Product Code : AL-MoCu-5N-CU
MoCu alloy is a kind of pseudo-alloy that is composed of Molybdenum and Copper. It consists of Molybdenum and Copper's characteristics, having high thermal conductivity, low thermal expansion coefficient, non-magnetic, low gas content, ideal vacuum performance, good machinability, special high-temperature performance.
Cu/Mo/Cu (CMC) is a sandwich composite including a Molybdenum core layer and two copper-clad layers. It has adjustable CTE and high thermal conductivity, making it suitable for the heat sink, head frame, and microchannel cooler for PCB. All types of CMC sheets can be stamped into components.
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| Product | Product Code | Purity | Size | Contact Us |
Product Information
MoCu alloy is a kind of pseudo-alloy that is composed of Molybdenum and Copper. It consists of Molybdenum and Copper's characteristics, having high thermal conductivity, low thermal expansion coefficient, non-magnetic, low gas content, ideal vacuum performance, good machinability, special high-temperature performance.
Cu/Mo/Cu (CMC) is a sandwich composite including a Molybdenum core layer and two copper-clad layers. It has adjustable CTE and high thermal conductivity, making it suitable for the heat sink, head frame, and microchannel cooler for PCB. All types of CMC sheets can be stamped into components.
Copper Clad Molybdenum Synonyms
Mo-Cu, moly copper, CuMo, molybdenum-copper, 60/40 65/35 70/30 75/25 80/20 85/15, Molybdenum-Copper Composite Material, Copper-Molybdenum-Copper Laminate, CuMoCu, CMC, Cu/Mo70Cu/Cu, CPC, Copper, Compd. With Molybdenum (1:1), 135495-47-5
Copper Clad Molybdenum Specification
Per your request or drawing
We can customized as required
Properties（Theoretical）
| Molecular Weight | 159.496 |
| Appearance | Metallic solid in various forms (plate, bar, sheet, sputtering target, powder) |
| Melting Point | N/A |
| Boiling Point | N/A |
| Density | 9.6-10.0 g/cm3 |
| Solubility in H2O | N/A |
| Electrical Resistivity | 3.8 x 10-6 Ω·cm |
| Tensile Strength | >e; 290 MPa (ultimate) |
| Thermal Conductivity | 165-215 W/m·K |
| Thermal Expansion | 6.8-9.5 µm/m-°C |
| Exact Mass | 160.835 g/mol |
| Monoisotopic Mass | 160.835 g/mol |
Typical MoCu Alloy Properties
| Material | Mo Content | Copper Content | Density | Thermal Conductivity at 25℃ | CTE at 25℃ |
| Wt% | Wt% | g/cm3 | W/M∙K | (10-6/K) | |
| Mo85Cu15 | 85±1 | Balance | 10 | 160-180 | 6.8 |
| Mo80Cu20 | 80±1 | Balance | 9.9 | 170-190 | 7.7 |
| Mo70Cu30 | 70±1 | Balance | 9.8 | 180-200 | 9.1 |
| Mo60Cu40 | 60±1 | Balance | 9.66 | 210-250 | 10.3 |
| Mo50Cu50 | 50±0.2 | Balance | 9.54 | 230-270 | 11.5 |
| Mo40Cu60 | 40±0.2 | Balance | 9.42 | 280-290 | 11.8 |
Typical CMC Properties
| Material | Composite | Copper Content | Thermal Conductivity at 25℃ W/M∙K | CTE at 25℃ | |
| Cu:Mo:Cu | g/cm3 | In-plane | Thru-thickness | (10-6/K) | |
| CMC13:74:13 | 13:74:13 | 9.88 | 200 | 170 | 5.6 |
| CMC 141 | 1:4:1 | 9.75 | 220 | 180 | 6.0 |
| CMC 131 | 1:3:1 | 9.66 | 244 | 190 | 6.8 |
| CMC 121 | 1:2:1 | 9.54 | 260 | 210 | 7.8 |
| CMC 111 | 1:1:1 | 9.32 | 305 | 250 | 8.8 |
Applications of Copper Clad Molybdenum
Thermal mounting plates
chip carriers for microwave components,
flanges and frames for RF and laser diode packages
LED packages, BGA packages, GaAs device mounts, etc.
Packing of Copper Clad Molybdenum
Standard Packing:
Typical bulk packaging includes palletized plastic 5 gallon/25 kg. pails, fiber and steel drums to 1 ton super sacks in full container (FCL) or truck load (T/L) quantities. Research and sample quantities and hygroscopic, oxidizing or other air sensitive materials may be packaged under argon or vacuum. Solutions are packaged in polypropylene, plastic or glass jars up to palletized 440 gallon liquid totes Special package is available on request.
ATTs’Copper Clad Molybdenum is carefully handled to minimize damage during storage and transportation and to preserve the quality of our products in their original condition.
Chemical Identifiers
| Linear Formula | Mo-Cu |
| MDL Number | N/A |
| EC No. | N/A |
| Pubchem CID | 57448858 |
| IUPAC Name | copper; molybdenum |
| SMILES | [Cu].[Mo] |
| InchI Identifier | InChI=1S/Cu.Mo |
| InchI Key | WUUZKBJEUBFVMV-UHFFFAOYSA-N |
