Product Code : ST-B4C-5N-Cu
Boron Carbide (B4C) sputtering target is an advanced material used in thin film coatings for a wide range of industrial applications. It is a compound of boron and carbon, known for its high hardness, wear-resistance, and thermal stability.
In sputtering, a cathode made of B4C material is bombarded by ions, causing the release of boron and carbon atoms. These atoms then deposit on a substrate placed in front of the target, forming a thin film coating. The B4C sputtering target is used in the production of wear-resistant coatings, magnetic storage devices, and optical coatings.
The B4C sputtering target is available in various sizes and shapes, including round, rectangular, and custom shapes, to meet the specific requirements of different manufacturing processes. Its high purity and uniformity ensure consistent and reliable deposition of the desired coatings.
Boron Carbide (B4C) sputtering targets are used in various fields such as defence, aerospace, nuclear, medical industries, and many others. It has low density, high strength, and excellent mechanical properties making it ideal for manufacturing cutting tools, nozzles, and armors at the microscopic and macroscopic level.
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Product Information
Boron Carbide (B4C) sputtering target is an advanced material used in thin film coatings for a wide range of industrial applications. It is a compound of boron and carbon, known for its high hardness, wear-resistance, and thermal stability.
In sputtering, a cathode made of B4C material is bombarded by ions, causing the release of boron and carbon atoms. These atoms then deposit on a substrate placed in front of the target, forming a thin film coating. The B4C sputtering target is used in the production of wear-resistant coatings, magnetic storage devices, and optical coatings.
The B4C sputtering target is available in various sizes and shapes, including round, rectangular, and custom shapes, to meet the specific requirements of different manufacturing processes. Its high purity and uniformity ensure consistent and reliable deposition of the desired coatings.
Boron Carbide (B4C) sputtering targets are used in various fields such as defence, aerospace, nuclear, medical industries, and many others. It has low density, high strength, and excellent mechanical properties making it ideal for manufacturing cutting tools, nozzles, and armors at the microscopic and macroscopic level.
Chemical Formula: B4C
CAS Number: 12069-32-8
Synonyms
BC, Tetrabor, carbon tetrabromide, black diamond, boron-carbon refractory ceramic
Boron Carbide (B4C) Sputtering Target Specification
Shape: Disc/Rectangular/Tube
Bonding: Unbonding/Bonding
Per your request or drawing
We can customized as required
Size：
| Circular Sputtering Targets | Diameter | 1.0”2.0”3.0”4.0”5.0”6.0”up to 21” |
| Rectangular Sputtering Targets | Width x Length | 5” x 12”5” x 15”5” x 20”5” x 22”6” x 20” |
| Thickness | 0.125”, 0.25” | |
Properties（Theoretical）
| Compound Formula | CB4 |
| Molecular Weight | 55.26 |
| Appearance | Gray/black solid |
| Melting Point | N/A |
| Boiling Point | N/A |
| Density | ~2.5 g/cm3 |
| Solubility in H2O | N/A |
| Electrical Resistivity | 1.0 ω-cm |
| Poisson's Ratio | 0.17-0.18 |
| Specific Heat | 0.94 J/g·°C |
| Thermal Conductivity | 90 W/m·K |
| Thermal Expansion | 4.50-5.60 µm/m·°C (25-500 °C) |
| Vickers Hardness | 26 MPa |
| Exact Mass | 56.037222 |
| Monoisotopic Mass | 56.037222 |
Sputtering Targets Requirements
General requirements such as size, flatness, purity, impurity content, density, N/O/C/S, grain size, and defect control. Special requirements include surface roughness, resistance value, grain size uniformity, composition and tissue uniformity, magnetic conductivity, ultra-high density, ultra-fine grains, etc.
Application of Boron Carbide (B4C)Sputtering Target
Boron Carbide (B4C) Sputtering Target is mainly used in the electronics and information industry, glass coating field, wear-resistant materials, high-temperature corrosion resistance, high-grade decorative goods, and other industries.
Packing of Boron Carbide (B4C)Sputtering Target
Standard Packing:
Typical bulk packaging includes palletized plastic 5 gallon/25 kg. pails, fiber and steel drums to 1 ton super sacks in full container (FCL) or truck load (T/L) quantities. Research and sample quantities and hygroscopic, oxidizing or other air sensitive materials may be packaged under argon or vacuum. Solutions are packaged in polypropylene, plastic or glass jars up to palletized 440 gallon liquid totes Special package is available on request.
ATTs’Boron Carbide (B4C) Sputtering Target is carefully handled to minimize damage during storage and transportation and to preserve the quality of our products in their original condition.
Chemical Identifiers
| Linear Formula | B4C |
| MDL Number | MFCD00011520 |
| EC No. | 235-111-5 |
| Beilstein/Reaxys No. | N/A |
| Pubchem CID | 123279 |
| IUPAC Name | N/A |
| SMILES | B12B3B4B1C234 |
| InchI Identifier | InChI=1S/CB4/c2-1-3(2)5(1)4(1)2 |
| InchI Key | INAHAJYZKVIDIZ-UHFFFAOYSA-N |
