Boron Wafer

Product Information

ATT produces boron wafers at the highest possible density. Our standard wafer sizes are nominally 25.4 mm (1 inch) to 300 mm (11.8 inch). Materials are produced by ultra-high purification processes such as crystallization, solid state and sublimation. This process forms a cylindrical ingot, which is then sliced and polished to form a wafer. ATT specializes in the production of custom compositions for commercial and research applications as well as new proprietary technologies. ATT also casts any rare earth metal and most other advanced materials into bars, rods or plates, and other mechanical shapes, and in solution and organometrics through other processes such as nanoparticles.

ATT is a professional supplier of boron wafers, and we also produce plates, balls, ingots, balls, flakes, powders, rods, wires, sputtering targets, and many other forms and custom shapes. Other shapes are available upon request.

Synonyms

Boron Wafer Properties (Theoretical)

Applications of Boron Wafer

Amorphous boron is used as a rocket fuel igniter and in pyrotechnic flares. It gives the flares a distinctive green colour. The most important compounds of boron are boric (or boracic) acid, borax (sodium borate) and boric oxide. These can be found in eye drops, mild antiseptics, washing powders and tile glazes.

Packing of Boron Wafer

Standard Packing:

Typical bulk packaging includes palletized plastic 5 gallon/25 kg. pails, fiber and steel drums to 1 ton super sacks in full container (FCL) or truck load (T/L)s quantities. Research and sample quantities and hygroscopic, oxidizing or other air sensitive materials may be packaged under argon or vacuum. Solutions are packaged in polypropylene, plastic or glass jars up to palletized 440 gallon liquid totes Special package is available on request.

ATTs’Boron Wafer is carefully handled to minimize damage during storage and transportation and to preserve the quality of our products in their original condition.

Chemical Identifiers