Product Code : FO-Cu-5N-CU
Copper foam is a rigid, three-dimensional network of interconnected copper ligaments that form cells with open pores. Copper Foam contains completely solid ligaments (as opposed to sintered or hollow ligaments) which makes it stronger and more thermally conductive. Its properties are fully customizable, which allows its performance characteristics to be optimized for a broad range of applications. It is commonly used in applications that benefit from very high thermal conductivity and surface area, and from the nature-mimicking morphology of the rigid cellular structure.
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Product Information
Copper foam is a rigid, three-dimensional network of interconnected copper ligaments that form cells with open pores. Copper Foam contains completely solid ligaments (as opposed to sintered or hollow ligaments) which makes it stronger and more thermally conductive. Its properties are fully customizable, which allows its performance characteristics to be optimized for a broad range of applications. It is commonly used in applications that benefit from very high thermal conductivity and surface area, and from the nature-mimicking morphology of the rigid cellular structure.
Synonyms
Foamy copper, porous copper, Copper OFC, Oxygen-free Copper, Copper OFHC, Oxygen-free high thermal conductivity copper, Copper OFE, Oxygen free electrolytic copper, Oxygen Free Electronic Copper, ASTM F68, Copper Alloy 101, C101, C102, C10100, C10200 Copper O, High-conductivity copper, C-110, C11000, C110 Electrolytic Tough Pitch (ETP) copper, Cu-ETP, C122, C-122, C145, C-145, C147, C-147, O60 (soft / annealed) temper, H00 (cold rolled), H01 (cold rolled, high yield), H02 (half hard) temper, H03 (three quarter hard) temper, H04 (full hard) temper
Copper Foam Specification
Dimensions
Size: customized
Per your request or drawing
We can customized as required
Properties(Theoretical)
Molecular Weight | 63.55 |
Appearance | Reddish Metal |
Melting Point | 1085 °C |
Boiling Point | 2562 °C |
Density | 8.96 g/cm3 |
Solubility in H2O | N/A |
Electrical Resistivity | 1.673 μΩ-cm @ 20 °C |
Electronegativity | 1.90 Paulings |
Heat of Fusion | 13.26 kJ ·mol-1 |
Heat of Vaporization | 300.4 kJ ·mol-1 |
Poisson's Ratio | 0.34 |
Specific Heat | 0.39 kJ/kg K |
Thermal Conductivity | 401 W ·m-1 ·K-1 |
Thermal Expansion | (25 °C) 16.5 µm·m-1·K-1 |
Vickers Hardness | 369 MPa |
Young's Modulus | 110–128 GPa |
Physical Characteristics of Copper Foam (8% Relative Density): (Theoretical)
Compressive strength | 131psi | 0.903MPa |
Tensile strength | 1000psi | 6.9 MPa |
Shear strength | 190psi | 1.31 MPa |
Vickers hardness | 35 | |
Specific heat | 0.385J/g-℃ | .092 BTU/lb-0F |
Thermal expansion coefficient | 1.7×10-5 m / m-°C (0-100°C) | 9.44× 10-6in/in--F |
Modulus of elasticity (tension) | 14.6 × 103 psi | 101.84 MPa |
Modulus of Elasticity(Compression)* | 107 kpsi | (736 MPa) |
Shear Modulus | 40.9 kpsi | (282 MPa) |
Bulk Thermal Conductivity | 5.84 BTU/ft-hr-F | (10.1 W/m-C) |
Coefficient of Thermal Expansion(0-100°℃) | 9.44× 10-6in/in--F | (1.7×10-5m/m--C) |
Bulk Resistivity | 2.56×10-5ohm-in | (6.5×10-5ohm-cm) |
Advantages
Copper Foam, also known as foamed copper, is primarily used in applications with high thermal performance requirements, such as heat exchangers, that exceed the capabilities of Aluminum Foam.
- High thermal conductivity
- High surface area per unit volume
- Creates turbulence in flowing fluids which minimizes boundary layers and promotes mixing to enhance thermal performance
- Custom conformal shapes/geometries to optimize size and weight
Characteristics
- Low Density
- High Strength to Weight Ratio
- High Surface area to Volume Ratio
- Isotropic load response
- Controlled stress-strain Characteristics
- Can be Heat Treated
- Brazable
- Can be coated and plated
Copper Foam Applications
* Electrode material
Copper foam has excellent electrical conductivity, which makes it widely used as electrode frame materials for new batteries such as nickel-zinc batteries and electric double-layer capacitors.
* Catalyst
Copper foam acts as a catalyst in many organic chemical reactions, such as directly replacing perforated copper plates as a chemical reaction catalyst. Foamed copper has also been successfully used as a carrier for photocatalytic air purification.
* Thermally conductive materials
Copper foam has excellent thermal conductivity, which makes it a flame retardant material with excellent performance. In addition, people use copper foam to make heat dissipation materials for motors and appliances.
* Silencing and shielding materials
Copper foam is a very good silencing material. Sound waves will be diffusely reflected on the surface of the foamed copper, and the sound absorption effect is achieved through the principles of material expansion and microporous noise elimination. Cooper foam is also an excellent electromagnetic shielding material, and its shielding performance is close to silver.
* Filter material
Copper foam is basically harmless to the human body, which makes it successfully used as a medical filter material. At the same time, the application of copper foam in water purification devices has a good future.
* Fluid pressure buffer material
The dispersing and buffering action of the copper foam on the fluid makes it an excellent pressure reducing protection device for various pressure gauges.
Packing of Copper Foam
Standard Packing:
Typical bulk packaging includes palletized plastic 5 gallon/25 kg. pails, fiber and steel drums to 1 ton super sacks in full container (FCL) or truck load (T/L) quantities. Research and sample quantities and hygroscopic, oxidizing or other air sensitive materials may be packaged under argon or vacuum. Solutions are packaged in polypropylene, plastic or glass jars up to palletized 440 gallon liquid totes Special package is available on request.
ATTs’ Copper foam is carefully handled to minimize damage during storage and transportation and to preserve the quality of our products in their original condition.
Chemical Identifiers
Linear Formula | Cu |
MDL Number | MFCD00010965 |
CAS # | 7440-50-8 |
EC No. | 231-159-6 |
Beilstein/Reaxys No. | N/A |
Pubchem CID | 23978 |
SMILES | [Cu] |
InchI Identifier | InChI=1S/Cu |
InchI Key | RYGMFSIKBFXOCR-UHFFFAOYSA-N |