Evaporation Materials
ATT offers high purity evaporation materials at a competitive price. We have a large number of various evaporation materials in stock and provide customized services. Materials are often packaged within the sizes required.
Product Code : EM-YbF3-5N-Cu
Ytterbium Fluoride (YbF3) is a commonly used evaporation material for thin film deposition. It is used as a source for depositing films for a variety of optical and electrical applications. YbF3 has very high thermal stability and uniformity which allow for the film's superior performance against the high temperature requirement during deposition.
Product Code : EM-SrF3-5N-Cu
Strontium fluoride (SrF3) is a commonly used evaporation material in thin-film deposition applications. It is an inorganic compound with a melting point of 851°C, and is available in both powder and pellets forms. It is used in a variety of deposition processes, including sputtering and chemical vapor deposition (CVD).
Product Code : EM-NaF-5N-Cu
Sodium fluoride (NaF) is an inorganic compound frequently used as an evaporation material for the fabrication of thin films in microelectronics. It is an important precursor for doping silicon, gallium arsenide and other semiconductor materials.
Product Code : EM-SmF3-5N-Cu
Samarium Fluoride (SmF3) is a type of evaporation material that has various uses in different industries and technological sectors. It is primarily used as a source for creating thin film coatings, particularly for dielectric layers, such as those found in optical systems like laser mirrors and lenses.
Product Code : EM-KF-5N-Cu
Potassium fluoride (KF) is an evaporating material often used in semiconductor fabrication to control chemical and physical properties of films deposited on substrates. It is commonly used in the production of semiconductor devices based on gallium arsenide (GaAs), silicon (Si), and/or indium phosphide (InP).
Product Code : EM-NdF3-5N-Cu
Neodymium fluoride (NdF3) is an inorganic compound commonly used as an evaporation material in thin film deposition. Due to its resistance to oxidation, high thermal and chemical stability, and low vapor pressure, NdF3 is an ideal material for depositing thin films at high temperature. It has a low melting temperature of 978°C.