Product Code : ST-Cd-7N-Cu
Cadmium is a widely used material in sputtering targets and can be used to create protective coatings, optoelectronic films, and thin-film transistors. The sputtering target is made up of a disc-shaped disk of a material used in sputtering. The target material is metallically bonded to a conductive backing plate and can be used in any type of sputtering system. Generally, cadmium sputtering targets are composed of a high-purity single-element material or an alloy. The high-purity material optimizes thermal stability and performance of the target. The target substrate can be copper, molybdenum, or other metals. Due to its unique characteristic, cadmium is the most common element used in sputtering targets, but other materials, such as zinc, indium, and carbon, can also be used.
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Product Information
Cadmium is a widely used material in sputtering targets and can be used to create protective coatings, optoelectronic films, and thin-film transistors. The sputtering target is made up of a disc-shaped disk of a material used in sputtering. The target material is metallically bonded to a conductive backing plate and can be used in any type of sputtering system. Generally, cadmium sputtering targets are composed of a high-purity single-element material or an alloy. The high-purity material optimizes thermal stability and performance of the target. The target substrate can be copper, molybdenum, or other metals. Due to its unique characteristic, cadmium is the most common element used in sputtering targets, but other materials, such as zinc, indium, and carbon, can also be used.
Chemical Formula:Cd
CAS Number: 7440-43-9
Cadmium (Cd) Sputtering Target Specification
Shape: Disc/Rectangular/Tube
Bonding: Unbonding/Bonding
Per your request or drawing
We can customized as required
Size:
Circular Sputtering Targets | Diameter | 1.0”2.0”3.0”4.0”5.0”6.0”up to 21” |
Rectangular Sputtering Targets | Width x Length | 5” x 12”5” x 15”5” x 20”5” x 22”6” x 20” |
Thickness | 0.125”, 0.25” |
Properties(Theoretical)
Molecular Weight | 112.41 |
Appearance | Silvery bluish-gray solid |
Melting Point | 321 °C |
Boiling Point | 767 °C |
Density | 8.65 g/cm3 |
Solubility in H2O | N/A |
Electrical Resistivity | 7.27 μΩ-cm (22 °C) |
Electronegativity | 1.69 Paulings |
Heat of Fusion | 6.21 kJ/mol |
Heat of Vaporization | 99.87 kJ/mol |
Poisson's Ratio | 0.30 |
Specific Heat | 0.231 kJ/kg·°K (25 °C) |
Thermal Conductivity | 96.6 W/(m·K) |
Thermal Expansion | 30.8 µm/(m·K) (25 °C) |
Young's Modulus | 50 GPa |
Sputtering Targets Requirements
General requirements such as size, flatness, purity, impurity content, density, N/O/C/S, grain size, and defect control. Special requirements include surface roughness, resistance value, grain size uniformity, composition and tissue uniformity, magnetic conductivity, ultra-high density, ultra-fine grains, etc.
Application of Cadmium (Cd) Sputtering Target
Cadmium (Cd) Sputtering Target is mainly used in the electronics and information industry, glass coating field, wear-resistant materials, high-temperature corrosion resistance, high-grade decorative goods, and other industries.
Packing of Cadmium (Cd) Sputtering Target
Standard Packing:
Typical bulk packaging includes palletized plastic 5 gallon/25 kg. pails, fiber and steel drums to 1 ton super sacks in full container (FCL) or truck load (T/L) quantities. Research and sample quantities and hygroscopic, oxidizing or other air sensitive materials may be packaged under argon or vacuum. Solutions are packaged in polypropylene, plastic or glass jars up to palletized 440 gallon liquid totes Special package is available on request.
ATTs’Cadmium (Cd) Sputtering Target is carefully handled to minimize damage during storage and transportation and to preserve the quality of our products in their original condition.
Chemical Identifiers
Linear Formula | Cd |
MDL Number | MFCD00010914 |
EC No. | 231-152-8 |
Beilstein/Reaxys No. | 8137359 |
Pubchem CID | 23973 |
SMILES | [Cd] |
InchI Identifier | InChI=1S/Cd |
InchI Key | BDOSMKKIYDKNTQ-UHFFFAOYSA-N |