Product Code : RE-WCu-CU-PO1
Spherical Copper-coated Tungsten (W-Cu) Powder is produced by spheroidized tungsten powder as raw material and is prepared by a chemical coating process. It has the characteristics of high sphericity, good fluidity, high purity, high bulk density, controllable metal copper content, and coating thickness. It is widely used in the national defense and military industry, the petrochemical industry, mechanical equipment, medical equipment, and other fields.
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Product | Product Code | Purity | Size | Contact Us |
Tungsten Copper Alloy Synonyms
Copper–tungsten, WCu, CuW, Copper - Tungsten Alloy, ASTM B702 (Class D) Rev. 93 (R10)
Spherical Tungsten Copper Alloy Powder Particle Size
0-15μm, 5-25μm, 15-45μm, 15-53μm, 45-75μm, 45-105μm, 75-150μm. (Various granularities can be customized according to customer requirements)
Spherical Tungsten Copper Alloy Powder Particle Size Description
● 0-15μm (D10=3~5μm, D50=6~10μm, D90=12~14μm)
● 5-25μm (D10=5~10μm, D50=15~20μm, D90=20~25μm)
● 15-45μm (D10=15~20μm, D50=25~30μm, D90=35~40μm)
● 15-53μm (D10=15~20μm, D50=25~35μm, D90=45~50μm)
● 45-75μm (D10=45~55μm, D50=55~65μm, D90=70~75μm)
● 45-105μm (D10=50~60μm, D50=75~85μm, D90=95~105μm)
● 45-150μm (D10=55~70μm, D50=110~120μm, D90=140~150μm)
● 75-150μm (D10=80~90μm, D50=110~125μm, D90=135~150μm)
Spherical Copper-coated Tungsten (W-Cu) Powder Chemical Composition
Chemical Composition | |||||
Element | Value(%) | Test Method | Element | Value(%) | Test Method |
W | Bal | ICP-AES | Sn | <0.001 | ICP-AES |
Cu | 2~20 | ICP-AES | Sb | <0.001 | ICP-AES |
Si | <0.005 | ICP-AES | Ni | <0.005 | ICP-AES |
Mg | <0.005 | ICP-AES | Ca | <0.001 | ICP-AES |
Mn | <0.004 | ICP-AES | Pt | <0.001 | ICP-AES |
Gas Impurities | |||
Element | Value(%) | Element | Value(%) |
C | ≤0.005 | O | ≤0.10 |
N | ≤0.003 | P | ≤0.005 |
Spherical Copper-coated Tungsten (W-Cu) Powder Property
Density(g/cm³) | Hall Flow Rate(s/50g) | |
Apparent Density | Tap Density | Value |
≥6.0 | ≥7.5 | ≤10.0 |
Spherical Copper-coated Tungsten (W-Cu) Powder Characteristics
high purity (≥ 99.9%), low oxygen (≤ 1000ppm), high sphericity (≥ 98%), uniform grain distribution, excellent mobility energy (≤10.0s/50g), high loose loading density (≥ 6.0g/cm3)
Spherical Copper-coated Tungsten (W-Cu) Powder Applicable Processes
Laser/electron beam additive manufacturing (SLM/EBM), laser direct deposition (DLD), powder thermal and other static pressure forming (HIP), metal injection forming (MIM), powder metallurgy (PM), laser melting application (LC), etc.
Spherical Copper-coated Tungsten (W-Cu) Powder Application
Spherical Copper-coated Tungsten Powder using tungsten carbide powder as raw material, prepared through the chemical packaging process, with high spherical, good mobility, high purity, loose loading density, metal copper content, coating thickness controllable characteristics, widely used in national defense, petrochemical, mechanical equipment, medical equipment, and other fields.
Packing of Spherical Tungsten Copper Alloy Powder
Standard Packing:
Typical bulk packaging includes palletized plastic 5 gallon/25 kg. pails, fiber and steel drums to 1 ton super sacks in full container (FCL) or truck load (T/L) quantities. Research and sample quantities and hygroscopic, oxidizing or other air sensitive materials may be packaged under argon or vacuum. Solutions are packaged in polypropylene, plastic or glass jars up to palletized 440 gallon liquid totes Special package is available on request.
ATTs’Spherical Tungsten Copper Alloy Powder is carefully handled to minimize damage during storage and transportation and to preserve the quality of our products in their original condition.
Chemical Identifiers
Linear Formula | WCu |
MDL Number | N/A |
CAS # | 64554-83-2 |
EC No. | N/A |
Beilstein/Reaxys No. | N/A |
Pubchem CID | 57449491 |
IUPAC Name | copper; tungsten |
SMILES | [Cu].[W |
InchI Identifier | InChI=1S/Cu.W |
InchI Key | SBYXRAKIOMOBFF-UHFFFAOYSA-N |