Product Code : EM-CuS-5N-Cu
Copper sulfide (CuS) is a compound formed from the combination of copper and sulfur. It is often used as an evaporated material in electrical devices such as semiconductors and thermistors. Due to its properties, CuS is ideal for creating electrical devices as it has relatively high electrical and thermal conductivities, excellent adhesion and good thermal stability. CuS is also easy to chemically etch and is often used in the manufacturing process of electronic components. Its popularity in the electronic and semiconductor industry is due to its rich and varied colors, including yellow, olive-green and black, and its reasonable price.
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Product Information
Copper sulfide (CuS) is a compound formed from the combination of copper and sulfur. It is often used as an evaporated material in electrical devices such as semiconductors and thermistors. Due to its properties, CuS is ideal for creating electrical devices as it has relatively high electrical and thermal conductivities, excellent adhesion and good thermal stability. CuS is also easy to chemically etch and is often used in the manufacturing process of electronic components. Its popularity in the electronic and semiconductor industry is due to its rich and varied colors, including yellow, olive-green and black, and its reasonable price.
Material Type: Copper sulfide
Symbol: CuS
Synonyms
N/A
Copper Sulfide (CuS) Evaporation Material Specification
Size：Pellet / Wire / Rod / Slug / Tablet / Customized
Per your request or drawing
We can customized as required
Properties（Theoretical）
| Compound Formula | CuS |
| Molecular Weight | 95.61 |
| Appearance | black powder or lumps |
| Melting Point | 500 °C (932 °F) |
| Boiling Point | N/A |
| Density | 4.6 g/cm3 |
| Solubility in H2O | N/A |
| Exact Mass | 94.901672 |
| Monoisotopic Mass | 94.901672 Da |
Application of Copper Sulfide (CuS) Evaporation Material
• Used in deposition processes including semiconductor deposition, chemical vapor deposition (CVD) and physical vapor deposition (PVD)
• Used for optics including wear protection, decorative coatings, and displays.
Packing of Copper Sulfide (CuS) Evaporation Material
Standard Packing:
Typical bulk packaging includes palletized plastic 5 gallon/25 kg. pails, fiber and steel drums to 1 ton super sacks in full container (FCL) or truck load (T/L) quantities. Research and sample quantities and hygroscopic, oxidizing or other air sensitive materials may be packaged under argon or vacuum. Solutions are packaged in polypropylene, plastic or glass jars up to palletized 440 gallon liquid totes Special package is available on request. They are vacuum sealed. The MSDS and Material Certification Sheets will be packed with the product.
ATTs’Copper Sulfide (CuS) Evaporation Material is carefully handled to minimize damage during storage and transportation and to preserve the quality of our products in their original condition.
Chemical Identifiers
| Linear Formula | CuS |
| MDL Number | MFCD00016066 |
| EC No. | 215-271-2 |
| Beilstein/Reaxys No. | N/A |
| Pubchem CID | 14831 |
| IUPAC Name | sulfanylidenecopper |
| SMILES | O.O.O.O.O.[O-]S(=O)(=O)[O-].[Cu+2] |
| InchI Identifier | InChI=1S/Cu.S/q+2;-2 |
| InchI Key | OMZSGWSJDCOLKM-UHFFFAOYSA-N |
