Product Code : 3D-WCu-CU-PO1
Spherical copper-coated tungsten powder is often used in 3D printing. Tungsten-copper alloy has the characteristics of high strength, high hardness, low expansion coefficient, and so on. W-Cu composite materials can be used as electronic packaging materials and heat sink materials.
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| Product | Product Code | Purity | Size | Contact Us |
Spherical Copper-coated Tungsten (W-Cu) Powder Particle Size
0-15μm, 5-25μm, 15-45μm, 15-53μm, 45-75μm, 45-105μm, 75-150μm. (Various granularities can be customized according to customer requirements)
Spherical Copper-coated Tungsten (W-Cu) Powder Particle Size Description
● 0-15μm (D10=3~5μm, D50=6~10μm, D90=12~14μm)
● 5-25μm (D10=5~10μm, D50=15~20μm, D90=20~25μm)
● 15-45μm (D10=15~20μm, D50=25~30μm, D90=35~40μm)
● 15-53μm (D10=15~20μm, D50=25~35μm, D90=45~50μm)
● 45-75μm (D10=45~55μm, D50=55~65μm, D90=70~75μm)
● 45-105μm (D10=50~60μm, D50=75~85μm, D90=95~105μm)
● 45-150μm (D10=55~70μm, D50=110~120μm, D90=140~150μm)
● 75-150μm (D10=80~90μm, D50=110~125μm, D90=135~150μm)
Spherical Copper-coated Tungsten (W-Cu) Powder Chemical Composition
| Chemical Composition | |||||
| Element | Value(%) | Test Method | Element | Value(%) | Test Method |
| W | Bal | ICP-AES | Sn | <0.001 | ICP-AES |
| Cu | 2~20 | ICP-AES | Sb | <0.001 | ICP-AES |
| Si | <0.005 | ICP-AES | Ni | <0.005 | ICP-AES |
| Mg | <0.005 | ICP-AES | Ca | <0.001 | ICP-AES |
| Mn | <0.004 | ICP-AES | Pt | <0.001 | ICP-AES |
| Gas Impurities | |||
| Element | Value(%) | Element | Value(%) |
| C | ≤0.005 | O | ≤0.10 |
| N | ≤0.003 | P | ≤0.005 |
Spherical Copper-coated Tungsten (W-Cu) Powder Property
| Density(g/cm³) | Hall Flow Rate(s/50g) | |
| Apparent Density | Tap Density | Value |
| ≥6.0 | ≥7.5 | ≤10.0 |
Spherical Copper-coated Tungsten (W-Cu) Powder Characteristics
high purity (≥ 99.9%), low oxygen (≤ 1000ppm), high sphericity (≥ 98%), uniform grain distribution, excellent mobility energy (≤10.0s/50g), high loose loading density (≥ 6.0g/cm3)
Spherical Copper-coated Tungsten (W-Cu) Powder Applicable Processes
Laser/electron beam additive manufacturing (SLM/EBM), laser direct deposition (DLD), powder thermal and other static pressure forming (HIP), metal injection forming (MIM), powder metallurgy (PM), laser melting application (LC), etc.
Spherical Copper-coated Tungsten (W-Cu) Powder Application
Spherical Copper-coated Tungsten Powder using tungsten carbide powder as raw material, prepared through the chemical packaging process, with high spherical, good mobility, high purity, loose loading density, metal copper content, coating thickness controllable characteristics, widely used in national defense, petrochemical, mechanical equipment, medical equipment, and other fields.
Packing of Spherical Copper-coated Tungsten (W-Cu) Powder
Standard Packing:
Typical bulk packaging includes palletized plastic 5 gallon/25 kg. pails, fiber and steel drums to 1 ton super sacks in full container (FCL) or truck load (T/L) quantities. Research and sample quantities and hygroscopic, oxidizing or other air sensitive materials may be packaged under argon or vacuum. Solutions are packaged in polypropylene, plastic or glass jars up to palletized 440 gallon liquid totes Special package is available on request.
ATTs’Spherical Copper-coated Tungsten (W-Cu) Powder is carefully handled to minimize damage during storage and transportation and to preserve the quality of our products in their original condition.
