Product Code : ST-Al/Cu-5N-Cu
Aluminum copper (Al/Cu) sputtering target is a popular sputtering method used in electronics manufacturing and other industries. The aluminum and copper alloy is made by mixing the two metals in an inert gas medium, then forming them into a spinning disc. This process can produce very thin layers of metal, making it ideal for use in coating materials for electronics. The thin films created by aluminum copper sputtering are highly durable and can withstand extreme temperatures and chemical exposure. This makes them ideal for use in many types of electronic devices, including integrated circuits, solar panels, and medical devices.
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Product Information
Aluminum copper (Al/Cu) sputtering target is a popular sputtering method used in electronics manufacturing and other industries. The aluminum and copper alloy is made by mixing the two metals in an inert gas medium, then forming them into a spinning disc. This process can produce very thin layers of metal, making it ideal for use in coating materials for electronics. The thin films created by aluminum copper sputtering are highly durable and can withstand extreme temperatures and chemical exposure. This makes them ideal for use in many types of electronic devices, including integrated circuits, solar panels, and medical devices.
Chemical Formula: Al/Cu
Synonyms
AlCu; Aluminum-copper master alloy; Aluminum 1100; Aluminum 2017, 2017-T4, 2017-T451, 1100-H8; Al99.0Cu; A91100; UNS A91100; CAS numbers 12003-21-3, 12003-26-8, 12003-30-4, 12252-23-2, 12004-58-9, 12004-92-1
Aluminum Copper (Al/Cu) Sputtering Target Specification
Shape: Disc/Rectangular/Tube
Bonding: Unbonding/Bonding
Per your request or drawing
We can customized as required
Size：
| Circular Sputtering Targets | Diameter | 1.0”2.0”3.0”4.0”5.0”6.0”up to 21” |
| Rectangular Sputtering Targets | Width x Length | 5” x 12”5” x 15”5” x 20”5” x 22”6” x 20” |
| Thickness | 0.125”, 0.25” | |
Properties（Theoretical）
| Compound Formula | Al/Cu |
| Appearance | Reddish metallic target |
| Melting Point | 548 °C |
| Boiling Point | N/A |
| Density | N/A |
| Solubility in H2O | N/A |
| Exact Mass | 89.911 g/mol |
| Monoisotopic Mass | 89.911 g/mol |
Sputtering Targets Requirements
General requirements such as size, flatness, purity, impurity content, density, N/O/C/S, grain size, and defect control. Special requirements include surface roughness, resistance value, grain size uniformity, composition and tissue uniformity, magnetic conductivity, ultra-high density, ultra-fine grains, etc.
Application of Aluminum Copper (Al/Cu) Sputtering Target
Aluminum Copper (Al/Cu) Sputtering Target is mainly used in the electronics and information industry, glass coating field, wear-resistant materials, high-temperature corrosion resistance, high-grade decorative goods, and other industries.
Packing of Aluminum Copper (Al/Cu) Sputtering Target
Standard Packing:
Typical bulk packaging includes palletized plastic 5 gallon/25 kg. pails, fiber and steel drums to 1 ton super sacks in full container (FCL) or truck load (T/L) quantities. Research and sample quantities and hygroscopic, oxidizing or other air sensitive materials may be packaged under argon or vacuum. Solutions are packaged in polypropylene, plastic or glass jars up to palletized 440 gallon liquid totes Special package is available on request.
ATTs’Aluminum Copper (Al/Cu) Sputtering Target is carefully handled to minimize damage during storage and transportation and to preserve the quality of our products in their original condition.
Chemical Identifiers
| Linear Formula | Al-Cu |
| MDL Number | MFCD00213972 |
| EC No. | N/A |
| Pubchem CID | 10197627 |
| IUPAC Name | aluminum; copper |
| SMILES | [Al].[Cu] |
| InchI Identifier | InChI=1S/Al.Cu |
| InchI Key | WPPDFTBPZNZZRP-UHFFFAOYSA-N |
