Product Code : ME-Bi-5N-WF
ATT produces Bismuth Wafers with the highest possible density. Our standard wafer size is nominally 25.4 mm (1 inch) to 300 mm (11.8 inches). Materials are produced using crystallization, solid state and other ultra high purification processes such as sublimation. This process forms a cylindrical ingot which is then sliced and polished to form wafers. ATT specializes in producing custom compositions for commercial and research applications and for new proprietary technologies. ATT also casts any of the rare earth metals and most other advanced materials into rod, bar or plate form, as well as other machined shapes and through other processes such as nanoparticles and in the form of solutions and organometallics.
ATT is a professional supplier of Bismuth Wafer, and we also produce discs, pellets, ingots, pellets, sheets, powders, rods, wires, sputtering targets, and many other forms and custom shapes. Other shapes are available upon request.
Please contact us if you need customized services. We will contact you with the price and availability in 24 hours.
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Product Information
ATT produces Bismuth Wafers with the highest possible density. Our standard wafer size is nominally 25.4 mm (1 inch) to 300 mm (11.8 inches). Materials are produced using crystallization, solid state and other ultra high purification processes such as sublimation. This process forms a cylindrical ingot which is then sliced and polished to form wafers. ATT specializes in producing custom compositions for commercial and research applications and for new proprietary technologies. ATT also casts any of the rare earth metals and most other advanced materials into rod, bar or plate form, as well as other machined shapes and through other processes such as nanoparticles and in the form of solutions and organometallics.
ATT is a professional supplier of Bismuth Wafer, and we also produce discs, pellets, ingots, pellets, sheets, powders, rods, wires, sputtering targets, and many other forms and custom shapes. Other shapes are available upon request.
Synonyms
Bismuth Wafer Properties (Theoretical)
Molecular Weight | 208.98 |
Appearance | solid |
Melting Point | 271.3 °C |
Boiling Point | 1560 °C |
Density | 9.747 g/cm3 |
Solubility in H2O | N/A |
Electrical Resistivity | 106.8 microhm-cm @ 0 °C |
Electronegativity | 1.9 Paulings |
Heat of Fusion | 2.505 Cal/gm mole |
Heat of Vaporization | 42.7 K-Cal/gm atom at 1560 °C |
Poisson's Ratio | 0.33 |
Specific Heat | 0.0296 Cal/g/K @ 25 °C |
Tensile Strength | N/A |
Thermal Conductivity | 0.0792 W/cm/ K @ 298.2 K |
Thermal Expansion | (25 °C) 13.4 µm·m-1·K-1 |
Vickers Hardness | N/A |
Young's Modulus | 32 GPa |
Applications of Bismuth Wafer
Bismuth has also been used in cosmetics and pharmaceuticals in disinfectants, bacteriostatic agents and astringents as well as in the nuclear industry where it is used as a refrigerant.
Packing of Bismuth Wafer
Standard Packing:
Typical bulk packaging includes palletized plastic 5 gallon/25 kg. pails, fiber and steel drums to 1 ton super sacks in full container (FCL) or truck load (T/L) quantities. Research and sample quantities and hygroscopic, oxidizing or other air sensitive materials may be packaged under argon or vacuum. Solutions are packaged in polypropylene, plastic or glass jars up to palletized 440 gallon liquid totes Special package is available on request.
ATTs’Bismuth Wafer is carefully handled to minimize damage during storage and transportation and to preserve the quality of our products in their original condition.
Chemical Identifiers
Linear Formula | Bi |
MDL Number | MFCD00134033 |
EC No. | 231-177-4 |
Beilstein/Reaxys No. | N/A |
Pubchem CID | 5359367 |
SMILES | [Bi] |
InchI Identifier | InChI=1S/Bi |
InchI Key | JCXGWMGPZLAOME-UHFFFAOYSA-N |