Copper Bismuth Alloy Sputtering Target

Product Information

ATT specializes in producing high-purity copper-bismuth alloy sputtering targets with the highest density, high purity (99.99%) copper-bismuth alloy sputtering targets and the smallest average grain size for semiconductor, chemical vapor deposition (CVD) and physical vapor deposition (PVD) displays and optical applications. Our standard sputtering targets for thin film deposition are available in single or combined flat target sizes and configurations up to 820 mm, with borehole positions and threads, bevels, grooves and backings, designed for use with older sputtering equipment as well as the latest process equipment, such as large area coatings for solar or fuel cell and flip-chip applications. Rotary (cylindrical), round, rectangular, square, ring, circular, oval, "dog bone" and other shaped targets are available in standard, custom and research sizes. All targets were analyzed using best-in-class demonstration techniques, including X-ray fluorescence (XRF), glow discharge mass spectrometry (GDMS), and inductively coupled plasma (ICP). Materials are produced by ultra-high purification processes such as crystallization, solid state and sublimation. ATT specializes in the production of custom compositions for commercial and research applications as well as new proprietary technologies. Please request a quote above for delivery time and more information on pricing.

ATT is a professional supplier of Copper Bismuth Alloy Sputtering Target, and we also manufacture plates, balls, ingots, balls, flakes, powders, rods, wires, sputtering targets, and many other forms and custom shapes. Other shapes are available upon request.

Synonyms

CuBi master alloy, Cu:Bi 90:10

Copper Bismuth Alloy Sputtering Target Properties (Theoretical)

Applications of Copper Bismuth Alloy Sputtering Target

• Pharmaceuticals.

• Cosmetics and pigments.

• Replacement of lead.

• Low melting solders.

• Fusible alloys.

• Synthetic fibres.

• Shots and shotguns

Packing of Copper Bismuth Alloy Sputtering Target

Standard Packing:

Typical bulk packaging includes palletized plastic 5 gallon/25 kg. pails, fiber and steel drums to 1 ton super sacks in full container (FCL) or truck load (T/L) quantities. Research and sample quantities and hygroscopic, oxidizing or other air sensitive materials may be packaged under argon or vacuum. Solutions are packaged in polypropylene, plastic or glass jars up to palletized 440 gallon liquid totes Special package is available on request.

ATTs’Copper Bismuth Alloy Sputtering Target is carefully handled to minimize damage during storage and transportation and to preserve the quality of our products in their original condition.

Chemical Identifiers