Product Code : EM-Si3N4-5N-Cu
Silicon nitride is a ceramic material composed of silicon and nitrogen. It is commonly used for evaporation in vacuum systems and can be used for physical vapor deposition (PVD), chemical vapor deposition (CVD), and ion beam assisted deposition (IBAD). It has a wide range of applications such as protective coatings, heat sinks, wear-resistant coatings, electronic components such as well tissue implants, MEMS components and more.
The physical properties of silicon nitride give it some advantages over other materials used for evaporation. It has excellent thermal shock resistance and oxidation resistance, two important factors when dealing with high temperatures and corrosive environments. It also has high electrical resistivity, low density, and a low coefficient of thermal expansion making it ideal for use as a spacer or thermal spreader. It also has a high dielectric strength, making it suitable for a wide range of electrical insulation uses.
Please contact us if you need customized services. We will contact you with the price and availability in 24 hours.
| Product | Product Code | Purity | Size | Contact Us |
Product Information
Silicon nitride is a ceramic material composed of silicon and nitrogen. It is commonly used for evaporation in vacuum systems and can be used for physical vapor deposition (PVD), chemical vapor deposition (CVD), and ion beam assisted deposition (IBAD). It has a wide range of applications such as protective coatings, heat sinks, wear-resistant coatings, electronic components such as well tissue implants, MEMS components and more.
The physical properties of silicon nitride give it some advantages over other materials used for evaporation. It has excellent thermal shock resistance and oxidation resistance, two important factors when dealing with high temperatures and corrosive environments. It also has high electrical resistivity, low density, and a low coefficient of thermal expansion making it ideal for use as a spacer or thermal spreader. It also has a high dielectric strength, making it suitable for a wide range of electrical insulation uses.
Material Type: Silicon nitride
Symbol: Si3N4
Synonyms
N/A
Silicon Nitride (Si3N4) Evaporation Material Specification
Size：Pellet / Wire / Rod / Slug / Tablet / Customized
Per your request or drawing
We can customized as required
Properties（Theoretical）
| Compound Formula | N4Si3 |
| Molecular Weight | 140.28 |
| Appearance | odorless grey powder |
| Melting Point | 1900 °C, 2173 K, 3452 °F |
| Boiling Point | N/A |
| Density | 2.2 to 3.5 g/cm3 |
| Solubility in H2O | Insoluble |
| Refractive Index | 2.016 |
| Electrical Resistivity | 11 to 12 10x Ω-m |
| Poisson's Ratio | 0.24 to 0.27 |
| Specific Heat | 720 to 800 J/kg-K |
| Thermal Conductivity | 12 to 31 W/m-K |
| Thermal Expansion | 2.5 to 3.2 µm/m-K |
| Young's Modulus | 140 to 310 GPa |
| Exact Mass | 139.943 g/mol |
| Monoisotopic Mass | 139.943069 Da |
| Charge | N/A |
Application of Silicon Nitride (Si3N4) Evaporation Material
• Used in deposition processes including semiconductor deposition, chemical vapor deposition (CVD) and physical vapor deposition (PVD)
• Used for optics including wear protection, decorative coatings, and displays.
Packing of Silicon Nitride (Si3N4) Evaporation Material
Standard Packing:
Typical bulk packaging includes palletized plastic 5 gallon/25 kg. pails, fiber and steel drums to 1 ton super sacks in full container (FCL) or truck load (T/L) quantities. Research and sample quantities and hygroscopic, oxidizing or other air sensitive materials may be packaged under argon or vacuum. Solutions are packaged in polypropylene, plastic or glass jars up to palletized 440 gallon liquid totes Special package is available on request. They are vacuum sealed. The MSDS and Material Certification Sheets will be packed with the product.
ATTs’Silicon Nitride (Si3N4) Evaporation Material is carefully handled to minimize damage during storage and transportation and to preserve the quality of our products in their original condition.
Chemical Identifiers
| Linear Formula | Si3N4 |
| MDL Number | MFCD00011230 |
| EC No. | 234-796-8 |
| Beilstein/Reaxys No. | N/A |
| Pubchem CID | 3084099 |
| IUPAC Name | bis(azanylidynesilylimino)silane |
| SMILES | N13[Si]25N4[Si]16N2[Si]34N56 |
| InchI Identifier | InChI=1S/N4Si3/c1-5-2-6(1)3(5)7(1,2)4(5)6 |
| InchI Key | HQVNEWCFYHHQES-UHFFFAOYSA-N |
