Aluminum Fluoride (AlF3) Sputtering Target

Product Information

Aluminum Fluoride (AlF3) sputtering targets are solid-state compounds used in the sputtering process to coat surfaces with thin films. AlF3 is a chemical compound made up of aluminum and fluoride atoms, with the chemical formula AlF3.

In the sputtering process, high-energy ions are bombarded onto a target material, which results in the release of atoms that then deposit onto a substrate to form a thin film. Aluminum Fluoride sputtering targets are used to deposit thin films on various substrates, such as glass, metals, and ceramics.

Aluminum Fluoride sputtering targets are typically made by using powder metallurgy processes, in which AlF3 powders are mixed, pressed, and sintered at high temperatures to form a dense, uniform, and high-purity target material. The target is then cut and machined into the desired shape and size before being subjected to a thorough cleaning process to ensure its purity.

Aluminum Fluoride sputtering targets possess excellent optical properties, specifically in the ultraviolet region. Therefore, they are widely used in various applications such as anti-reflection coatings, optical fibers, and optical sensors. Additionally, Aluminum Fluoride sputtering targets are commonly used in the electronics industry as a dielectric layer in thin film transistors and memory chips.

In conclusion, Aluminum Fluoride sputtering targets are an essential material in the production of thin films with outstanding optical properties and dielectric behavior. They are commonly used in the electronics and optics industries, making them a crucial component in various devices and applications.

Chemical Formula: AlF3

CAS Number:  7784-18-1

Synonyms

Aluminum trifluoride, trifluoroalumane, trifluoridoaluminium, aluminum(III) fluoride, aluminum(3+) fluoride, aluminum(3+) trifluoride

Aluminum Fluoride (AlF3) Sputtering Target Specification

Shape: Disc/Rectangular/Tube

Bonding: Unbonding/Bonding

Per your request or drawing

We can customized as required

Size：

Porperties（Theoretical）

Sputtering Targets Requirements

General requirements such as size, flatness, purity, impurity content, density, N/O/C/S, grain size, and defect control. Special requirements include surface roughness, resistance value, grain size uniformity, composition and tissue uniformity, magnetic conductivity, ultra-high density, ultra-fine grains, etc.

Application of Aluminum Fluoride (AlF3)  Sputtering Target

Aluminum Fluoride (AlF3) Sputtering Target is mainly used in the electronics and information industry, glass coating field, wear-resistant materials, high-temperature corrosion resistance, high-grade decorative goods, and other industries.

Packing of  Aluminum Fluoride (AlF3)  Sputtering Target

Standard Packing:

Typical bulk packaging includes palletized plastic 5 gallon/25 kg. pails, fiber and steel drums to 1 ton super sacks in full container (FCL) or truck load (T/L) quantities. Research and sample quantities and hygroscopic, oxidizing or other air sensitive materials may be packaged under argon or vacuum. Solutions are packaged in polypropylene, plastic or glass jars up to palletized 440 gallon liquid totes Special package is available on request.

ATTs’Aluminum Fluoride (AlF3) Sputtering Target is carefully handled to minimize damage during storage and transportation and to preserve the quality of our products in their original condition.

Chemical Identifier