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Lead Sponge

Product Code : ME-Pb-5N-SG

Lead sponges are cellular structures composed of a large number of pores and high porosity - 75-95% of the volume is empty. Lead sponges are produced by injecting gas into molten metal or by mixing a blowing agent that creates foam and stabilizes the foam with a high temperature blowing agent. Sponges' properties include low density, high stiffness, high energy absorption, low thermal conductivity, low permeability, fire resistance and sound absorption. Lead sponges are widely used in heat exchangers, energy absorption, flow diffusion and light optics. Ceramic foams are commonly used for thermal insulation, sound insulation, adsorption of environmental contaminants, filtration of molten metal alloys, and as substrates for catalysts requiring large internal surface areas. More technical, research and Safety (MSDS) information is available.

ATT is a professional supplier of Lead Sponge, and we also manufacture tablets, balls, ingots, balls, sheets, powders, rods, threads, sputtering targets, and many other forms and custom shapes. Other shapes are available upon request.

Please contact us if you need customized services. We will contact you with the price and availability in 24 hours.

Product Product Code Purity Size Contact Us
Lead Sponge ME-Pb-2N-SG 99% Customized
Lead Sponge ME-Pb-3N-SG 99.9% Customized
Lead Sponge ME-Pb-4N-SG 99.99% Customized
Lead Sponge ME-Pb-5N-SG 99.999% Customized

Product Information

Lead sponges are cellular structures composed of a large number of pores and high porosity - 75-95% of the volume is empty. Lead sponges are produced by injecting gas into molten metal or by mixing a blowing agent that creates foam and stabilizes the foam with a high temperature blowing agent. Sponges' properties include low density, high stiffness, high energy absorption, low thermal conductivity, low permeability, fire resistance and sound absorption. Lead sponges are widely used in heat exchangers, energy absorption, flow diffusion and light optics. Ceramic foams are commonly used for thermal insulation, sound insulation, adsorption of environmental contaminants, filtration of molten metal alloys, and as substrates for catalysts requiring large internal surface areas. More technical, research and Safety (MSDS) information is available.

ATT is a professional supplier of Lead Sponge, and we also manufacture tablets, balls, ingots, balls, sheets, powders, rods, threads, sputtering targets, and many other forms and custom shapes. Other shapes are available upon request.


Synonyms


Lead Sponge Properties (Theoretical)

Molecular Weight207.2
AppearanceBluish white
Melting Point327.502 °C
Boiling Point1740 °C
Density11.35 g/cm3
Solubility in H2ON/A
Electrical Resistivity20.648 microhm-cm @ 20 °C
Electronegativity1.8 Paulings
Heat of Fusion1.224 Cal/gm mole
Heat of Vaporization42.4 K-Cal/gm atom at 1740 °C
Poisson's Ratio0.44
Specific Heat0.038 Cal/g/oK @ 25 °C
Tensile StrengthN/A
Thermal Conductivity0.353 W/cm/K @ 298.2 K
Thermal Expansion(25 °C) 28.9 µm·m-1·K-1
Vickers HardnessN/A
Young's Modulus16 GPa


Applications of Lead Sponge

Lead is still widely used for car batteries, pigments, ammunition, cable sheathing, weights for lifting, weight belts for diving, lead crystal glass, radiation protection and in some solders. It is often used to store corrosive liquids.


Packing of Lead Sponge

Standard Packing:

Typical bulk packaging includes palletized plastic 5 gallon/25 kg. pails, fiber and steel drums to 1 ton super sacks in full container (FCL) or truck load (T/L)s quantities. Research and sample quantities and hygroscopic, oxidizing or other air sensitive materials may be packaged under argon or vacuum. Solutions are packaged in polypropylene, plastic or glass jars up to palletized 440 gallon liquid totes Special package is available on request.

ATTs’Lead Sponge is carefully handled to minimize damage during storage and transportation and to preserve the quality of our products in their original condition.

Chemical Identifiers

Linear FormulaPb
MDL NumberMFCD00134050
EC No.231-100-4
Beilstein/Reaxys No.N/A
Pubchem CID5352425
SMILES[Pb]
InchI IdentifierInChI=1S/Pb
InchI KeyWABPQHHGFIMREM-UHFFFAOYSA-N



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