Evaporation Materials
ATT offers high purity evaporation materials at a competitive price. We have a large number of various evaporation materials in stock and provide customized services. Materials are often packaged within the sizes required.
Product Code : EM-LaTiO3-5N-Cu
Lanthanum Titanate (LaTiO3) is an inorganic compound that is used as an evaporation material due mainly to its very high vapor pressure, low vapor pressure when heated to high temperatures, and low vapor pressure at low temperatures.
Product Code : EM-HfC-5N-Cu
Hafnium Carbide (HfC) is a chemical compound comprised of carbon and hafnium, a transition metal found on the fourth period of group four on the periodic table. It is a refractory ceramic compound with a melting point of 5400°C. HfC is a very hard material with a hardness of approximately 9.1 on the Mohs scale.
Product Code : EM-Na3AiF6-5N-Cu
Cryolite is a naturally occurring fluorine-containing mineral composed of sodium, aluminum and fluoride (Na3AlF6) that is used as a raw material in the electrolytic production of aluminum metal and other aluminum compounds.
Product Code : EM-CuS-5N-Cu
Copper sulfide (CuS) is a compound formed from the combination of copper and sulfur. It is often used as an evaporated material in electrical devices such as semiconductors and thermistors.
Product Code : EM-BaTiO3-5N-Cu
Barium titanate (BaTiO3) is a high-temperature dielectric material used in evaporation processes, such as magnetron sputtering, to coat a variety of substrates. Barium titanate can be used to coat ceramic substrates, such as alumina, as well as most metals and alloys. It also works well with a wide range of plastics including ULTEM and PEEK.
Product Code : EM-YF3-5N-Cu
Yttrium Fluoride (YF3) is a high purity refractory material typically used as an evaporation source in Physical Vapor Deposition (PVD) processes. It is an ionic, white to yellow-white crystal with cubic and hexagonal crystal structures.
