Product Code : EM-AlN-5N-Cu
Aluminum nitride (AlN) is an excellent high temperature material with great thermal properties and electrical insulation. It is widely used in the semiconductor and electronics industries as a protective surface coating during the evaporation or sputtering deposition of other materials. Compared to other materials such as aluminum oxide, aluminum nitride has superior properties such as higher thermal and electrical conductivity, higher thermal shock capability, and better mechanical strength. This makes it the ideal material for evaporation process applications. Another advantage of aluminum nitride is that it is non-toxic, non-flammable, and non-corrosive, which makes it a safe and reliable material for use in hazardous industrial and military settings.
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Product Information
Aluminum nitride (AlN) is an excellent high temperature material with great thermal properties and electrical insulation. It is widely used in the semiconductor and electronics industries as a protective surface coating during the evaporation or sputtering deposition of other materials. Compared to other materials such as aluminum oxide, aluminum nitride has superior properties such as higher thermal and electrical conductivity, higher thermal shock capability, and better mechanical strength. This makes it the ideal material for evaporation process applications. Another advantage of aluminum nitride is that it is non-toxic, non-flammable, and non-corrosive, which makes it a safe and reliable material for use in hazardous industrial and military settings.
Material Type: Aluminum nitride
Symbol: AlN
Synonyms
N/A
Aluminum Nitride (AlN) Evaporation Material Specification
Size：Pellet / Wire / Rod / Slug / Tablet / Customized
Per your request or drawing
We can customized as required
Properties（Theoretical）
| Compound Formula | AlN |
| Molecular Weight | 40.9882 |
| Appearance | White to pale yellow powder |
| Melting Point | 2200 °C |
| Boiling Point | 2517 °C (dec.) |
| Density | 2.9 to 3.3 g/cm3 |
| Solubility in H2O | N/A |
| Electrical Resistivity | 10 to 12 10x Ω-m |
| Poisson's Ratio | 0.21 to 0.31 |
| Specific Heat | 780 J/kg-K |
| Thermal Conductivity | 80 to 200 W/m-K |
| Thermal Expansion | 4.2 to 5.4 µm/m-K |
| Young's Modulus | 330 GPa |
| Exact Mass | 40.9846 |
| Monoisotopic Mass | 40.9846 |
Application of Aluminum Nitride (AlN) Evaporation Material
• Used in deposition processes including semiconductor deposition, chemical vapor deposition (CVD) and physical vapor deposition (PVD)
• Used for optics including wear protection, decorative coatings, and displays.
Packing of Aluminum Nitride (AlN) Evaporation Material
Standard Packing:
Typical bulk packaging includes palletized plastic 5 gallon/25 kg. pails, fiber and steel drums to 1 ton super sacks in full container (FCL) or truck load (T/L) quantities. Research and sample quantities and hygroscopic, oxidizing or other air sensitive materials may be packaged under argon or vacuum. Solutions are packaged in polypropylene, plastic or glass jars up to palletized 440 gallon liquid totes Special package is available on request. They are vacuum sealed. The MSDS and Material Certification Sheets will be packed with the product.
ATTs’Aluminum Nitride (AlN) Evaporation Material is carefully handled to minimize damage during storage and transportation and to preserve the quality of our products in their original condition.
Chemical Identifiers
| Linear Formula | AlN |
| MDL Number | MFCD00003429 |
| EC No. | 246-140-8 |
| Beilstein/Reaxys No. | N/A |
| Pubchem CID | 90455 |
| IUPAC Name | azanylidynealumane |
| SMILES | [Al]#N |
| InchI Identifier | InChI=1S/Al.N |
| InchI Key | PIGFYZPCRLYGLF-UHFFFAOYSA-N |
