Product Code : ST-Al/Ni-5N-Cu
Aluminum Nickel (Al/Ni) sputtering targets are widely used in physical vapor deposition (PVD) processes to deposit thin films of Al/Ni alloys on substrates. The combination of aluminum (Al) and nickel (Ni) provides an alloy material that exhibits exceptional strength, durability, and corrosion resistance. These films find applications in various industries, including semiconductors, electronics, and aerospace.
The manufacturing process for Al/Ni sputtering targets typically involves blending Al and Ni powders in the desired ratio and then pressing the mixture into a solid pellet using a hydraulic press. The pressed pellet is then sintered in a vacuum furnace to achieve the desired density and uniformity. The target can then be machined into the desired dimensions and mounted on a backing plate.
During sputtering, a high-energy plasma is generated in the sputtering chamber, and Al/Ni atoms are ejected from the target surface and deposited onto the substrate, forming a thin film. The resulting film's properties, including composition, thickness, and adhesion, can be tailored by controlling various parameters such as sputtering power, deposition time, and working gas.
Aluminum Nickel (Al/Ni) sputtering targets are suitable for depositing films on substrates with high uniformity, purity, and adhesion. The thin films formed using these targets exhibit exceptional properties, including high corrosion resistance, high hardness, and excellent mechanical strength. As a result, these films find applications in semiconductors, electronics, and even biomedical devices as well as in decorative coatings and architectural glass.
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Product Information
Aluminum Nickel (Al/Ni) sputtering targets are widely used in physical vapor deposition (PVD) processes to deposit thin films of Al/Ni alloys on substrates. The combination of aluminum (Al) and nickel (Ni) provides an alloy material that exhibits exceptional strength, durability, and corrosion resistance. These films find applications in various industries, including semiconductors, electronics, and aerospace.
The manufacturing process for Al/Ni sputtering targets typically involves blending Al and Ni powders in the desired ratio and then pressing the mixture into a solid pellet using a hydraulic press. The pressed pellet is then sintered in a vacuum furnace to achieve the desired density and uniformity. The target can then be machined into the desired dimensions and mounted on a backing plate.
During sputtering, a high-energy plasma is generated in the sputtering chamber, and Al/Ni atoms are ejected from the target surface and deposited onto the substrate, forming a thin film. The resulting film's properties, including composition, thickness, and adhesion, can be tailored by controlling various parameters such as sputtering power, deposition time, and working gas.
Aluminum Nickel (Al/Ni) sputtering targets are suitable for depositing films on substrates with high uniformity, purity, and adhesion. The thin films formed using these targets exhibit exceptional properties, including high corrosion resistance, high hardness, and excellent mechanical strength. As a result, these films find applications in semiconductors, electronics, and even biomedical devices as well as in decorative coatings and architectural glass.
Chemical Formula:Al/Ni
Aluminum Nickel (Al/Ni) Sputtering Target Specification
Shape: Disc/Rectangular/Tube
Bonding: Unbonding/Bonding
Per your request or drawing
We can customized as required
Size：
| Circular Sputtering Targets | Diameter | 1.0”2.0”3.0”4.0”5.0”6.0”up to 21” |
| Rectangular Sputtering Targets | Width x Length | 5” x 12”5” x 15”5” x 20”5” x 22”6” x 20” |
| Thickness | 0.125”, 0.25” | |
Sputtering Targets Requirements
General requirements such as size, flatness, purity, impurity content, density, N/O/C/S, grain size, and defect control. Special requirements include surface roughness, resistance value, grain size uniformity, composition and tissue uniformity, magnetic conductivity, ultra-high density, ultra-fine grains, etc.
Application of Aluminum Nickel (Al/Ni)Sputtering Target
Aluminum Nickel (Al/Ni) Sputtering Target is mainly used in the electronics and information industry, glass coating field, wear-resistant materials, high-temperature corrosion resistance, high-grade decorative goods, and other industries.
Packing of Aluminum Nickel (Al/Ni) Sputtering Target
Standard Packing:
Typical bulk packaging includes palletized plastic 5 gallon/25 kg. pails, fiber and steel drums to 1 ton super sacks in full container (FCL) or truck load (T/L) quantities. Research and sample quantities and hygroscopic, oxidizing or other air sensitive materials may be packaged under argon or vacuum. Solutions are packaged in polypropylene, plastic or glass jars up to palletized 440 gallon liquid totes Special package is available on request.
ATTs Aluminum Nickel (Al/Ni)Sputtering Target is carefully handled to minimize damage during storage and transportation and to preserve the quality of our products in their original condition.
