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Aluminum Titanium (Al/Ti) Sputtering Target

Product Code : ST-Al/Ti-5N-Cu

Aluminum Titanium (Al/Ti) is a sputtering target material used in the process of physical vapor deposition (PVD) to produce thin films for a variety of applications. The Al/Ti sputtering target is made by melting the two metals together in an appropriate ratio and casting them into a cylindrical shape. The resulting ingot is then processed into the desired dimensions for use in the sputtering process.

During sputtering, high-energy ions are accelerated towards the Al/Ti sputtering target, causing atoms to be ejected and deposited onto a substrate surface. This process creates a thin film that can be precisely controlled and uniform in thickness. The Al/Ti thin film has excellent adhesion to a variety of substrates, making it useful for a wide range of applications.

Al/Ti thin films are used in the production of electronic components such as capacitors, resistors, and integrated circuits. The material's combination of low resistivity, excellent adhesion, and high stability makes it an excellent choice for these applications. Al/Ti sputtering targets are also used to produce decorative coatings on a variety of consumer products such as watches, eyeglass frames, and jewelry.

Overall, Aluminum Titanium sputtering targets are important in the production of high-quality thin films for a wide range of critical applications in various industries.


Please contact us if you need customized services. We will contact you with the price and availability in 24 hours.

Product Product Code Purity Size Contact Us
Aluminum Titanium (Al/Ti) Sputtering Target ST-Al/Ti-2N-Cu 99% Customize
Aluminum Titanium (Al/Ti) Sputtering Target ST-Al/Ti-3N-Cu 99.9% Customize
Aluminum Titanium (Al/Ti) Sputtering Target ST-Al/Ti-4N-Cu 99.99% Customize
Aluminum Titanium (Al/Ti) Sputtering Target ST-Al/Ti-5N-Cu 99.999% Customize

Product Information

Aluminum Titanium (Al/Ti) is a sputtering target material used in the process of physical vapor deposition (PVD) to produce thin films for a variety of applications. The Al/Ti sputtering target is made by melting the two metals together in an appropriate ratio and casting them into a cylindrical shape. The resulting ingot is then processed into the desired dimensions for use in the sputtering process.

During sputtering, high-energy ions are accelerated towards the Al/Ti sputtering target, causing atoms to be ejected and deposited onto a substrate surface. This process creates a thin film that can be precisely controlled and uniform in thickness. The Al/Ti thin film has excellent adhesion to a variety of substrates, making it useful for a wide range of applications.

Al/Ti thin films are used in the production of electronic components such as capacitors, resistors, and integrated circuits. The material's combination of low resistivity, excellent adhesion, and high stability makes it an excellent choice for these applications. Al/Ti sputtering targets are also used to produce decorative coatings on a variety of consumer products such as watches, eyeglass frames, and jewelry.

Overall, Aluminum Titanium sputtering targets are important in the production of high-quality thin films for a wide range of critical applications in various industries.

Chemical Formula:Al/Ti

Aluminum Titanium (Al/Ti) Sputtering Target Specification

Shape: Disc/Rectangular/Tube

Bonding: Unbonding/Bonding

Per your request or drawing

We can customized as required

Size:

Circular   Sputtering TargetsDiameter1.0”2.0”3.0”4.0”5.0”6.0”up to 21”
Rectangular   Sputtering TargetsWidth x Length5” x 12”5” x 15”5” x 20”5” x 22”6” x 20”
Thickness0.125”, 0.25”



Sputtering Targets Requirements

General requirements such as size, flatness, purity, impurity content, density, N/O/C/S, grain size, and defect control. Special requirements include surface roughness, resistance value, grain size uniformity, composition and tissue uniformity, magnetic conductivity, ultra-high density, ultra-fine grains, etc.


Application of Aluminum Titanium (Al/Ti)  Sputtering Target

Aluminum Titanium (Al/Ti)  Sputtering Target is mainly used in the electronics and information industry, glass coating field, wear-resistant materials, high-temperature corrosion resistance, high-grade decorative goods, and other industries.


Packing of  Aluminum Titanium (Al/Ti) Sputtering Target

Standard Packing:

Typical bulk packaging includes palletized plastic 5 gallon/25 kg. pails, fiber and steel drums to 1 ton super sacks in full container (FCL) or truck load (T/L) quantities. Research and sample quantities and hygroscopic, oxidizing or other air sensitive materials may be packaged under argon or vacuum. Solutions are packaged in polypropylene, plastic or glass jars up to palletized 440 gallon liquid totes Special package is available on request.

ATTs Aluminum Titanium (Al/Ti) Sputtering Target is carefully handled to minimize damage during storage and transportation and to preserve the quality of our products in their original condition.


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