Product Code : ST-Al/Si/Cu-5N-Cu
Aluminum Silicon Copper (Al/Si/Cu) sputtering target is a material used in the process of physical vapor deposition (PVD) to create a thin film of Al/Si/Cu on a substrate, typically for semiconductor and electrical applications.
The Al/Si/Cu sputtering target is made by combining the three elements in the appropriate ratio and melting them together in a furnace. The resulting ingot is then processed into a cylindrical shape and machined to the desired dimensions.
During the sputtering process, ions are accelerated toward the target material and collide with it, causing atoms to be ejected and deposited onto the substrate. The thin film created by sputtering is highly uniform and can be precisely controlled.
Al/Si/Cu sputtering targets are commonly used to create thin films for electrical components such as interconnects, contacts, and wiring. The addition of silicon and copper improves the physical and electrical properties of the aluminum and enhances adhesion to the substrate.
Overall, Al/Si/Cu sputtering targets are a critical component in the production of high-quality electrical and semiconductor devices.
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Product Information
Aluminum Silicon Copper (Al/Si/Cu) sputtering target is a material used in the process of physical vapor deposition (PVD) to create a thin film of Al/Si/Cu on a substrate, typically for semiconductor and electrical applications.
The Al/Si/Cu sputtering target is made by combining the three elements in the appropriate ratio and melting them together in a furnace. The resulting ingot is then processed into a cylindrical shape and machined to the desired dimensions.
During the sputtering process, ions are accelerated toward the target material and collide with it, causing atoms to be ejected and deposited onto the substrate. The thin film created by sputtering is highly uniform and can be precisely controlled.
Al/Si/Cu sputtering targets are commonly used to create thin films for electrical components such as interconnects, contacts, and wiring. The addition of silicon and copper improves the physical and electrical properties of the aluminum and enhances adhesion to the substrate.
Overall, Al/Si/Cu sputtering targets are a critical component in the production of high-quality electrical and semiconductor devices.
Chemical Formula:Al/Si/Cu
Aluminum Silicon Copper (Al/Si/Cu) Sputtering Target Specification
Shape: Disc/Rectangular/Tube
Bonding: Unbonding/Bonding
Per your request or drawing
We can customized as required
Size：
| Circular Sputtering Targets | Diameter | 1.0”2.0”3.0”4.0”5.0”6.0”up to 21” |
| Rectangular Sputtering Targets | Width x Length | 5” x 12”5” x 15”5” x 20”5” x 22”6” x 20” |
| Thickness | 0.125”, 0.25” | |
Sputtering Targets Requirements
General requirements such as size, flatness, purity, impurity content, density, N/O/C/S, grain size, and defect control. Special requirements include surface roughness, resistance value, grain size uniformity, composition and tissue uniformity, magnetic conductivity, ultra-high density, ultra-fine grains, etc.
Application of Aluminum Silicon Copper (Al/Si/Cu) Sputtering Target
Aluminum Silicon Copper (Al/Si/Cu) Sputtering Target is mainly used in the electronics and information industry, glass coating field, wear-resistant materials, high-temperature corrosion resistance, high-grade decorative goods, and other industries.
Packing of Aluminum Silicon Copper (Al/Si/Cu) Sputtering Target
Standard Packing:
Typical bulk packaging includes palletized plastic 5 gallon/25 kg. pails, fiber and steel drums to 1 ton super sacks in full container (FCL) or truck load (T/L) quantities. Research and sample quantities and hygroscopic, oxidizing or other air sensitive materials may be packaged under argon or vacuum. Solutions are packaged in polypropylene, plastic or glass jars up to palletized 440 gallon liquid totes Special package is available on request.
ATTs Aluminum Silicon Copper (Al/Si/Cu) Sputtering Target is carefully handled to minimize damage during storage and transportation and to preserve the quality of our products in their original condition.
