Aluminum Nitride Sputtering Target, AlN

Product Information

Aluminum nitride sputtering target from ATT is a ceramic sputtering material with the formula AlN.

Aluminium, also called aluminum, is a chemical element that originated from the Latin name for alum, ‘alumen’ meaningbitter salt. It was first mentioned in 1825 and observed by H.C.Ørsted. The isolation was later accomplished and announced by H.C.Ørsted. “Al” is the canonical chemical symbol of aluminium. Its atomic number in the periodic table of elements is 13 with a location at Period 3 and Group 13, belonging to the p-block. The relative atomic mass of aluminium is 26.9815386(8) Dalton, the number in the brackets indicating the uncertainty.

Nitrogen is a chemical element that originated from the Greek ‘nitron’ and ‘genes’ meaning nitre-forming. It was first mentioned in 1772 and observed by D. Rutherford. The isolation was later accomplished and announced by D. Rutherford. “N” is the canonical chemical symbol of nitrogen. Its atomic number in the periodic table of elements is 7 with a location at Period 2 and Group 15, belonging to the p-block. The relative atomic mass of nitrogen is 14.0067(2) Dalton, the number in the brackets indicating the uncertainty.

ATT provides high-quality Aluminum nitride Sputtering Target for research and industry purposes at competitive prices. We can provide Aluminum nitride Sputtering Target with different purity, size, and density according to your requirements.

Chemical Formula: AlN
CAS Number: 24304-00-5

Synonyms

Alumina; aluminium oxide; aluminum(III) oxide; aluminium(III) oxide; aloxide; aloxite; alundum; oxo-oxoalumanyloxy-alumane, sapphire; corundum; aluminum trioxide; alumina ceramic; alpha-Corundum; bauxite; Electrocorundum; keto-ketoalumanyloxy-alumane; α-Al2O3; α alumina; alpha alumina

Aluminum Nitride Sputtering Target Specification

Size：

Shape: Disc/Rectangular/Tube

Bonding: Unbonding/Bonding

Per your request or drawing

We can customized as required

Properties（Theoretical）

Sputtering Targets Requirements

General requirements such as size, flatness, purity, impurity content, density, N/O/C/S, grain size, and defect control. Special requirements include surface roughness, resistance value, grain size uniformity, composition and tissue uniformity, magnetic conductivity, ultra-high density, ultra-fine grains, etc.

Application of Aluminum Nitride Sputtering Target

Aluminum Nitride Sputtering Target can be used in semiconductor, chemical vapor deposition (CVD), physical vapor deposition (PVD) display, and optical applications.

Packing of  Aluminum Nitride Sputtering Target

Standard Packing:

Typical bulk packaging includes palletized plastic 5 gallon/25 kg. pails, fiber and steel drums to 1 ton super sacks in full container (FCL) or truck load (T/L) quantities. Research and sample quantities and hygroscopic, oxidizing or other air sensitive materials may be packaged under argon or vacuum. Solutions are packaged in polypropylene, plastic or glass jars up to palletized 440 gallon liquid totes Special package is available on request.

ATTs’ Aluminum Nitride Sputtering Target is carefully handled to minimize damage during storage and transportation and to preserve the quality of our products in their original condition.

Chemical Identifiers