Product Code : ST-Al/Sc-5N-Cu
Aluminum Scandium (Al/Sc) sputtering targets are extensively used in Physical Vapor Deposition (PVD) processes to deposit thin films of Al/Sc alloys on substrates. Aluminum (Al) and Scandium (Sc) are combined to produce ultralight and high-strength materials that provide unique properties such as high ductility, high-temperature resistance, and excellent mechanical properties. Films deposited using Al/Sc sputtering targets are widely used in aerospace, automotive, and other high-performance applications.
The manufacturing of Al/Sc sputtering targets involves blending Al and Sc powders in the desired ratio and pressing the resultant mixture into a compact. The pressed compact is then sintered to form a dense, homogeneous target. The process of sintering includes heating the compact in a vacuum to produce a solid rod or plate of the desired size and thickness, followed by precision machining to meet the specific dimensions and tolerances required for the sputtering process.
The sputtering of Al/Sc sputtering targets is carried out in a sputtering chamber, where a plasma is generated using argon gas. High-energy positive ions in the plasma are bombarded onto the surface of the target, dislodging atoms of Al/Sc, which then deposit onto the substrate, forming a thin film. The parameters used in the sputtering process can be adjusted to control the composition, thickness, and other material properties of the deposited film.
Aluminum Scandium (Al/Sc) sputtering targets are highly suitable for deposition onto substrates to create thin films with ultra-high-strength, ductility, and high-temperature resistance. They are widely used in various aerospace and automotive applications, particularly as structural and wear-resistant coatings and in the production of high-performance electronic devices such as thin-film transistors and photovoltaics.
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Product Information
Aluminum Scandium (Al/Sc) sputtering targets are extensively used in Physical Vapor Deposition (PVD) processes to deposit thin films of Al/Sc alloys on substrates. Aluminum (Al) and Scandium (Sc) are combined to produce ultralight and high-strength materials that provide unique properties such as high ductility, high-temperature resistance, and excellent mechanical properties. Films deposited using Al/Sc sputtering targets are widely used in aerospace, automotive, and other high-performance applications.
The manufacturing of Al/Sc sputtering targets involves blending Al and Sc powders in the desired ratio and pressing the resultant mixture into a compact. The pressed compact is then sintered to form a dense, homogeneous target. The process of sintering includes heating the compact in a vacuum to produce a solid rod or plate of the desired size and thickness, followed by precision machining to meet the specific dimensions and tolerances required for the sputtering process.
The sputtering of Al/Sc sputtering targets is carried out in a sputtering chamber, where a plasma is generated using argon gas. High-energy positive ions in the plasma are bombarded onto the surface of the target, dislodging atoms of Al/Sc, which then deposit onto the substrate, forming a thin film. The parameters used in the sputtering process can be adjusted to control the composition, thickness, and other material properties of the deposited film.
Aluminum Scandium (Al/Sc) sputtering targets are highly suitable for deposition onto substrates to create thin films with ultra-high-strength, ductility, and high-temperature resistance. They are widely used in various aerospace and automotive applications, particularly as structural and wear-resistant coatings and in the production of high-performance electronic devices such as thin-film transistors and photovoltaics.
Chemical Formula:Al/Sc
CAS Number: 113413-85-7
Synonyms
Scandium Aluminum Sputtering Target
Aluminum Scandium (Al/Sc) Sputtering Target Specification
Shape: Disc/Rectangular/Tube
Bonding: Unbonding/Bonding
Per your request or drawing
We can customized as required
Size：
| Circular Sputtering Targets | Diameter | 1.0”2.0”3.0”4.0”5.0”6.0”up to 21” |
| Rectangular Sputtering Targets | Width x Length | 5” x 12”5” x 15”5” x 20”5” x 22”6” x 20” |
| Thickness | 0.125”, 0.25” | |
Sputtering Targets Requirements
General requirements such as size, flatness, purity, impurity content, density, N/O/C/S, grain size, and defect control. Special requirements include surface roughness, resistance value, grain size uniformity, composition and tissue uniformity, magnetic conductivity, ultra-high density, ultra-fine grains, etc.
Application of Aluminum Scandium (Al/Sc) Sputtering Target
Aluminum Scandium (Al/Sc) Sputtering Target is mainly used in the electronics and information industry, glass coating field, wear-resistant materials, high-temperature corrosion resistance, high-grade decorative goods, and other industries.
Packing of Aluminum Scandium (Al/Sc) Sputtering Target
Standard Packing:
Typical bulk packaging includes palletized plastic 5 gallon/25 kg. pails, fiber and steel drums to 1 ton super sacks in full container (FCL) or truck load (T/L) quantities. Research and sample quantities and hygroscopic, oxidizing or other air sensitive materials may be packaged under argon or vacuum. Solutions are packaged in polypropylene, plastic or glass jars up to palletized 440 gallon liquid totes Special package is available on request.
ATTs Aluminum Scandium (Al/Sc) Sputtering Target is carefully handled to minimize damage during storage and transportation and to preserve the quality of our products in their original condition.
