Product Code : ST-B-5N-Cu
Boron (B) sputtering targets are commonly used in physical vapor deposition (PVD) processes to deposit thin films of boron on a substrate. Boron is a chemical element with atomic number 5 and symbol B. It is a non-metallic material, typically found as a black, amorphous powder or a crystalline form.
Boron sputtering targets are typically made of high-purity boron (99.5% or higher) or boron carbide (B4C) powders. They are available in different shapes and sizes according to the specific requirements of the deposition process.
During the sputtering process, a stream of high-energy particles, typically argon ions, are directed towards the target. These ions bombard the surface of the target, causing atoms of boron to be ejected from the surface and to deposit onto the substrate to form a thin film. The properties of the resulting boron thin film can be controlled by varying the sputtering conditions such as gas pressure, power, and target-to-substrate distance.
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Product Information
Boron (B) sputtering targets are commonly used in physical vapor deposition (PVD) processes to deposit thin films of boron on a substrate. Boron is a chemical element with atomic number 5 and symbol B. It is a non-metallic material, typically found as a black, amorphous powder or a crystalline form.
Boron sputtering targets are typically made of high-purity boron (99.5% or higher) or boron carbide (B4C) powders. They are available in different shapes and sizes according to the specific requirements of the deposition process.
During the sputtering process, a stream of high-energy particles, typically argon ions, are directed towards the target. These ions bombard the surface of the target, causing atoms of boron to be ejected from the surface and to deposit onto the substrate to form a thin film. The properties of the resulting boron thin film can be controlled by varying the sputtering conditions such as gas pressure, power, and target-to-substrate distance.
Chemical Formula: B
CAS Number: 7440-42-8
Synonyms
N/A
Boron (B) Sputtering Target Specification
Shape: Disc/Rectangular/Tube
Bonding: Unbonding/Bonding
Per your request or drawing
We can customized as required
Size：
| Circular Sputtering Targets | Diameter | 1.0”2.0”3.0”4.0”5.0”6.0”up to 21” |
| Rectangular Sputtering Targets | Width x Length | 5” x 12”5” x 15”5” x 20”5” x 22”6” x 20” |
| Thickness | 0.125”, 0.25” | |
Properties（Theoretical）
| Molecular Weight | 10.811 |
| Appearance | Black/Brown |
| Melting Point | 2079 °C |
| Boiling Point | 2550 °C |
| Density | 2.34 cryst. g/cm3 |
| Solubility in H2O | N/A |
| Electrical Resistivity | 1.8 x 1012 microhm-cm @ 0 °C |
| Electronegativity | 2.0 Paulings |
| Heat of Vaporization | 128 K-Cal/gm atom at 2550 °C |
| Poisson's Ratio | N/A |
| Specific Heat | 0.245 Cal/g/K @ 25 °C |
| Tensile Strength | N/A |
| Thermal Conductivity | 0.274 W/cm/K @ 298.2 K |
| Thermal Expansion | 5–7 µm·m-1·K-1 @ 25 °C |
| Vickers Hardness | N/A |
| Young's Modulus | N/A |
Sputtering Targets Requirements
General requirements such as size, flatness, purity, impurity content, density, N/O/C/S, grain size, and defect control. Special requirements include surface roughness, resistance value, grain size uniformity, composition and tissue uniformity, magnetic conductivity, ultra-high density, ultra-fine grains, etc.
Application of Boron (B) Sputtering Target
Boron (B) Sputtering Target is mainly used in the electronics and information industry, glass coating field, wear-resistant materials, high-temperature corrosion resistance, high-grade decorative goods, and other industries.
Packing of Boron (B) Sputtering Target
Standard Packing:
Typical bulk packaging includes palletized plastic 5 gallon/25 kg. pails, fiber and steel drums to 1 ton super sacks in full container (FCL) or truck load (T/L) quantities. Research and sample quantities and hygroscopic, oxidizing or other air sensitive materials may be packaged under argon or vacuum. Solutions are packaged in polypropylene, plastic or glass jars up to palletized 440 gallon liquid totes Special package is available on request.
ATTs’Boron (B) Sputtering Target is carefully handled to minimize damage during storage and transportation and to preserve the quality of our products in their original condition.
Chemical Identifiers
| Linear Formula | B |
| MDL Number | MFCD00134034 |
| EC No. | 231-151-2 |
| Beilstein/Reaxys No. | N/A |
| Pubchem CID | 5462311 |
| SMILES | [B] |
| InchI Identifier | InChI=1S/B |
| InchI Key | ZOXJGFHDIHLPTG-UHFFFAOYSA-N |
