Product Code : EM-Cu-5N-Cu
High purity copper evaporation materials play a huge role in deposition processes to ensure high quality deposited film. Copper is reddish-orange in color with a melting point of 1,083°C, a density of 8.92 g/cc, and a vapor pressure of 10-4 Torr at 1,017°C. Two of the most popular alloys in the world, brass and bronze, contain copper. It is known to be an excellent conductor of heat and electricity and can be found in wire, coins, and electromagnets.
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Product Information
High purity copper evaporation materials play a huge role in deposition processes to ensure high quality deposited film. Copper is reddish-orange in color with a melting point of 1,083°C, a density of 8.92 g/cc, and a vapor pressure of 10-4 Torr at 1,017°C. Two of the most popular alloys in the world, brass and bronze, contain copper. It is known to be an excellent conductor of heat and electricity and can be found in wire, coins, and electromagnets.
ATT provides high-quality Copper Evaporation Materials for research and industry purposes at competitive prices. We can provide Copper Evaporation Materials with different purity, size, and density according to your requirements.
Material Type：Copper
Symbol：Cu
Color/Appearance：Copper, Metallic
Synonyms
N/A
Copper Evaporation Materials Specification
Size：Pellet / Wire / Rod / Slug / Tablet / Customized
Per your request or drawing
We can customized as required
Properties（Theoretical）
| Molecular Weight | 63.55 |
| Appearance | Reddish Metal |
| Melting Point | 1085 °C |
| Boiling Point | 2562 °C |
| Density | 8.96 g/cm3 |
| Solubility in H2O | N/A |
| Electrical Resistivity | 1.673 μΩ-cm @ 20 °C |
| Electronegativity | 1.90 Paulings |
| Heat of Fusion | 13.26 kJ ·mol-1 |
| Heat of Vaporization | 300.4 kJ ·mol-1 |
| Poisson's Ratio | 0.34 |
| Specific Heat | 0.39 kJ/kg K |
| Thermal Conductivity | 401 W ·m-1 ·K-1 |
| Thermal Expansion | (25 °C) 16.5 µm·m-1·K-1 |
| Vickers Hardness | 369 MPa |
| Young's Modulus | 110–128 GPa |
Application of Copper Evaporation Materials
• Used in deposition processes including semiconductor deposition, chemical vapor deposition (CVD) and physical vapor deposition (PVD)
• Used for optics including wear protection, decorative coatings, and displays.
Packing of Copper Evaporation Materials
Standard Packing:
Typical bulk packaging includes palletized plastic 5 gallon/25 kg. pails, fiber and steel drums to 1 ton super sacks in full container (FCL) or truck load (T/L) quantities. Research and sample quantities and hygroscopic, oxidizing or other air sensitive materials may be packaged under argon or vacuum. Solutions are packaged in polypropylene, plastic or glass jars up to palletized 440 gallon liquid totes Special package is available on request. They are vacuum sealed. The MSDS and Material Certification Sheets will be packed with the product.
ATTs’Copper Evaporation Materials is carefully handled to minimize damage during storage and transportation and to preserve the quality of our products in their original condition.
Chemical Identifiers
| Linear Formula | Cu |
| MDL Number | MFCD00010965 |
| EC No. | 231-159-6 |
| Beilstein/Reaxys No. | N/A |
| Pubchem CID | 23978 |
| SMILES | [Cu] |
| InchI Identifier | InChI=1S/Cu |
| InchI Key | RYGMFSIKBFXOCR-UHFFFAOYSA-N |
