Product Code : EM-TiN-5N-Cu
Titanium nitride (TiN) is a vapor deposition material used for a variety of applications, including optical coatings, microelectromechanical systems (MEMS), and surface hardening. It is an attractive material for many applications due to its excellent reflection, high hardness, low wear characteristics, and low-temperature processability. It is a type of refractory ceramic material that is highly heat resistant, meaning it has excellent thermal stability and wear resistance, even when exposed to extreme temperatures and abrasive materials. It has a very low coefficient of thermal expansion, making it suitable for use in high-temperature applications and in machines with tight dimensional tolerances. Additionally, it is electrically conductive, making it a great choice for applications that require conductivity along with wear and corrosion resistance, such as electrical contacts and components.
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Product Information
Titanium nitride (TiN) is a vapor deposition material used for a variety of applications, including optical coatings, microelectromechanical systems (MEMS), and surface hardening. It is an attractive material for many applications due to its excellent reflection, high hardness, low wear characteristics, and low-temperature processability. It is a type of refractory ceramic material that is highly heat resistant, meaning it has excellent thermal stability and wear resistance, even when exposed to extreme temperatures and abrasive materials. It has a very low coefficient of thermal expansion, making it suitable for use in high-temperature applications and in machines with tight dimensional tolerances. Additionally, it is electrically conductive, making it a great choice for applications that require conductivity along with wear and corrosion resistance, such as electrical contacts and components.
Material Type: Titanium nitride
Symbol: TiN
Synonyms
N/A
Titanium Nitride (TiN) Evaporation Material Specification
Size:Pellet / Wire / Rod / Slug / Tablet / Customized
Per your request or drawing
We can customized as required
Properties(Theoretical)
Compound Formula | NTi |
Molecular Weight | 61.87 |
Appearance | Brown Powder |
Melting Point | N/A |
Boiling Point | N/A |
Density | 5.24 g/cm3 |
Solubility in H2O | N/A |
Exact Mass | 61.951 |
Monoisotopic Mass | 61.951 |
Application of Titanium Nitride (TiN) Evaporation Material
• Used in deposition processes including semiconductor deposition, chemical vapor deposition (CVD) and physical vapor deposition (PVD)
• Used for optics including wear protection, decorative coatings, and displays.
Packing of Titanium Nitride (TiN) Evaporation Material
Standard Packing:
Typical bulk packaging includes palletized plastic 5 gallon/25 kg. pails, fiber and steel drums to 1 ton super sacks in full container (FCL) or truck load (T/L) quantities. Research and sample quantities and hygroscopic, oxidizing or other air sensitive materials may be packaged under argon or vacuum. Solutions are packaged in polypropylene, plastic or glass jars up to palletized 440 gallon liquid totes Special package is available on request. They are vacuum sealed. The MSDS and Material Certification Sheets will be packed with the product.
ATTs’Titanium Nitride (TiN) Evaporation Material is carefully handled to minimize damage during storage and transportation and to preserve the quality of our products in their original condition.
Chemical Identifiers
Linear Formula | TiN |
MDL Number | MFCD00049596 |
EC No. | 247-117-5 |
Beilstein/Reaxys No. | N/A |
Pubchem CID | 93091 |
IUPAC Name | azanylidynetitanium |
SMILES | N#[Ti] |
InchI Identifier | InChI=1S/N.Ti |
InchI Key | NRTOMJZYCJJWKI-UHFFFAOYSA-N |