Product Code : ST-Al/Mg-5N-Cu
Aluminum Magnesium (Al/Mg) sputtering targets are commonly used in physical vapor deposition (PVD) processes to deposit thin films of Al/Mg alloys onto a substrate. The combination of aluminum (Al) and magnesium (Mg) provides high strength and durability with excellent resistance to corrosion. The resulting films are often used in aerospace, automotive, and other high-performance applications.
Aluminum Magnesium (Al/Mg) sputtering targets are produced by blending Al and Mg powders in the desired ratio and compacting the resulting mixture under high pressure to form a solid target. The target is then sintered at high temperatures in a vacuum to produce a dense, homogenous slab of the desired size and shape. The sputtering target is then mounted onto a backing plate and installed in a sputtering chamber.
In the sputtering process, a high-energy plasma is generated in the sputtering chamber, and Al/Mg atoms are ejected from the target surface by positive ions. The ejected atoms are then deposited onto a substrate to form a thin film. The deposition rate, film thickness, and other material properties can be controlled by adjusting key parameters such as the sputtering power, working gas, and deposition time.
Aluminum Magnesium (Al/Mg) sputtering targets are often used to deposit thin films with precise composition, uniformity, and adhesion. The deposited films exhibit high durability and wear resistance, making them well-suited for a variety of applications, including aerospace, automotive, and corrosion-resistant coatings. They are also used in the formation of electrical contacts and as a protective layer in electronic devices.
Please contact us if you need customized services. We will contact you with the price and availability in 24 hours.
| Product | Product Code | Purity | Size | Contact Us |
Product Information
Aluminum Magnesium (Al/Mg) sputtering targets are commonly used in physical vapor deposition (PVD) processes to deposit thin films of Al/Mg alloys onto a substrate. The combination of aluminum (Al) and magnesium (Mg) provides high strength and durability with excellent resistance to corrosion. The resulting films are often used in aerospace, automotive, and other high-performance applications.
Aluminum Magnesium (Al/Mg) sputtering targets are produced by blending Al and Mg powders in the desired ratio and compacting the resulting mixture under high pressure to form a solid target. The target is then sintered at high temperatures in a vacuum to produce a dense, homogenous slab of the desired size and shape. The sputtering target is then mounted onto a backing plate and installed in a sputtering chamber.
In the sputtering process, a high-energy plasma is generated in the sputtering chamber, and Al/Mg atoms are ejected from the target surface by positive ions. The ejected atoms are then deposited onto a substrate to form a thin film. The deposition rate, film thickness, and other material properties can be controlled by adjusting key parameters such as the sputtering power, working gas, and deposition time.
Aluminum Magnesium (Al/Mg) sputtering targets are often used to deposit thin films with precise composition, uniformity, and adhesion. The deposited films exhibit high durability and wear resistance, making them well-suited for a variety of applications, including aerospace, automotive, and corrosion-resistant coatings. They are also used in the formation of electrical contacts and as a protective layer in electronic devices.
Chemical Formula:Al/Mg
CAS Number:
Synonyms
Aluminum-Magnesium; AlMg; Aluminum 5056 Alloy; UNS A95056; ISO AlMg5; ISO AlMg5Cr; AA5056-H38; Aluminum-Magnesium Wrought Alloy; 5056-H111; 5056-H12; 5056-H14; 5056-H18; 5056-H192; 5056-H32; 5056-H34; 5056-H38; 5056-H392; 5056-O
Aluminum Magnesium (Al/Mg) Sputtering Target Specification
Shape: Disc/Rectangular/Tube
Bonding: Unbonding/Bonding
Per your request or drawing
We can customized as required
Size：
| Circular Sputtering Targets | Diameter | 1.0”2.0”3.0”4.0”5.0”6.0”up to 21” |
| Rectangular Sputtering Targets | Width x Length | 5” x 12”5” x 15”5” x 20”5” x 22”6” x 20” |
| Thickness | 0.125”, 0.25” | |
Properties（Theoretical）
| Appearance | Silvery-gray metallic target |
| Melting Point | 600 °C (1110 °F) |
| Boiling Point | N/A |
| Density | 1.9 g/cm3 |
| Solubility in H2O | N/A |
| Electrical Resistivity | -7 10x Ω-m |
| Poisson's Ratio | 0.29 |
| Specific Heat | 1040 J/kg-K |
| Tensile Strength | 230 to 280 MPa (Ultimate)/ 130 to 180 MPa (Yeild) |
| Thermal Expansion | 26 µm/m-K |
| Young's Modulus | 45 GPa |
Sputtering Targets Requirements
General requirements such as size, flatness, purity, impurity content, density, N/O/C/S, grain size, and defect control. Special requirements include surface roughness, resistance value, grain size uniformity, composition and tissue uniformity, magnetic conductivity, ultra-high density, ultra-fine grains, etc.
Application of Aluminum Magnesium (Al/Mg) Sputtering Target
Aluminum Magnesium (Al/Mg) Sputtering Target is mainly used in the electronics and information industry, glass coating field, wear-resistant materials, high-temperature corrosion resistance, high-grade decorative goods, and other industries.
Packing of Aluminum Magnesium (Al/Mg) Sputtering Target
Standard Packing:
Typical bulk packaging includes palletized plastic 5 gallon/25 kg. pails, fiber and steel drums to 1 ton super sacks in full container (FCL) or truck load (T/L) quantities. Research and sample quantities and hygroscopic, oxidizing or other air sensitive materials may be packaged under argon or vacuum. Solutions are packaged in polypropylene, plastic or glass jars up to palletized 440 gallon liquid totes Special package is available on request.
ATTs Aluminum Magnesium (Al/Mg) Sputtering Target is carefully handled to minimize damage during storage and transportation and to preserve the quality of our products in their original condition.
Chemical Identifiers
| Linear Formula | Al-Mg |
| MDL Number | MFCD00214039 |
| EC No. | N/A |
