Product Code : ME-B-5N-SF
ATT specializes in producing high-purity boron sputtering targets with the highest density and smallest average grain size for semiconductor, chemical Vapor deposition (CVD) and physical Vapor deposition (PVD) displays and optical applications. Our standard sputtering targets for thin films are available in single or combined flat target sizes and configurations up to 820 mm, with drill positions and threads, bevels, grooves and backings, designed for use with older sputtering equipment as well as the latest process equipment, such as large area coatings for solar or fuel cell and flip-chip applications. We offer targets compatible with all standard guns in all shapes and configurations, including round, rectangular, ring, oval, "dog bone", rotable (swivel), multi-tile and other standard, custom and research size sizes. All targets were analyzed using best-in-class demonstration techniques, including X-ray fluorescence (XRF), glow discharge mass spectrometry (GDMS), and inductively coupled plasma (ICP). "Sputtering" allows deposition of an ultra-high purity thin film of sputtered metal or oxide material onto another solid substrate, controlled removal of the target material by ion bombardment and conversion into a directed gas/plasma phase. Materials are produced by ultra-high purification processes such as crystallization, solid state and sublimation. ATT specializes in the production of custom compositions for commercial and research applications as well as new proprietary technologies. ATT also casts any rare earth metal and most other advanced materials into bars, rods or plates, and other mechanical shapes, and in solution and organometrics through other processes such as nanoparticles.
ATT is a professional supplier of boron sputtering targets, and we also manufacture plates, balls, ingots, balls, flakes, powders, rods, wires, sputtering targets, and many other forms and custom shapes. Other shapes are available upon request.
Please contact us if you need customized services. We will contact you with the price and availability in 24 hours.
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Product Information
ATT specializes in producing high-purity boron sputtering targets with the highest density and smallest average grain size for semiconductor, chemical Vapor deposition (CVD) and physical Vapor deposition (PVD) displays and optical applications. Our standard sputtering targets for thin films are available in single or combined flat target sizes and configurations up to 820 mm, with drill positions and threads, bevels, grooves and backings, designed for use with older sputtering equipment as well as the latest process equipment, such as large area coatings for solar or fuel cell and flip-chip applications. We offer targets compatible with all standard guns in all shapes and configurations, including round, rectangular, ring, oval, "dog bone", rotable (swivel), multi-tile and other standard, custom and research size sizes. All targets were analyzed using best-in-class demonstration techniques, including X-ray fluorescence (XRF), glow discharge mass spectrometry (GDMS), and inductively coupled plasma (ICP). "Sputtering" allows deposition of an ultra-high purity thin film of sputtered metal or oxide material onto another solid substrate, controlled removal of the target material by ion bombardment and conversion into a directed gas/plasma phase. Materials are produced by ultra-high purification processes such as crystallization, solid state and sublimation. ATT specializes in the production of custom compositions for commercial and research applications as well as new proprietary technologies. ATT also casts any rare earth metal and most other advanced materials into bars, rods or plates, and other mechanical shapes, and in solution and organometrics through other processes such as nanoparticles.
ATT is a professional supplier of boron sputtering targets, and we also manufacture plates, balls, ingots, balls, flakes, powders, rods, wires, sputtering targets, and many other forms and custom shapes. Other shapes are available upon request.
Synonyms
Boron Sputtering Target Properties (Theoretical)
| Molecular Weight | 10.811 |
| Appearance | Black/Brown |
| Melting Point | 2079 °C |
| Boiling Point | 2550 °C |
| Density | 2.34 cryst. g/cm3 |
| Solubility in H2O | N/A |
| Electrical Resistivity | 1.8 x 1012 microhm-cm @ 0 °C |
| Electronegativity | 2.0 Paulings |
| Heat of Vaporization | 128 K-Cal/gm atom at 2550 °C |
| Poisson's Ratio | N/A |
| Specific Heat | 0.245 Cal/g/K @ 25 °C |
| Tensile Strength | N/A |
| Thermal Conductivity | 0.274 W/cm/K @ 298.2 K |
| Thermal Expansion | 5–7 µm·m-1·K-1 @ 25 °C |
| Vickers Hardness | N/A |
| Young's Modulus | N/A |
Applications of Boron Sputtering Target
Amorphous boron is used as a rocket fuel igniter and in pyrotechnic flares. It gives the flares a distinctive green colour. The most important compounds of boron are boric (or boracic) acid, borax (sodium borate) and boric oxide. These can be found in eye drops, mild antiseptics, washing powders and tile glazes.
Packing of Boron Sputtering Target
Standard Packing:
Typical bulk packaging includes palletized plastic 5 gallon/25 kg. pails, fiber and steel drums to 1 ton super sacks in full container (FCL) or truck load (T/L)s quantities. Research and sample quantities and hygroscopic, oxidizing or other air sensitive materials may be packaged under argon or vacuum. Solutions are packaged in polypropylene, plastic or glass jars up to palletized 440 gallon liquid totes Special package is available on request.
ATTs’Boron Sputtering Target is carefully handled to minimize damage during storage and transportation and to preserve the quality of our products in their original condition.
Chemical Identifiers
| Linear Formula | B |
| MDL Number | MFCD00134034 |
| EC No. | 231-151-2 |
| Beilstein/Reaxys No. | N/A |
| Pubchem CID | 5462311 |
| SMILES | [B] |
| InchI Identifier | InChI=1S/B |
| InchI Key | ZOXJGFHDIHLPTG-UHFFFAOYSA-N |
