Product Code : ST-Cr/Cu-5N-Cu
Chromium Copper (Cr/Cu) sputtering targets are a type of material commonly used for thin-film deposition in various electronic and optical applications. They are made by combining chromium and copper, with specific ratios of each element depending on the desired properties of the resulting thin films.
The sputtering process involves bombarding the target material with a stream of high-energy ions, such as argon ions. The ions knock atoms from the surface of the target, which then deposit onto a substrate, forming a thin film.
The advantages of chromium-copper alloy targets include high electrical conductivity, excellent resistance to corrosion and wear, and good adhesion to substrates. As such, Cr/Cu targets are used in various applications such as data storage, sensors, photovoltaic cells, and flat panel displays. They have high thermal stability and good surface flatness, which is very important in applications that require high surface quality such as optical coatings and semiconductors.
Cr/Cu sputtering targets are usually produced by using a powder metallurgy process in which the chromium and copper powders are mixed and pressed into a solid disc or shaped in a mold using various processes. The resulting disk-shaped or cylindrical targets are then sintered at elevated temperatures to achieve compactness and high structural integrity.
Overall, Cr/Cu sputtering targets are a critical component in the manufacturing of advanced electronics and optics, providing exceptional electrical and material properties for high-quality thin-film coatings.
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Product Information
Chromium Copper (Cr/Cu) sputtering targets are a type of material commonly used for thin-film deposition in various electronic and optical applications. They are made by combining chromium and copper, with specific ratios of each element depending on the desired properties of the resulting thin films.
The sputtering process involves bombarding the target material with a stream of high-energy ions, such as argon ions. The ions knock atoms from the surface of the target, which then deposit onto a substrate, forming a thin film.
Chemical Formula:Cr/Cu
Chromium Copper (Cr/Cu) Sputtering Target Specification
Shape: Disc/Rectangular/Tube
Bonding: Unbonding/Bonding
Per your request or drawing
We can customized as required
Size：
| Circular Sputtering Targets | Diameter | 1.0”2.0”3.0”4.0”5.0”6.0”up to 21” |
| Rectangular Sputtering Targets | Width x Length | 5” x 12”5” x 15”5” x 20”5” x 22”6” x 20” |
| Thickness | 0.125”, 0.25” | |
Sputtering Targets Requirements
General requirements such as size, flatness, purity, impurity content, density, N/O/C/S, grain size, and defect control. Special requirements include surface roughness, resistance value, grain size uniformity, composition and tissue uniformity, magnetic conductivity, ultra-high density, ultra-fine grains, etc.
Application of Chromium Copper (Cr/Cu) Sputtering Target
Chromium Copper (Cr/Cu) Sputtering Target is mainly used in the electronics and information industry, glass coating field, wear-resistant materials, high-temperature corrosion resistance, high-grade decorative goods, and other industries.
Packing of Chromium Copper (Cr/Cu) Sputtering Target
Standard Packing:
Typical bulk packaging includes palletized plastic 5 gallon/25 kg. pails, fiber and steel drums to 1 ton super sacks in full container (FCL) or truck load (T/L) quantities. Research and sample quantities and hygroscopic, oxidizing or other air sensitive materials may be packaged under argon or vacuum. Solutions are packaged in polypropylene, plastic or glass jars up to palletized 440 gallon liquid totes Special package is available on request.
ATTs Chromium Copper (Cr/Cu) Sputtering Target is carefully handled to minimize damage during storage and transportation and to preserve the quality of our products in their original condition.
