Product Code : ME-Cu-6N-PL
Copper is a chemical element with the symbol Cu and atomic number 29. It is a soft, malleable, and ductile metal with very high thermal and electrical conductivity. A freshly exposed surface of pure copper has a pinkish-orange color. Copper is used as a conductor of heat and electricity, as a building material, and as a constituent of various metal alloys, such as sterling silver used in jewelry, cupronickel used to make marine hardware and coins, and constantan used in strain gauges and thermocouples for temperature measurement.
ATT specializes in producing high purity uniform shaped Copper Pellets with the highest possible density and smallest possible average grain sizes for use in semiconductor, Chemical Vapor Deposition (CVD) and Physical Vapor Deposition (PVD) processes including Thermal and Electron Beam (E-Beam) Evaporation, Low Temperature Organic Evaporation, Atomic Layer Deposition (ALD), Metallic-Organic and Chemical Vapor Deposition (MOCVD). Our standard Pellet sizes range from 1/8" x 1/8" to 1/4" x 1/4" and 3 mm diameter. We can also provide Pellets outside this range for ultra high purity thin film applications, such as fuel cells and solar energy layers. Materials are produced using crystallization, solid state and other ultra high purification processes such as sublimation.
Please contact us if you need customized services. We will contact you with the price and availability in 24 hours.
| Product | Product Code | Purity | Size | Contact Us |
Product Information
Copper is a chemical element with the symbol Cu and atomic number 29. It is a soft, malleable, and ductile metal with very high thermal and electrical conductivity. A freshly exposed surface of pure copper has a pinkish-orange color. Copper is used as a conductor of heat and electricity, as a building material, and as a constituent of various metal alloys, such as sterling silver used in jewelry, cupronickel used to make marine hardware and coins, and constantan used in strain gauges and thermocouples for temperature measurement.
ATT specializes in producing high purity uniform shaped Copper Pellets with the highest possible density and smallest possible average grain sizes for use in semiconductor, Chemical Vapor Deposition (CVD) and Physical Vapor Deposition (PVD) processes including Thermal and Electron Beam (E-Beam) Evaporation, Low Temperature Organic Evaporation, Atomic Layer Deposition (ALD), Metallic-Organic and Chemical Vapor Deposition (MOCVD). Our standard Pellet sizes range from 1/8" x 1/8" to 1/4" x 1/4" and 3 mm diameter. We can also provide Pellets outside this range for ultra high purity thin film applications, such as fuel cells and solar energy layers. Materials are produced using crystallization, solid state and other ultra high purification processes such as sublimation.
Synonyms
Copper OFC, Oxygen-free Copper, Copper OFHC, Oxygen-free high thermal conductivity copper, Copper OFE, Oxygen free electrolytic copper, Oxygen Free Electronic Copper, ASTM F68, Copper Alloy 101, C101, C102, C10100, C10200 Copper O, High-conductivity copper, C-110, C11000, C110 Electrolytic Tough Pitch (ETP) copper, Cu-ETP, C122, C-122, C145, C-145, C147, C-147, O60 (soft / annealed) temper, H00 (cold rolled), H01 (cold rolled, high yield), H02 (half hard) temper, H03 (three quarter hard) temper, H04 (full hard) temper
Copper Pellets Specification
Dimensions
Size: Our standard Pellet sizes range from 1/8" x 1/8" to 1/4" x 1/4" and 3 mm diameter.
Per your request or drawing
We can customized as required
Copper Products
| Materials | Ni |
| Plate | √ |
| Sheet | √ |
| Strip | √ |
| Rod | √ |
| Sputtering Target | √ |
| Tube | √ |
Other: Spherical Copper Powder, Copper crucibles, Copper nuts, Copper bolts, Copper heating elements, and Copper shielding screens.
Properties（Theoretical）
| Molecular Weight | 63.55 |
| Appearance | Reddish Metal |
| Melting Point | 1085 °C |
| Boiling Point | 2562 °C |
| Density | 8.96 g/cm3 |
| Solubility in H2O | N/A |
| Electrical Resistivity | 1.673 μΩ-cm @ 20 °C |
| Electronegativity | 1.90 Paulings |
| Heat of Fusion | 13.26 kJ ·mol-1 |
| Heat of Vaporization | 300.4 kJ ·mol-1 |
| Poisson's Ratio | 0.34 |
| Specific Heat | 0.39 kJ/kg K |
| Thermal Conductivity | 401 W ·m-1 ·K-1 |
| Thermal Expansion | (25 °C) 16.5 µm·m-1·K-1 |
| Vickers Hardness | 369 MPa |
| Young's Modulus | 110–128 GPa |
| Temperature coefficient ( K⁻¹ ) | 0.00430 @0-100°C |
| Thermal emf against Pt (cold 0C - hot 100C) ( mV ) | 0.76 |
Chemical composition
Purity：6N（99.9999%）
| Element | Value |
| Pb | <50 PPM |
| O | 400 PPM |
| Bi | <10 PPM |
| Ag | 500 PPM |
We can customized as required
Applications of Copper Pellets
Aerospace.
Automotive.
Chemical.
Cosmetics.
Defense / Military.
Energy Storage & Batteries.
Lighting (OLED)
Manufacturing.
Packing of Copper Pellets
Standard Packing:
Typical bulk packaging includes palletized plastic 5 gallon/25 kg. pails, fiber and steel drums to 1 ton super sacks in full container (FCL) or truck load (T/L) quantities. Research and sample quantities and hygroscopic, oxidizing or other air sensitive materials may be packaged under argon or vacuum. Solutions are packaged in polypropylene, plastic or glass jars up to palletized 440 gallon liquid totes Special package is available on request.
ATTs’Copper Pellets is carefully handled to minimize damage during storage and transportation and to preserve the quality of our products in their original condition.
Chemical Identifiers
| Linear Formula | Cu |
| CAS | 7440-50-8 |
| MDL Number | MFCD00010965 |
| EC No. | 231-159-6 |
| Beilstein/Reaxys No. | N/A |
| Pubchem CID | 23978 |
| SMILES | [Cu] |
| InchI Identifier | InChI=1S/Cu |
| InchI Key | RYGMFSIKBFXOCR-UHFFFAOYSA-N |
