Aluminum Cobalt (Al/Co) Sputtering Target

Product Information

Aluminum Cobalt (Al/Co) sputtering targets are widely used in physical vapor deposition (PVD) processes for the deposition of thin films of Al/Co alloys. The combination of aluminum (Al) and cobalt (Co) creates an alloy that exhibits excellent magnetic, electrical, and catalytic properties. The thin films deposited using the Al/Co sputtering targets find applications in different industries including electronics, magnetic storage media, and catalysis.

The fabrication of Al/Co sputtering targets typically involves the use of powder metallurgy techniques, where Al and Co powders are blended in the desired ratio and then compressed under high pressure. The resulting compacted slab is then sintered at high temperatures in a vacuum atmosphere to produce a dense sputtering target with the desired size and shape. Al/Co sputtering targets are often mounted on a backing plate and installed in a sputtering chamber.

During sputtering, the Al/Co target is bombarded by high-energy ions, which cause atoms to be ejected from the target surface and deposited onto a substrate to form a thin film of Al/Co alloys. The properties of the resulting films can be controlled by adjusting the deposition parameters such as the working gas, the target-to-substrate distance, and the sputtering power.

Aluminum Cobalt (Al/Co) sputtering targets are highly suitable for depositing thin films with precise composition, uniformity, and adhesion. The resulting Al/Co films exhibit good material properties including high magnetic anisotropy, high coercivity, and low magnetic noise, making them useful for a variety of magnetic sensing and storage applications.

Chemical Formula:Al/Co

 Aluminum Cobalt (Al/Co) Sputtering Target Specification

Shape: Disc/Rectangular/Tube

Bonding: Unbonding/Bonding

Per your request or drawing

We can customized as required

Size：

Sputtering Targets Requirements

General requirements such as size, flatness, purity, impurity content, density, N/O/C/S, grain size, and defect control. Special requirements include surface roughness, resistance value, grain size uniformity, composition and tissue uniformity, magnetic conductivity, ultra-high density, ultra-fine grains, etc.

Application of  Aluminum Cobalt (Al/Co)  Sputtering Target

 Aluminum Cobalt (Al/Co) Sputtering Target is mainly used in the electronics and information industry, glass coating field, wear-resistant materials, high-temperature corrosion resistance, high-grade decorative goods, and other industries.

Packing of   Aluminum Cobalt (Al/Co)  Sputtering Target

Standard Packing:

Typical bulk packaging includes palletized plastic 5 gallon/25 kg. pails, fiber and steel drums to 1 ton super sacks in full container (FCL) or truck load (T/L) quantities. Research and sample quantities and hygroscopic, oxidizing or other air sensitive materials may be packaged under argon or vacuum. Solutions are packaged in polypropylene, plastic or glass jars up to palletized 440 gallon liquid totes Special package is available on request.

ATTs  Aluminum Cobalt (Al/Co) Sputtering Target is carefully handled to minimize damage during storage and transportation and to preserve the quality of our products in their original condition.

Chemical Identifiers