Product Code : EM-Ta-5N-Cu
Tantalum has a melting point of 3,017°C, a density of 16.6 g/cc, and vapor pressure of 10-4 Torr at 2,590°C. It is a dark blue-gray metal that is very heavy, ductile and hard and has high corrosion resistance. Tantalum is especially resistant to chemicals at temperatures below 150 °C and can only be dissolved with hydrofluoric acid. It is mainly used to make surgical implants due to its non-toxic nature. It is also used as a capacitor for electronics and may be alloyed with other metals to add strength and durability.
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Product Information
Tantalum has a melting point of 3,017°C, a density of 16.6 g/cc, and vapor pressure of 10-4 Torr at 2,590°C. It is a dark blue-gray metal that is very heavy, ductile and hard and has high corrosion resistance. Tantalum is especially resistant to chemicals at temperatures below 150 °C and can only be dissolved with hydrofluoric acid. It is mainly used to make surgical implants due to its non-toxic nature. It is also used as a capacitor for electronics and may be alloyed with other metals to add strength and durability.
ATT provides high-quality Tantalum (Ta) Evaporation Materials for research and industry purposes at competitive prices. We can provide Tantalum (Ta) Evaporation Materials with different purity, size, and density according to your requirements.
Material Type: Tantalum
Symbol: Ta
Color/Appearance: Gray Blue, Metallic
Synonyms
N/A
Tantalum (Ta) Evaporation Materials Specification
Size:Pellet / Wire / Rod / Slug / Tablet / Customized
Per your request or drawing
We can customized as required
Properties(Theoretical)
Molecular Weight | 180.94 |
Appearance | Silvery-gray solid |
Melting Point | 3017 °C |
Boiling Point | 5458 °C |
Density | 16.69 g/cm3 (20 °C) |
Solubility in H2O | N/A |
Crystal Phase / Structure | α: body-centered cubic (bcc) / β: tetragonal |
Electrical Resistivity | 131 nΩ·m (20 °C) |
Electronegativity | 1.5 Paulings |
Heat of Fusion | 36.57 kJ/mol |
Heat of Vaporization | 753 kJ/mol |
Poisson's Ratio | 0.34 |
Specific Heat | 140 J/kg·K |
Thermal Conductivity | 57.5 W/m·K |
Thermal Expansion | 6.3 µm/m·K |
Vickers Hardness | 870–1200 MPa |
Young's Modulus | 186 GPa |
Application of Tantalum (Ta) Evaporation Materials
• Used in deposition processes including semiconductor deposition, chemical vapor deposition (CVD) and physical vapor deposition (PVD)
• Used for optics including wear protection, decorative coatings, and displays.
Packing of Tantalum (Ta) Evaporation Materials
Standard Packing:
Typical bulk packaging includes palletized plastic 5 gallon/25 kg. pails, fiber and steel drums to 1 ton super sacks in full container (FCL) or truck load (T/L) quantities. Research and sample quantities and hygroscopic, oxidizing or other air sensitive materials may be packaged under argon or vacuum. Solutions are packaged in polypropylene, plastic or glass jars up to palletized 440 gallon liquid totes Special package is available on request. They are vacuum sealed. The MSDS and Material Certification Sheets will be packed with the product.
ATTs’Tantalum (Ta) Evaporation Materials is carefully handled to minimize damage during storage and transportation and to preserve the quality of our products in their original condition.
Chemical Identifiers
Linear Formula | Ta |
MDL Number | MFCD00011252 |
EC No. | 231-135-5 |
Beilstein/Reaxys No. | N/A |
Pubchem CID | 23956 |
SMILES | [Ta] |
InchI Identifier | InChI=1S/Ta |
InchI Key | GUVRBAGPIYLISA-UHFFFAOYSA-N |