Product Code : EM-Cu2S-5N-Cu
Copper(I) sulfide (Cu2S) is a solid, brittle, gray-black material composed of copper and sulfur. It is typically produced by various techniques, such as thermal decomposition, sintering, chemical reaction, or evaporation.
Evaporation is a process in which small volumes of a material are heated until enough of it evaporates to provide the desired amount of material. It is most commonly used to deposit thin layers of materials onto substrates such as glass, metals, ceramics, and plastics.
When evaporating copper(I) sulfide (Cu2S), the source material should be heated in an evaporator to temperatures of approximately 1000 ºC. The vaporized material travels through a condenser and onto a water-cooled substrate or collector. The evaporated material will then form a thin film of the desired material, usually around 0.001” thick.
In addition to thin film applications, copper(I) sulfide (Cu2S) can also be used for soldering or welding operations because of its ability to conduct heat and electricity. It can also be used for bonding or coating, given its durability and corrosion-resistant properties.
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Product Information
Copper(I) sulfide (Cu2S) is a solid, brittle, gray-black material composed of copper and sulfur. It is typically produced by various techniques, such as thermal decomposition, sintering, chemical reaction, or evaporation.
Evaporation is a process in which small volumes of a material are heated until enough of it evaporates to provide the desired amount of material. It is most commonly used to deposit thin layers of materials onto substrates such as glass, metals, ceramics, and plastics.
When evaporating copper(I) sulfide (Cu2S), the source material should be heated in an evaporator to temperatures of approximately 1000 ºC. The vaporized material travels through a condenser and onto a water-cooled substrate or collector. The evaporated material will then form a thin film of the desired material, usually around 0.001” thick.
In addition to thin film applications, copper(I) sulfide (Cu2S) can also be used for soldering or welding operations because of its ability to conduct heat and electricity. It can also be used for bonding or coating, given its durability and corrosion-resistant properties.
Material Type: Copper(I) sulfide
Symbol:Cu2S
CAS :22205-45-4
Arsenicum Sulfide (As3S3) Evaporation Material Specification
Size:Pellet / Wire / Rod / Slug / Tablet / Customized
Per your request or drawing
We can customized as required
Properties(Theoretical)
Compound Formula | Cu2S |
Molecular Weight | 159.157 |
Appearance | Black powder |
Melting Point | 1130 °C |
Boiling Point | N/A |
Density | 5.6 g/cm3 |
Solubility in H2O | N/A |
Exact Mass | 157.831266 |
Monoisotopic Mass | 157.831266 |
Application of Copper(I) Sulfide (Cu2S) Evaporation Material Evaporation Material
• Used in deposition processes including semiconductor deposition, chemical vapor deposition (CVD) and physical vapor deposition (PVD)
• Used for optics including wear protection, decorative coatings, and displays.
Packing of Copper(I) Sulfide (Cu2S) Evaporation Material Evaporation Material
Standard Packing:
Typical bulk packaging includes palletized plastic 5 gallon/25 kg. pails, fiber and steel drums to 1 ton super sacks in full container (FCL) or truck load (T/L) quantities. Research and sample quantities and hygroscopic, oxidizing or other air sensitive materials may be packaged under argon or vacuum. Solutions are packaged in polypropylene, plastic or glass jars up to palletized 440 gallon liquid totes Special package is available on request. They are vacuum sealed. The MSDS and Material Certification Sheets will be packed with the product.
ATTs’Copper(I) Sulfide (Cu2S) Evaporation Material Evaporation Material is carefully handled to minimize damage during storage and transportation and to preserve the quality of our products in their original condition.
Chemical Identifiers
Linear Formula | Cu2S |
MDL Number | MFCD00016062 |
EC No. | 244-842-9 |
Beilstein/Reaxys No. | N/A |
Pubchem CID | 10130093 |
IUPAC Name | copper(1+); sulfide |
SMILES | [S-2].[Cu+].[Cu+] |
InchI Identifier | InChI=1S/2Cu.S/q2*+1;-2 |
InchI Key | AQMRBJNRFUQADD-UHFFFAOYSA-N |