Product Code : ME-Cu-6N-SP
ATT specializes in producing Copper Plates in various thicknesses and sizes. Most plates are cast for use in coating and thin film Chemical Vapor Deposition (CVD) and Physical Vapor Deposition (PVD) processes including Thermal and Electron Beam (E-Beam) Evaporation, Low Temperature Organic Evaporation, Atomic Layer Deposition (ALD), Organometallic and Chemical Vapor Deposition (MOCVD) for specific applications such as fuel cells and solar energy. Thicknesses start at 0.25" for all metals. Materials are produced using crystallization, solid state and other ultra high purification processes such as sublimation. ATT specializes in producing custom compositions for commercial and research applications and for new proprietary technologies. ATT also casts any of the rare earth metals and most other advanced materials into rod, bar, or plate form, as well as other machined shapes and through other processes such as nanoparticles and in the form of solutions and organometallics. We also produce copper as rods, powder and plates. Other shapes are available by request.
Please contact us if you need customized services. We will contact you with the price and availability in 24 hours.
Product | Product Code | Purity | Size | Contact Us |
Product Information
ATT specializes in producing Copper Plates in various thicknesses and sizes. Most plates are cast for use in coating and thin film Chemical Vapor Deposition (CVD) and Physical Vapor Deposition (PVD) processes including Thermal and Electron Beam (E-Beam) Evaporation, Low Temperature Organic Evaporation, Atomic Layer Deposition (ALD), Organometallic and Chemical Vapor Deposition (MOCVD) for specific applications such as fuel cells and solar energy. Thicknesses start at 0.25" for all metals. Materials are produced using crystallization, solid state and other ultra high purification processes such as sublimation. ATT specializes in producing custom compositions for commercial and research applications and for new proprietary technologies. ATT also casts any of the rare earth metals and most other advanced materials into rod, bar, or plate form, as well as other machined shapes and through other processes such as nanoparticles and in the form of solutions and organometallics. We also produce copper as rods, powder and plates. Other shapes are available by request.
Synonyms
Copper OFC, Oxygen-free Copper, Copper OFHC, Oxygen-free high thermal conductivity copper, Copper OFE, Oxygen free electrolytic copper, Oxygen Free Electronic Copper, ASTM F68, Copper Alloy 101, C101, C102, C10100, C10200 Copper O, High-conductivity copper, C-110, C11000, C110 Electrolytic Tough Pitch (ETP) copper, Cu-ETP, C122, C-122, C145, C-145, C147, C-147, O60 (soft / annealed) temper, H00 (cold rolled), H01 (cold rolled, high yield), H02 (half hard) temper, H03 (three quarter hard) temper, H04 (full hard) temper
Copper Plate Specification
Dimensions
Size: Thicknesses start at 0.25" for all metals.
Purity: >=99.0%, 99.5%, 99.9%, 99.99%, 99.995%,99.999%, 99.9999%。
Per your request or drawing
We can customized as required
Copper Products
Materials | Ni |
Plate | √ |
Sheet | √ |
Strip | √ |
Rod | √ |
Sputtering Target | √ |
Tube | √ |
Other: Spherical Copper Powder, Copper crucibles, Copper nuts, Copper bolts, Copper heating elements, and Copper shielding screens.
Properties(Theoretical)
Molecular Weight | 63.55 |
Appearance | Reddish Metal |
Melting Point | 1085 °C |
Boiling Point | 2562 °C |
Density | 8.96 g/cm3 |
Solubility in H2O | N/A |
Electrical Resistivity | 1.673 μΩ-cm @ 20 °C |
Electronegativity | 1.90 Paulings |
Heat of Fusion | 13.26 kJ ·mol-1 |
Heat of Vaporization | 300.4 kJ ·mol-1 |
Poisson's Ratio | 0.34 |
Specific Heat | 0.39 kJ/kg K |
Thermal Conductivity | 401 W ·m-1 ·K-1 |
Thermal Expansion | (25 °C) 16.5 µm·m-1·K-1 |
Vickers Hardness | 369 MPa |
Young's Modulus | 110–128 GPa |
Applications of Copper Plate
Because of its special metal characteristics, high conductivity and corrosion resistance, copper plate is widely used in conductive, thermal and corrosion resistant equipment. Such as wire, cable, conductive screw, blasting detonator, chemical evaporator, storage and various pipes.
Packing of Copper Plate
Standard Packing:
Typical bulk packaging includes palletized plastic 5 gallon/25 kg. pails, fiber and steel drums to 1 ton super sacks in full container (FCL) or truck load (T/L) quantities. Research and sample quantities and hygroscopic, oxidizing or other air sensitive materials may be packaged under argon or vacuum. Solutions are packaged in polypropylene, plastic or glass jars up to palletized 440 gallon liquid totes Special package is available on request.
ATTs’Copper Plate is carefully handled to minimize damage during storage and transportation and to preserve the quality of our products in their original condition.
Chemical Identifiers
Linear Formula | Cu |
CAS | 7440-50-8 |
MDL Number | MFCD00010965 |
EC No. | 231-159-6 |
Beilstein/Reaxys No. | N/A |
Pubchem CID | 23978 |
SMILES | [Cu] |
InchI Identifier | InChI=1S/Cu |
InchI Key | RYGMFSIKBFXOCR-UHFFFAOYSA-N |