Product Code : ME-Pb-5N-WF
ATT produces the highest density of lead wafers. Our standard wafer sizes are nominally 25.4 mm (1 inch) to 300 mm (11.8 inch). Materials are produced by ultra-high purification processes such as crystallization, solid state and sublimation. This process forms a cylindrical ingot, which is then sliced and polished to form a wafer. ATT specializes in the production of custom compositions for commercial and research applications as well as new proprietary technologies. ATT also casts any rare earth metal and most other advanced materials into bars, rods or plates, and other mechanical shapes, and in solution and organometrics through other processes such as nanoparticles.
ATT is a professional supplier of lead wafers, and we also manufacture tablets, balls, ingots, balls, sheets, powders, rods, wires, sputtering targets, and many other forms and custom shapes. Other shapes are available upon request
Please contact us if you need customized services. We will contact you with the price and availability in 24 hours.
Product | Product Code | Purity | Size | Contact Us |
Product Information
ATT specializes in producing high-purity lead rods with the highest density and smallest average grain size for semiconductor, chemical vapor deposition (CVD) and physical vapor deposition (PVD) processes, including thermal and electron beam (E-Beam) evaporation, low temperature organic evaporation, atomic layer deposition (ALD), metal-organic and chemical vapor deposition (MOCVD). Our standard rod sizes range from 1/8 "x 1/8" to 1/4 "x 1/4" and 3 mm diameter. We can also offer rods and deposition materials beyond this range for specific applications such as fuel cells and solar energy, as well as thin film deposition on glass or metal substrates. Materials are produced by ultra-high purification processes such as crystallization, solid state and sublimation. ATT specializes in the production of custom compositions for commercial and research applications as well as new proprietary technologies. ATT casts any rare earth metal and most other advanced materials into bars, rods, or plates, as well as other mechanical shapes, and through other processes, such as nanoparticles, in solution and organometrics. We have a variety of standard size bar molds.
ATT is a professional supplier of lead rods, and we also manufacture tablets, balls, ingots, balls, sheets, powders, rods, threads, sputtering targets, and many other forms and custom shapes. Other shapes are available upon request.
Synonyms
Lead Wafer Properties (Theoretical)
Molecular Weight | 207.2 |
Appearance | Bluish white |
Melting Point | 327.502 °C |
Boiling Point | 1740 °C |
Density | 11.35 g/cm3 |
Solubility in H2O | N/A |
Electrical Resistivity | 20.648 microhm-cm @ 20 °C |
Electronegativity | 1.8 Paulings |
Heat of Fusion | 1.224 Cal/gm mole |
Heat of Vaporization | 42.4 K-Cal/gm atom at 1740 °C |
Poisson's Ratio | 0.44 |
Specific Heat | 0.038 Cal/g/oK @ 25 °C |
Tensile Strength | N/A |
Thermal Conductivity | 0.353 W/cm/K @ 298.2 K |
Thermal Expansion | (25 °C) 28.9 µm·m-1·K-1 |
Vickers Hardness | N/A |
Young's Modulus | 16 GPa |
Applications of Lead Wafer
Lead is still widely used for car batteries, pigments, ammunition, cable sheathing, weights for lifting, weight belts for diving, lead crystal glass, radiation protection and in some solders. It is often used to store corrosive liquids.
Packing of Lead Wafer
Standard Packing:
Typical bulk packaging includes palletized plastic 5 gallon/25 kg. pails, fiber and steel drums to 1 ton super sacks in full container (FCL) or truck load (T/L)s quantities. Research and sample quantities and hygroscopic, oxidizing or other air sensitive materials may be packaged under argon or vacuum. Solutions are packaged in polypropylene, plastic or glass jars up to palletized 440 gallon liquid totes Special package is available on request.
ATTs’Lead Wafer is carefully handled to minimize damage during storage and transportation and to preserve the quality of our products in their original condition.
Chemical Identifiers
Linear Formula | Pb |
MDL Number | MFCD00134050 |
EC No. | 231-100-4 |
Beilstein/Reaxys No. | N/A |
Pubchem CID | 5352425 |
SMILES | [Pb] |
InchI Identifier | InChI=1S/Pb |
InchI Key | WABPQHHGFIMREM-UHFFFAOYSA-N |