Product Code :
Aluminum Sputtering Targets can be used in semiconductors, chemical vapor deposition (CVD), physical vapor deposition (PVD) display, and optical applications. We are a supplier of high-quality Aluminum Sputtering targets at competitive prices. ATT provides high-quality Aluminum Sputtering Target for research and industry purposes at competitive prices. We can provide Aluminum Sputtering Target with different purity, size, and density according to your requirements.
Please contact us if you need customized services. We will contact you with the price and availability in 24 hours.
Product Information
Aluminum is a silvery white reactive metal which is usually covered by a tenacious oxide coating. This renders it inert to acids, but it is attacked by alkalies. It is the most common metallic element in the earth's crust (82000 ppm) and is extracted from the hydrated oxide, Bauxite, by electrolysis of the oxide dissolved in molten sodium hexafluoroaluminate (cryolite). The metal has good thermal properties and is malleable and ductile. It is light, malleable, ductile, and non-magnetic under normal conditions. It has a density of 2.7 g/cc, a melting point of 660°C, and a vapor pressure of 10-4 Torr at 1,010°C. Although it is not a strong material, it is a good conductor of heat and electricity and is able to form an oxide layer that is resistant to corrosion. Aluminum and its alloys are widely used for various applications including aircraft assemblies and engine parts.
Aluminum Sputtering Targets can be used in semiconductors, chemical vapor deposition (CVD), physical vapor deposition (PVD) display, and optical applications. We are a supplier of high-quality Aluminum Sputtering targets at competitive prices. ATT provides high-quality Aluminum Sputtering Target for research and industry purposes at competitive prices. We can provide Aluminum Sputtering Target with different purity, size, and density according to your requirements.
Synonyms
Aluminum (Al) Sputtering Target Specification
Size：
| Circular Sputtering Targets | Diameter | 1.0”2.0”3.0”4.0”5.0”6.0”up to 21” |
| Rectangular Sputtering Targets | Width x Length | 5” x 12”5” x 15”5” x 20”5” x 22”6” x 20” |
| Thickness | 0.125”, 0.25” | |
Shape: Disc/Rectangular/Tube
Bonding: Unbonding/Bonding
Purity:2N(99%), 3N5(99.95%), 4N(99.99%), 4N5(99.995%),5N(99.999%).6N(99.9999%).
Per your request or drawing
We can customized as required
Properties（Theoretical）
| Molecular Weight | 26.98 |
| Appearance | Silvery |
| Melting Point | 660.39°C |
| Boiling Point | 2467 °C |
| Density | 2700 kg/m3 |
| Electrical Resistivity | 2.6548 microhm-cm @ 0 °C |
| Electrical resistivity ( µOhmcm ) | 2.67@20°C |
| Electronegativity | 1.5 Paulings |
| Heat of Vaporization | 67.9 K-Cal/gm at om at 765 °C |
| Poisson's Ratio | 0.35 |
| Thermal Conductivity | 2.37 W/cm/ K @ 298.2 K |
| Thermal Expansion | (25 °C) 23.1 µm·m-1·K-1 |
| Superconductivity critical temperature ( K ) | 1.175 |
| Temperature coefficient ( K⁻¹ ) | 0.00450 @0-100°C |
| Thermal emf against Pt (cold 0C - hot 100C) ( mV ) | 0.42 |
| Bulk modulus ( GPa ) ( Hard ) | 75.2 |
| Bulk modulus ( GPa ) ( Soft ) | 75.2 |
| Hardness - Vickers ( kgf mm⁻² ) ( Hard ) | 35 - 48 |
| Hardness - Vickers ( kgf mm⁻² ) ( Soft ) | 21 |
| Material condition | Soft |
| Material condition | Hard |
| Poisson's ratio ( Hard ) | 0.345 |
| Poisson's ratio ( Soft ) | 0.345 |
| Tensile modulus ( GPa ) ( Hard ) | 70.6 |
| Tensile modulus ( GPa ) ( Soft ) | 70.6 |
| Tensile strength ( MPa ) ( Hard ) | 130.00 - 195.00 |
| Tensile strength ( MPa ) ( Soft ) | 50.00 - 90.00 |
| Yield strength ( MPa ) ( Hard ) | 110.0 - 170.0 |
| Yield strength ( MPa ) ( Soft ) | 10.0 - 35.0 |
| Coefficient of thermal expansion ( x10⁻⁶ K⁻¹ ) | 23.500 @0-100°C |
| Latent heat of evaporation ( J g⁻¹ ) | 10800 |
| Latent heat of fusion ( J g⁻¹ ) | 388 |
| Specific heat ( J K⁻¹ kg⁻¹ ) | 900.0 @25°C |
Chemical composition
Purity：5N（99.999%）
| element | Value |
| Mg | 1.2 PPM |
| Fe | 0.3 PPM |
| Si | 0.8 PPM |
| Cu | 0.3 PPM |
We can customized as required
Sputtering Targets Requirements
General requirements such as size, flatness, purity, impurity content, density, N/O/C/S, grain size, and defect control. Special requirements include surface roughness, resistance value, grain size uniformity, composition and tissue uniformity, magnetic conductivity, ultra-high density, ultra-fine grains, etc.
Applications of Aluminum (Al) Sputtering Target
Aluminum Sputtering Target is mainly used in the electronics and information industry, glass coating field, wear-resistant materials, high-temperature corrosion resistance, high-grade decorative goods, and other industries.
Packing of Aluminum (Al) Sputtering Target
Standard Packing:
Typical bulk packaging includes palletized plastic 5 gallon/25 kg. pails, fiber and steel drums to 1 ton super sacks in full container (FCL) or truck load (T/L) quantities. Research and sample quantities and hygroscopic, oxidizing or other air sensitive materials may be packaged under argon or vacuum. Solutions are packaged in polypropylene, plastic or glass jars up to palletized 440 gallon liquid totes Special package is available on request.
ATTs’ Aluminum (Al) Sputtering Target is carefully handled to minimize damage during storage and transportation and to preserve the quality of our products in their original condition.
Chemical Identifiers
| Linear Formula | Al |
| CAS #: | 7429-90-5 |
| MDL Number | MFCD00134029 |
| EC No. | 231-072-3 |
| Beilstein/Reaxys No. | N/A |
| Pubchem CID | 5359268 |
| SMILES | [Al] |
| InchI Identifier | InChI=1S/Al |
| InchI Key | XAGFODPZIPBFFR-UHFFFAOYSA-N |
