Product Code : EM-Sn-5N-Cu
Tin is a metallic element that has a silvery-white luster with a low melting point and is soft and flexible. Tin is inert and does not react with air or water. It reacts slowly with dilute hydrochloric acid, and reacts with concentrated hydrochloric acid to generate stannous chloride; does not react with dilute sulfuric acid, but reacts with concentrated hot sulfuric acid to generate tin(IV) sulfate; and reacts with concentrated hot nitric acid to generate β-stannic acid.
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Product Information
Tin is a metallic element that has a silvery-white luster with a low melting point and is soft and flexible. Tin is inert and does not react with air or water. It reacts slowly with dilute hydrochloric acid, and reacts with concentrated hydrochloric acid to generate stannous chloride; does not react with dilute sulfuric acid, but reacts with concentrated hot sulfuric acid to generate tin(IV) sulfate; and reacts with concentrated hot nitric acid to generate β-stannic acid.
Material Type: Tin
Symbol: Sn
Color/Appearance: Silvery Lustrous Gray, Metallic
Synonyms
N/A
Tin (Sn) Evaporation Materials Specification
Size:Pellet / Wire / Rod / Slug / Tablet / Customized
Per your request or drawing
We can customized as required
Properties(Theoretical)
Molecular Weight | 118.69 |
Appearance | Silver-gray metallic solid |
Melting Point | 232 °C |
Boiling Point | 2602 °C |
Density | 7.265-7.31 g/cm3 (20 °C) |
Solubility in H2O | N/A |
Electrical Resistivity | 11.5 x 10-8 Ω·m |
Electronegativity | 1.96 Paulings |
Heat of Fusion | 7.03 kJ/mol |
Heat of Vaporization | 296.1 kJ/mol |
Poisson's Ratio | 0.36 |
Specific Heat | 0.21 J/g·°C (25 °C) |
Thermal Conductivity | 66.8 W/(m·K) |
Thermal Expansion | 22.0 µm/(m·K) (20 °C) |
Young's Modulus | 50 GPa |
Application of Tin (Sn) Evaporation Materials
• Used in deposition processes including semiconductor deposition, chemical vapor deposition (CVD) and physical vapor deposition (PVD)
• Used for optics including wear protection, decorative coatings, and displays.
Packing of Tin (Sn) Evaporation Materials
Standard Packing:
Typical bulk packaging includes palletized plastic 5 gallon/25 kg. pails, fiber and steel drums to 1 ton super sacks in full container (FCL) or truck load (T/L) quantities. Research and sample quantities and hygroscopic, oxidizing or other air sensitive materials may be packaged under argon or vacuum. Solutions are packaged in polypropylene, plastic or glass jars up to palletized 440 gallon liquid totes Special package is available on request. They are vacuum sealed. The MSDS and Material Certification Sheets will be packed with the product.
ATTs’Tin (Sn) Evaporation Materials is carefully handled to minimize damage during storage and transportation and to preserve the quality of our products in their original condition.
Chemical Identifiers
Linear Formula | Sn |
MDL Number | MFCD00133862 |
EC No. | 231-141-8 |
Beilstein/Reaxys No. | N/A |
Pubchem CID | 5352426 |
SMILES | [Sn] |
InchI Identifier | InChI=1S/Sn |
InchI Key | ATJFFYVFTNAWJD-UHFFFAOYSA-N |