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Tin (Sn) Evaporation Material

Product Code : EM-Sn-5N-Cu

Tin is a metallic element that has a silvery-white luster with a low melting point and is soft and flexible. Tin is inert and does not react with air or water. It reacts slowly with dilute hydrochloric acid, and reacts with concentrated hydrochloric acid to generate stannous chloride; does not react with dilute sulfuric acid, but reacts with concentrated hot sulfuric acid to generate tin(IV) sulfate; and reacts with concentrated hot nitric acid to generate β-stannic acid.

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Product Product Code Purity Size Contact Us
Tin (Sn) Evaporation Material EM-Sn-2N-Cu 99% Customize
Tin (Sn) Evaporation Material EM-Sn-3N-Cu 99.9% Customize
Tin (Sn) Evaporation Material EM-Sn-4N-Cu 99.99% Customize
Tin (Sn) Evaporation Material EM-Sn-5N-Cu 99.999% Customize

Product Information

Tin is a metallic element that has a silvery-white luster with a low melting point and is soft and flexible. Tin is inert and does not react with air or water. It reacts slowly with dilute hydrochloric acid, and reacts with concentrated hydrochloric acid to generate stannous chloride; does not react with dilute sulfuric acid, but reacts with concentrated hot sulfuric acid to generate tin(IV) sulfate; and reacts with concentrated hot nitric acid to generate β-stannic acid.

Material Type: Tin 
Symbol: Sn
Color/Appearance: Silvery Lustrous Gray, Metallic

CAS :

 
7440-31-5    


Synonyms

N/A



Tin (Sn) Evaporation Materials Specification

Size:Pellet / Wire / Rod / Slug / Tablet / Customized

Per your request or drawing

We can customized as required


Properties(Theoretical)

Molecular Weight118.69
AppearanceSilver-gray metallic solid
Melting Point232 °C
Boiling Point2602 °C
Density7.265-7.31 g/cm3 (20   °C)
Solubility in H2ON/A
Electrical Resistivity11.5 x 10-8 Ω·m
Electronegativity1.96 Paulings
Heat of Fusion7.03 kJ/mol
Heat of Vaporization296.1 kJ/mol
Poisson's Ratio0.36
Specific Heat0.21 J/g·°C (25 °C)
Thermal Conductivity66.8 W/(m·K)
Thermal Expansion22.0 µm/(m·K) (20 °C)
Young's Modulus50 GPa






Application of Tin (Sn)  Evaporation Materials

• Used in deposition processes including semiconductor deposition, chemical vapor deposition (CVD) and physical vapor deposition (PVD)
• Used for optics including wear protection, decorative coatings, and displays.


Packing of Tin (Sn)  Evaporation Materials

Standard Packing:

Typical bulk packaging includes palletized plastic 5 gallon/25 kg. pails, fiber and steel drums to 1 ton super sacks in full container (FCL) or truck load (T/L) quantities. Research and sample quantities and hygroscopic, oxidizing or other air sensitive materials may be packaged under argon or vacuum. Solutions are packaged in polypropylene, plastic or glass jars up to palletized 440 gallon liquid totes Special package is available on request. They are vacuum sealed. The MSDS and Material Certification Sheets will be packed with the product.

ATTs’Tin (Sn)  Evaporation Materials is carefully handled to minimize damage during storage and transportation and to preserve the quality of our products in their original condition.







Chemical Identifiers


Linear FormulaSn
MDL NumberMFCD00133862
EC No.231-141-8
Beilstein/Reaxys No.N/A
Pubchem CID5352426
SMILES[Sn]
InchI IdentifierInChI=1S/Sn
InchI KeyATJFFYVFTNAWJD-UHFFFAOYSA-N



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