Product Code : ME-Cu-6N-BR
Copper is a chemical element with the symbol Cu and atomic number 29. It is a soft, malleable, and ductile metal with very high thermal and electrical conductivity. A freshly exposed surface of pure copper has a pinkish-orange color. Copper is used as a conductor of heat and electricity, as a building material, and as a constituent of various metal alloys, such as sterling silver used in jewelry, cupronickel used to make marine hardware and coins, and constantan used in strain gauges and thermocouples for temperature measurement.
ATT specializes in producing high purity uniform shaped Copper Rod with the highest possible density and smallest possible average grain sizes for use in semiconductor, Chemical Vapor Deposition (CVD) and Physical Vapor Deposition (PVD) processes including Thermal and Electron Beam (E-Beam) Evaporation, Low Temperature Organic Evaporation, Atomic Layer Deposition (ALD), Metallic-Organic and Chemical Vapor Deposition (MOCVD). Our standard rod sizes range from 1/8" x 1/8" to 1/4" x 1/4" and 3 mm diameter. We can also provide rods outside this range and deposition materials for specific applications such as fuel cells and solar energy and for thin film deposition on glass or metal substrates. Materials are produced using crystallization, solid state and other ultra high purification processes such as sublimation.
Please contact us if you need customized services. We will contact you with the price and availability in 24 hours.
| Product | Product Code | Purity | Size | Contact Us |
Product Information
Copper is a chemical element with the symbol Cu and atomic number 29. It is a soft, malleable, and ductile metal with very high thermal and electrical conductivity. A freshly exposed surface of pure copper has a pinkish-orange color. Copper is used as a conductor of heat and electricity, as a building material, and as a constituent of various metal alloys, such as sterling silver used in jewelry, cupronickel used to make marine hardware and coins, and constantan used in strain gauges and thermocouples for temperature measurement.
ATT specializes in producing high purity uniform shaped Copper Rod with the highest possible density and smallest possible average grain sizes for use in semiconductor, Chemical Vapor Deposition (CVD) and Physical Vapor Deposition (PVD) processes including Thermal and Electron Beam (E-Beam) Evaporation, Low Temperature Organic Evaporation, Atomic Layer Deposition (ALD), Metallic-Organic and Chemical Vapor Deposition (MOCVD). Our standard rod sizes range from 1/8" x 1/8" to 1/4" x 1/4" and 3 mm diameter. We can also provide rods outside this range and deposition materials for specific applications such as fuel cells and solar energy and for thin film deposition on glass or metal substrates. Materials are produced using crystallization, solid state and other ultra high purification processes such as sublimation.
Synonyms
Copper OFC, Oxygen-free Copper, Copper OFHC, Oxygen-free high thermal conductivity copper, Copper OFE, Oxygen free electrolytic copper, Oxygen Free Electronic Copper, ASTM F68, Copper Alloy 101, C101, C102, C10100, C10200 Copper O, High-conductivity copper, C-110, C11000, C110 Electrolytic Tough Pitch (ETP) copper, Cu-ETP, C122, C-122, C145, C-145, C147, C-147, O60 (soft / annealed) temper, H00 (cold rolled), H01 (cold rolled, high yield), H02 (half hard) temper, H03 (three quarter hard) temper, H04 (full hard) temper
Copper Rod Specification
Dimensions
Size: Our standard rod sizes range from 1/8" x 1/8" to 1/4" x 1/4" and 3 mm diameter.
Per your request or drawing
We can customized as required
Copper Products
| Materials | Ni |
| Plate | √ |
| Sheet | √ |
| Strip | √ |
| Rod | √ |
| Sputtering Target | √ |
| Tube | √ |
Other: Spherical Copper Powder, Copper crucibles, Copper nuts, Copper bolts, Copper heating elements, and Copper shielding screens.
Properties（Theoretical）
| Molecular Weight | 63.55 |
| Appearance | Reddish Metal |
| Melting Point | 1083.4 °C |
| Boiling Point | 2567 °C |
| Density | 8.96 g/cm3 |
| Solubility in H2O | N/A |
| Electrical Resistivity | 1.678 microhm-cm @ 20 °C |
| Electronegativity | 1.9 Paulings |
| Heat of Fusion | 3.11 Cal/gm mole |
| Heat of Vaporization | 72.8 K-cal/gm atom at 2567 °C |
| Poisson's Ratio | 0.34 |
| Specific Heat | 0.092 Cal/g/K @ 25 °C |
| Tensile Strength | N/A |
| Thermal Conductivity | 4.01 W/cm/K @ 298.2 K |
| Thermal Expansion | (25 °C) 16.5 µm·m-1·K-1 |
| Vickers Hardness | 369 MPa |
| Young's Modulus | 110–128 GPa |
| Temperature coefficient ( K⁻¹ ) | 0.00430 @0-100°C |
| Thermal emf against Pt (cold 0C - hot 100C) ( mV ) | 0.76 |
Chemical composition
Purity：6N（99.9999%）
| Element | Value |
| Bi | 1 PPM |
| Ca | 1 PPM |
| Ni | 2 PPM |
| Fe | 2 PPM |
| Mn | <1 PPM |
| Cr | <1 PPM |
| Ag | 70 PPM |
| Al | 1 PPM |
| Mg | 1 PPM |
| Pb | 2 PPM |
| Na | <1 PPM |
| Sn | 1 PPM |
| Si | 2 PPM |
We can customized as required
Applications of Copper Rod
Copper rods are used as conductors to produce various cables and also for special purposes (electric vehicles, flat wire, plating).
Packing of Copper Rod
Standard Packing:
Typical bulk packaging includes palletized plastic 5 gallon/25 kg. pails, fiber and steel drums to 1 ton super sacks in full container (FCL) or truck load (T/L) quantities. Research and sample quantities and hygroscopic, oxidizing or other air sensitive materials may be packaged under argon or vacuum. Solutions are packaged in polypropylene, plastic or glass jars up to palletized 440 gallon liquid totes Special package is available on request.
ATTs’Copper Rod is carefully handled to minimize damage during storage and transportation and to preserve the quality of our products in their original condition.
Chemical Identifiers
| Linear Formula | Cu |
| CAS | 7440-50-8 |
| MDL Number | MFCD00010965 |
| EC No. | 231-159-6 |
| Beilstein/Reaxys No. | N/A |
| Pubchem CID | 23978 |
| SMILES | [Cu] |
| InchI Identifier | InChI=1S/Cu |
| InchI Key | RYGMFSIKBFXOCR-UHFFFAOYSA-N |
