Product Code : ME-Cu-5N-SF
Copper is a ductile metal with very high thermal and electrical conductivity. Pure copper is rather soft and malleable and a freshly exposed surface has a pinkish or peach color. It is often used as a thermal conductor, and electrical conductor, building material, and composition of various alloys. The copper foil itself has a very flat shape and can be perfectly molded to other materials. The copper foil is also resistant to high-temperature oxidation and corrosion, making it suitable for use in harsh environments or for products with strict material life requirements. Our copper coil rolls are ideal for electrical conductivity uses. other alloys available upon request. Tempers are available in annealed, full hard, and as rolled. The copper foil rolls we offer are ideal for use in the following applications: cable wrap, batteries, solar/alternative energy, circuit boards, and transformers.
Please contact us if you need customized services. We will contact you with the price and availability in 24 hours.
| Product | Product Code | Purity | Size | Contact Us |
Product Information
Copper is a ductile metal with very high thermal and electrical conductivity. Pure copper is rather soft and malleable and a freshly exposed surface has a pinkish or peach color. It is often used as a thermal conductor, and electrical conductor, building material, and composition of various alloys. The copper foil itself has a very flat shape and can be perfectly molded to other materials. The copper foil is also resistant to high-temperature oxidation and corrosion, making it suitable for use in harsh environments or for products with strict material life requirements. Our copper coil rolls are ideal for electrical conductivity uses. other alloys available upon request. Tempers are available in annealed, full hard, and as rolled. The copper foil rolls we offer are ideal for use in the following applications: cable wrap, batteries, solar/alternative energy, circuit boards, and transformers.
Synonyms
Copper OFC, Oxygen-free Copper, Copper OFHC, Oxygen-free high thermal conductivity copper, Copper OFE, Oxygen free electrolytic copper, Oxygen Free Electronic Copper, ASTM F68, Copper Alloy 101, C101, C102, C10100, C10200 Copper O, High-conductivity copper, C-110, C11000, C110 Electrolytic Tough Pitch (ETP) copper, Cu-ETP, C122, C-122, C145, C-145, C147, C-147, O60 (soft / annealed) temper, H00 (cold rolled), H01 (cold rolled, high yield), H02 (half hard) temper, H03 (three quarter hard) temper, H04 (full hard) temper
Copper Foil / Strip Specification
Dimensions
Size: Thickness: 6um to 400um,Width: ≤1300mm, customized.
Purity: >=99.0%, 99.5%, 99.9%, 99.99%, 99.995%，99.999%
Per your request or drawing
We can customized as required
Copper Products
| Materials | Ni |
| Plate | √ |
| Sheet | √ |
| Strip | √ |
| Rod | √ |
| Sputtering Target | √ |
| Tube | √ |
| Wire | √ |
Other: Spherical Copper Powder, Copper crucibles, Copper nuts, Copper bolts, Copper heating elements, and Copper shielding screens.
Properties（Theoretical）
| Molecular Weight | 63.55 |
| Appearance | solid |
| Melting Point | 1083.4 °C |
| Boiling Point | 2567 °C |
| Density | 8.96 g/cm3 |
| Electrical Resistivity | 1.678 microhm-cm @ 20 °C |
| Electronegativity | 1.9 Paulings |
| Heat of Fusion | 3.11 Cal/gm mole |
| Heat of Vaporization | 72.8 K-cal/gm atom at 2567 °C |
| Poisson's Ratio | 0.34 |
| Specific Heat | 0.092 Cal/g/K @ 25 °C |
| Thermal Conductivity | 4.01 W/cm/K @ 298.2 K |
| Thermal Expansion | (25 °C) 16.5 µm·m-1·K-1 |
| Vickers Hardness | 369 MPa |
| Young's Modulus | 110–128 GPa |
Applications of Copper Foil
Suitable for automotive, electric power, communications, military, aerospace and other high-power circuit board, high-frequency board manufacturing, and transformers, cables, cell phones, computers, medical, aerospace, military and other electronic products shielding.
Packing of Copper Foil
Standard Packing:
Sealed bags in carton boxes. Special package is available on request.
ATTs’ Copper Foil is carefully handled to minimize damage during storage and transportation and to preserve the quality of our products in their original condition.
Chemical Identifiers
| Linear Formula | Cu |
| MDL Number | MFCD00010965 |
| CAS | 7440-50-8 |
| EC No. | 231-159-6 |
| Beilstein/Reaxys No. | N/A |
| Pubchem CID | 23978 |
| SMILES | [Cu] |
| InchI Identifier | InChI=1S/Cu |
| InchI Key | RYGMFSIKBFXOCR-UHFFFAOYSA-N |
