Product Code : EM-DyF3-5N-Cu
Dysprosium Fluoride (or DyF3) is a chemical compound composed of dysprosium and fluorine. It is commonly used as an evaporation material in processes that involve the use of a physical vapor deposition (PVD) system. With a high boiling point (about 1400 °C), it is used to deposit layers of film onto a workpiece substrate. The evaporation method works by heating a material in an enclosed space, or chamber, until enough vapors are generated to coat the substrate. These materials have a wide range of applications in industries such as semiconductors, optics, mechanics, and aerospace. They are also used for advanced technologies, such as optical coatings, hard coatings, and multilayer stacks. The evaporation rate of DyF3 is very high, therefore making it ideal for depositing thin, hard, and uniform films.
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Product Information
Dysprosium Fluoride (or DyF3) is a chemical compound composed of dysprosium and fluorine. It is commonly used as an evaporation material in processes that involve the use of a physical vapor deposition (PVD) system. With a high boiling point (about 1400 °C), it is used to deposit layers of film onto a workpiece substrate. The evaporation method works by heating a material in an enclosed space, or chamber, until enough vapors are generated to coat the substrate. These materials have a wide range of applications in industries such as semiconductors, optics, mechanics, and aerospace. They are also used for advanced technologies, such as optical coatings, hard coatings, and multilayer stacks. The evaporation rate of DyF3 is very high, therefore making it ideal for depositing thin, hard, and uniform films.
Material Type: Dysprosium Fluoride
Symbol: DyF3
Synonyms
N/A
Dysprosium Fluoride (DyF3) Evaporation Material Specification
Size：Pellet / Wire / Rod / Slug / Tablet / Customized
Per your request or drawing
We can customized as required
Properties（Theoretical）
| Compound Formula | DyF3 |
| Molecular Weight | 219.5 |
| Appearance | White |
| Melting Point | 1360 °C (2480 °F) |
| Boiling Point | 2200 °C (3992 °F) |
| Density | 5.948 g/cm3 |
| Solubility in H2O | N/A |
| Exact Mass | 220.924 g/mol |
| Monoisotopic Mass | 220.92441 Da |
Application of Dysprosium Fluoride (DyF3) Evaporation Material
• Used in deposition processes including semiconductor deposition, chemical vapor deposition (CVD) and physical vapor deposition (PVD)
• Used for optics including wear protection, decorative coatings, and displays.
Packing of Dysprosium Fluoride (DyF3) Evaporation Material
Standard Packing:
Typical bulk packaging includes palletized plastic 5 gallon/25 kg. pails, fiber and steel drums to 1 ton super sacks in full container (FCL) or truck load (T/L) quantities. Research and sample quantities and hygroscopic, oxidizing or other air sensitive materials may be packaged under argon or vacuum. Solutions are packaged in polypropylene, plastic or glass jars up to palletized 440 gallon liquid totes Special package is available on request. They are vacuum sealed. The MSDS and Material Certification Sheets will be packed with the product.
ATTs’Dysprosium Fluoride (DyF3) Evaporation Material is carefully handled to minimize damage during storage and transportation and to preserve the quality of our products in their original condition.
Chemical Identifiers
| Linear Formula | DyF3 |
| MDL Number | MFCD00016071 |
| EC No. | 236-992-9 |
| Beilstein/Reaxys No. | N/A |
| Pubchem CID | 83587 |
| IUPAC Name | Trifluorodysprosium |
| SMILES | F[Dy](F)F |
| InchI Identifier | InChI=1S/Dy.3FH/h;3*1H/q+3;;;/p-3 |
| InchI Key | FWQVINSGEXZQHB-UHFFFAOYSA-K |
