Product Code : EM-BaF2-5N-Cu

BaF2 evaporation material is a candidate for use in vacuum evaporation deposition processes, such as physical vapor deposition (PVD). It is used to create thin layers of material over a substrate, such as semi-conductor wafers, display panels, glass, and optical elements.

Product Code : EM-ZrO2-5N-Cu

Zirconium oxide (ZrO2) is an evaporative material used for a number of industrial and manufacturing applications. ZrO2 is a white crystalline powder composed of zirconium and oxygen atoms. Its high melting point and low thermal expansion make it useful for conduction of thermal energy.

Product Code : EM-ZnO-5N-Cu

Zinc Oxide (ZnO) is a widely used evaporation material in thin film deposition processes such as in metal organic chemical vapor deposition (MOCVD). It is an inorganic material with a high evaporation rate, making it an ideal material for deposition processes.

Product Code : EM-V2O5-5N-Cu

Vanadium pentoxide (V2O5) is an inorganic compound composed of vanadium and oxygen. It is an orange-red to yellow-brown, odorless, brittle solid that is primarily used as an industrial catalyst, in specialized batteries, and as a precursor in chemical vapor deposition (CVD) of vanadium oxide coatings.

Product Code : EM-WO3-5N-Cu

Tungsten oxide (WO3) is a widely used evaporative material, due to its high thermal conductivity, low vapor pressure and good compatibility with other evaporative materials. WO3 is usually used as a coating material or as an additive to other materials due to its excellent electrical and optical properties.

Product Code : EM-Ti2O3-5N-Cu

Titanium trioxide (Ti2O3) is an evaporative material that is used for numerous thin-film processes. It is suitable for a wide range of semiconductor, industrial, decorative, and metalizing applications. The most common uses for this material are for metalizing (coating), optical coatings, semiconductors, and as a high-temperature adhesive (glue).