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Spherical Tungsten Copper Alloy Powder

Product Code : RE-WCu-CU-PO1

Spherical Copper-coated Tungsten (W-Cu) Powder is produced by spheroidized tungsten powder as raw material and is prepared by a chemical coating process. It has the characteristics of high sphericity, good fluidity, high purity, high bulk density, controllable metal copper content, and coating thickness. It is widely used in the national defense and military industry, the petrochemical industry, mechanical equipment, medical equipment, and other fields.

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Product Product Code Purity Size Contact Us
Spherical Tungsten Copper Alloy PowderRE-WCu-CU-PO1Customize0-15μm
Spherical Tungsten Copper Alloy PowderRE-WCu-CU-PO2Customize15-53μm
Spherical Tungsten Copper Alloy PowderRE-WCu-CU-PO3Customize45-105μm
Spherical Tungsten Copper Alloy PowderRE-WCu-CU-PO4Customize75-150μm
Spherical Tungsten Copper Alloy PowderRE-WCu-CU-PO5CustomizeCustomize

Tungsten Copper Alloy Synonyms

Copper–tungsten, WCu, CuW, Copper - Tungsten Alloy, ASTM B702 (Class D) Rev. 93 (R10)


Spherical Tungsten Copper Alloy Powder Particle Size

0-15μm, 5-25μm, 15-45μm, 15-53μm, 45-75μm, 45-105μm, 75-150μm. (Various granularities can be customized according to customer requirements)


Spherical Tungsten Copper Alloy Powder Particle Size Description

● 0-15μm (D10=3~5μm, D50=6~10μm, D90=12~14μm)

● 5-25μm (D10=5~10μm, D50=15~20μm, D90=20~25μm)

● 15-45μm (D10=15~20μm, D50=25~30μm, D90=35~40μm)

● 15-53μm (D10=15~20μm, D50=25~35μm, D90=45~50μm)

● 45-75μm (D10=45~55μm, D50=55~65μm, D90=70~75μm)

● 45-105μm (D10=50~60μm, D50=75~85μm, D90=95~105μm)

● 45-150μm (D10=55~70μm, D50=110~120μm, D90=140~150μm)

● 75-150μm (D10=80~90μm, D50=110~125μm, D90=135~150μm)

Spherical Tungsten Copper Alloy Powder

Spherical Tungsten Copper Alloy Powder


Spherical Copper-coated Tungsten (W-Cu) Powder Chemical Composition

Chemical    Composition
ElementValue(%)Test MethodElementValue(%)Test Method
WBalICP-AESSn<0.001ICP-AES
Cu2~20ICP-AESSb<0.001ICP-AES
Si<0.005ICP-AESNi<0.005ICP-AES
Mg<0.005ICP-AESCa<0.001ICP-AES
Mn<0.004ICP-AESPt<0.001ICP-AES


Gas   Impurities
ElementValue(%)ElementValue(%)
C≤0.005O≤0.10
N≤0.003P≤0.005


Spherical Copper-coated Tungsten (W-Cu) Powder Property

Density(g/cm³)Hall Flow   Rate(s/50g)
Apparent   DensityTap DensityValue
≥6.0≥7.5≤10.0


Spherical Copper-coated Tungsten (W-Cu) Powder Characteristics

high purity (≥ 99.9%), low oxygen (≤ 1000ppm), high sphericity (≥ 98%), uniform grain distribution, excellent mobility energy (≤10.0s/50g), high loose loading density (≥ 6.0g/cm3)


Spherical Copper-coated Tungsten (W-Cu) Powder Applicable Processes

Laser/electron beam additive manufacturing (SLM/EBM), laser direct deposition (DLD), powder thermal and other static pressure forming (HIP), metal injection forming (MIM), powder metallurgy (PM), laser melting application (LC), etc.


Spherical Copper-coated Tungsten (W-Cu) Powder Application

Spherical Copper-coated Tungsten Powder using tungsten carbide powder as raw material, prepared through the chemical packaging process, with high spherical, good mobility, high purity, loose loading density, metal copper content, coating thickness controllable characteristics, widely used in national defense, petrochemical, mechanical equipment, medical equipment, and other fields.


Packing of Spherical Tungsten Copper Alloy Powder

Standard Packing:

Typical bulk packaging includes palletized plastic 5 gallon/25 kg. pails, fiber and steel drums to 1 ton super sacks in full container (FCL) or truck load (T/L) quantities. Research and sample quantities and hygroscopic, oxidizing or other air sensitive materials may be packaged under argon or vacuum. Solutions are packaged in polypropylene, plastic or glass jars up to palletized 440 gallon liquid totes Special package is available on request.

ATTs’Spherical Tungsten Copper Alloy Powder is carefully handled to minimize damage during storage and transportation and to preserve the quality of our products in their original condition.

Chemical Identifiers

Linear FormulaWCu
MDL NumberN/A
CAS #64554-83-2
EC No.N/A
Beilstein/Reaxys No.N/A
Pubchem CID57449491
IUPAC Namecopper; tungsten
SMILES[Cu].[W
InchI IdentifierInChI=1S/Cu.W
InchI KeySBYXRAKIOMOBFF-UHFFFAOYSA-N


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