Product Code : 3D-Cu-CU-PO1
Spherical copper powder is an ultrafine metal powder with high dispersibility, high filling property and uniform particle size. Due to its excellent dispersibility and good adhesion with resins and solvents, this product can shorten the necessary mixing time and achieve a high degree of product uniformity.
We provide spherical copper powder with high purity hypoxia, high sphericity, smooth surface, no satellite, uniform particle size distribution, excellent flow performance, and high loose density and vibrational density. Copper has the advantages of low resistivity, low electromigration speed, and high price. It is one of the ideal substitutes for silver-palladium internal electrodes.
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| Product | Product Code | Purity | Size | Contact Us |
Copper Powder Synonyms
Ultrafine copper powder type PMU
Technical Specifications
| PRODUCT GROUP | CHEMICAL COMPOSITION % | APPARENT DENSITY g/cc | PARTICLE SIZE µm |
| Spherical Copper Powder | Cu>99.3 | 5.0 +/- 0.2 | <150 |
Spherical Copper (Cu) Powder Applicable Processes
High strength, high hardness, good high-temperature performance, excellent wear resistance, and corrosion resistance
Spherical Copper (Cu) Powder Particle Size
0-15μm, 5-25μm, 15-45μm, 15-53μm, 45-75μm, 45-105μm, 75-150μm. (Various granularities can be customized according to customer requirements)
Spherical Copper (Cu) Powder Particle Size Description
● 0-15μm (D10=3~5μm, D50=6~10μm, D90=12~14μm)
● 5-25μm (D10=5~10μm, D50=15~20μm, D90=20~25μm)
● 15-45μm (D10=15~20μm, D50=25~30μm, D90=35~40μm)
● 15-53μm (D10=15~20μm, D50=25~35μm, D90=45~50μm)
● 45-75μm (D10=45~55μm, D50=55~65μm, D90=70~75μm)
● 45-105μm (D10=50~60μm, D50=75~85μm, D90=95~105μm)
● 45-150μm (D10=55~70μm, D50=110~120μm, D90=140~150μm)
● 75-150μm (D10=80~90μm, D50=110~125μm, D90=135~150μm)
Spherical Copper Powder Application
The spherical copper powder can be used for 3D printing (SLM), metal injection molding (MIM), electronic slurry, various spraying, metal additives, powder metallurgy, powder brazing, diamond tools, electrical alloys, modified plastics, thermally conductive materials, and electrical conductivity glue.
Packing of Spherical Copper (Cu) Powder
Standard Packing:
Typical bulk packaging includes palletized plastic 5 gallon/25 kg. pails, fiber and steel drums to 1 ton super sacks in full container (FCL) or truck load (T/L) quantities. Research and sample quantities and hygroscopic, oxidizing or other air sensitive materials may be packaged under argon or vacuum. Solutions are packaged in polypropylene, plastic or glass jars up to palletized 440 gallon liquid totes Special package is available on request.
ATTs’Spherical Copper (Cu) Powder is carefully handled to minimize damage during storage and transportation and to preserve the quality of our products in their original condition.
Chemical Identifiers
| Linear Formula | Cu |
| CAS | 7440-50-8 |
| MDL Number | MFCD00010965 |
| EC No. | 231-159-6 |
| Beilstein/Reaxys No. | N/A |
| Pubchem CID | 23978 |
| SMILES | [Cu] |
| InchI Identifier | InChI=1S/Cu |
| InchI Key | RYGMFSIKBFXOCR-UHFFFAOYSA-N |
