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Cadmium (Cd) Sputtering Target

Product Code : ST-Cd-7N-Cu

Cadmium is a widely used material in sputtering targets and can be used to create protective coatings, optoelectronic films, and thin-film transistors. The sputtering target is made up of a disc-shaped disk of a material used in sputtering. The target material is metallically bonded to a conductive backing plate and can be used in any type of sputtering system. Generally, cadmium sputtering targets are composed of a high-purity single-element material or an alloy. The high-purity material optimizes thermal stability and performance of the target. The target substrate can be copper, molybdenum, or other metals. Due to its unique characteristic, cadmium is the most common element used in sputtering targets, but other materials, such as zinc, indium, and carbon, can also be used.

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Product Product Code Purity Size Contact Us
Cadmium (Cd) Sputtering TargetST-Cd-2N-Cu 99%Customize
Cadmium (Cd) Sputtering TargetST-Cd-4N-Cu 99.99%Customize
Cadmium (Cd) Sputtering TargetST-Cd-6N-Cu 99.9999%Customize
Cadmium (Cd) Sputtering TargetST-Cd-7N-Cu 99.99999%Customize

Product Information

Cadmium is a widely used material in sputtering targets and can be used to create protective coatings, optoelectronic films, and thin-film transistors. The sputtering target is made up of a disc-shaped disk of a material used in sputtering. The target material is metallically bonded to a conductive backing plate and can be used in any type of sputtering system. Generally, cadmium sputtering targets are composed of a high-purity single-element material or an alloy. The high-purity material optimizes thermal stability and performance of the target. The target substrate can be copper, molybdenum, or other metals. Due to its unique characteristic, cadmium is the most common element used in sputtering targets, but other materials, such as zinc, indium, and carbon, can also be used.

Chemical Formula:Cd
CAS Number:  7440-43-9


Cadmium (Cd) Sputtering Target Specification

Shape: Disc/Rectangular/Tube

Bonding: Unbonding/Bonding

Per your request or drawing

We can customized as required

Size:

Circular   Sputtering TargetsDiameter1.0”2.0”3.0”4.0”5.0”6.0”up to 21”
Rectangular   Sputtering TargetsWidth x Length5” x 12”5” x 15”5” x 20”5” x 22”6” x 20”
Thickness0.125”, 0.25”


Properties(Theoretical)

Molecular Weight112.41
AppearanceSilvery bluish-gray solid
Melting Point321 °C
Boiling Point767 °C
Density8.65 g/cm3
Solubility in H2ON/A
Electrical Resistivity7.27 μΩ-cm (22 °C)
Electronegativity1.69 Paulings
Heat of Fusion6.21 kJ/mol
Heat of Vaporization99.87 kJ/mol
Poisson's Ratio0.30
Specific Heat0.231 kJ/kg·°K (25 °C)
Thermal Conductivity96.6 W/(m·K)
Thermal Expansion30.8 µm/(m·K) (25 °C)
Young's Modulus50 GPa




Sputtering Targets Requirements

General requirements such as size, flatness, purity, impurity content, density, N/O/C/S, grain size, and defect control. Special requirements include surface roughness, resistance value, grain size uniformity, composition and tissue uniformity, magnetic conductivity, ultra-high density, ultra-fine grains, etc.


Application of Cadmium (Cd) Sputtering Target

Cadmium (Cd) Sputtering Target is mainly used in the electronics and information industry, glass coating field, wear-resistant materials, high-temperature corrosion resistance, high-grade decorative goods, and other industries.


Packing of  Cadmium (Cd) Sputtering Target

Standard Packing:

Typical bulk packaging includes palletized plastic 5 gallon/25 kg. pails, fiber and steel drums to 1 ton super sacks in full container (FCL) or truck load (T/L) quantities. Research and sample quantities and hygroscopic, oxidizing or other air sensitive materials may be packaged under argon or vacuum. Solutions are packaged in polypropylene, plastic or glass jars up to palletized 440 gallon liquid totes Special package is available on request.

ATTs’Cadmium (Cd) Sputtering Target is carefully handled to minimize damage during storage and transportation and to preserve the quality of our products in their original condition.



Chemical Identifiers

Linear FormulaCd
MDL NumberMFCD00010914
EC No.231-152-8
Beilstein/Reaxys No.8137359
Pubchem CID23973
SMILES[Cd]
InchI IdentifierInChI=1S/Cd
InchI KeyBDOSMKKIYDKNTQ-UHFFFAOYSA-N




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