ATT supplies semiconductors and materials for the production of semiconductors in a wide variety of forms.  These include single-crystal and polycrystalline bulk materials, finished semiconductor wafers, organometallic deposition precursors, oxide and ceramic dielectric materials, and numerous types of sputtering targets.From bare wafer to finished chip, there are hundreds of special process steps, such as oxidation, spattering, lithography, etching, ion implantation and packaging, etc. in the process.  Semiconductor raw materials are used in every link of integrated circuit production.  The materials used in wafer manufacturing include silicon wafers, photoresist, photoresist reagents, wet electronic chemicals, electronic gases, CMP polishing materials, and target materials, etc.  In terms of market share, among all these wafer manufacturing materials, silicon wafers account for the largest market, about 33%, followed by electronic gases, photolithography machines and supporting reagents.  Chip packaging materials include packaging substrate, lead frame, resin, bonding wire, tin ball, and plating solution, etc.  At the same time, similar wet electronic chemicals contain various kinds of reagents such as acid and alkali, and there are as many as hundreds of fine molecule industries.  From the perspective of market share, among semiconductor packaging materials, packaging substrate accounts for the largest proportion (about 40%), followed by lead frame and bonding line.