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Boron Carbide (B4C) Evaporation Material

Product Code : EM-B4C-5N-Cu

Boron Carbide (B4C) is a hard and wear-resistant ceramic material used for evaporation. It is typically used to create thin films for optical coatings, opto-electrical applications, and semiconductor elements. B4C can also be used in composite materials to provide greater wear resistance and improved structural integrity. Due to its high melting point (3400°C) and its ability to form an inert compound with other materials, it is a preferred deposition material for a variety of applications.


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Product Product Code Purity Size Contact Us
Boron Carbide (B4C) Evaporation Material EM-B4C-2N-Cu 99% Customize
Boron Carbide (B4C) Evaporation Material EM-B4C-3N-Cu 99.9% Customize
Boron Carbide (B4C) Evaporation Material EM-B4C-4N-Cu 99.99% Customize
Boron Carbide (B4C) Evaporation Material EM-B4C-5N-Cu 99.999% Customize

Product Information

Boron Carbide (B4C) is a hard and wear-resistant ceramic material used for evaporation. It is typically used to create thin films for optical coatings, opto-electrical applications, and semiconductor elements. B4C can also be used in composite materials to provide greater wear resistance and improved structural integrity. Due to its high melting point (3400°C) and its ability to form an inert compound with other materials, it is a preferred deposition material for a variety of applications.


Material Type: Boron Carbide 

Symbol: B4C

CAS :12069-32-8


Boron Carbide (B4C)  Evaporation Material Specification

Size:Pellet / Wire / Rod / Slug / Tablet / Customized

Per your request or drawing

We can customized as required


Properties(Theoretical)

Compound FormulaCB4
Molecular Weight55.26
AppearanceGray/black solid
Melting Point2763 °C
Boiling Point3500 °C
Density2.52 g/cm3
Solubility in H2OInsoluble
Crystal Phase / StructureRhombohedral
Electrical Resistivity0 to 11 10x Ω-m
Poisson's Ratio0.17-0.18
Specific Heat950 J/kg-K
Tensile Strength350 MPa (Ultimate)
Thermal Conductivity31 to 90 W/m-K
Thermal Expansion4.5 to 5.6 µm/m-K
Vickers Hardness26 MPa
Young's Modulus240 to 460 GPa
Exact Mass56.037222
Monoisotopic Mass56.037222



Application of Boron Carbide (B4C) Evaporation Material

• Used in deposition processes including semiconductor deposition, chemical vapor deposition (CVD) and physical vapor deposition (PVD)
• Used for optics including wear protection, decorative coatings, and displays.


Packing of Boron Carbide (B4C) Evaporation Material

Standard Packing:

Typical bulk packaging includes palletized plastic 5 gallon/25 kg. pails, fiber and steel drums to 1 ton super sacks in full container (FCL) or truck load (T/L) quantities. Research and sample quantities and hygroscopic, oxidizing or other air sensitive materials may be packaged under argon or vacuum. Solutions are packaged in polypropylene, plastic or glass jars up to palletized 440 gallon liquid totes Special package is available on request. They are vacuum sealed. The MSDS and Material Certification Sheets will be packed with the product.

ATTs’Boron Carbide (B4C) Evaporation Material is carefully handled to minimize damage during storage and transportation and to preserve the quality of our products in their original condition.


Chemical Identifiers

Linear FormulaB4C
MDL NumberMFCD00011520
EC No.235-111-5
Beilstein/Reaxys No.N/A
Pubchem CID123279
IUPAC Name2,3,4,5-tetraboratetracyclo[2.1.0.01,3.02,5]pentane
SMILESB12B3B4B1C234
InchI IdentifierInChI=1S/CB4/c2-1-3(2)5(1)4(1)2
InchI KeyINAHAJYZKVIDIZ-UHFFFAOYSA-N




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