Product Code : ST-Cu/Al-5N-Cu
A copper aluminum (Cu/Al) sputtering target is a high-quality material used in the sputtering process, which involves the release of particles from a solid target under bombardment with energetic ions for the deposition of thin films. It consists of a blend of copper and aluminum, which are compressed using high-pressure machinery to create a uniform, high-density disk. Cu/Al sputtering targets are typically used in the manufacturing of optoelectronic devices, solar cells, and decorative coatings.
The sputtering target has high thermal conductivity, making it suitable for use in deposition processes that require temperatures that are beyond the limits of other materials. It is also highly resistant to oxidation, exhibiting excellent stability in high-temperature environments. The target's high-density keeps the target material from being vaporized, ensuring long-lasting efficiency and reducing the number of replacements necessary.
The typical Cu/Al sputtering target is round with a diameter of around 150mm, although it can come in different shapes, sizes, and thicknesses, depending on the user’s particular application requirements. Its unique blend of physical and chemical properties makes it an ideal material for sputtering applications, delivering excellent quality and performance while also ensuring longer lifespan and durability.
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Product Information
A copper aluminum (Cu/Al) sputtering target is a high-quality material used in the sputtering process, which involves the release of particles from a solid target under bombardment with energetic ions for the deposition of thin films. It consists of a blend of copper and aluminum, which are compressed using high-pressure machinery to create a uniform, high-density disk. Cu/Al sputtering targets are typically used in the manufacturing of optoelectronic devices, solar cells, and decorative coatings.
The sputtering target has high thermal conductivity, making it suitable for use in deposition processes that require temperatures that are beyond the limits of other materials. It is also highly resistant to oxidation, exhibiting excellent stability in high-temperature environments. The target's high-density keeps the target material from being vaporized, ensuring long-lasting efficiency and reducing the number of replacements necessary.
The typical Cu/Al sputtering target is round with a diameter of around 150mm, although it can come in different shapes, sizes, and thicknesses, depending on the user’s particular application requirements. Its unique blend of physical and chemical properties makes it an ideal material for sputtering applications, delivering excellent quality and performance while also ensuring longer lifespan and durability.
Chemical Formula:Cu/Al
Scandium (Sc) Sputtering Target Specification
Shape: Disc/Rectangular/Tube
Bonding: Unbonding/Bonding
Per your request or drawing
We can customized as required
Size：
| Circular Sputtering Targets | Diameter | 1.0”2.0”3.0”4.0”5.0”6.0”up to 21” |
| Rectangular Sputtering Targets | Width x Length | 5” x 12”5” x 15”5” x 20”5” x 22”6” x 20” |
| Thickness | 0.125”, 0.25” | |
Sputtering Targets Requirements
General requirements such as size, flatness, purity, impurity content, density, N/O/C/S, grain size, and defect control. Special requirements include surface roughness, resistance value, grain size uniformity, composition and tissue uniformity, magnetic conductivity, ultra-high density, ultra-fine grains, etc.
Application of Copper Aluminum (Cu/Al) Sputtering Target
Copper Aluminum (Cu/Al) Sputtering Target is mainly used in the electronics and information industry, glass coating field, wear-resistant materials, high-temperature corrosion resistance, high-grade decorative goods, and other industries.
Packing of Copper Aluminum (Cu/Al) Sputtering Target
Standard Packing:
Typical bulk packaging includes palletized plastic 5 gallon/25 kg. pails, fiber and steel drums to 1 ton super sacks in full container (FCL) or truck load (T/L) quantities. Research and sample quantities and hygroscopic, oxidizing or other air sensitive materials may be packaged under argon or vacuum. Solutions are packaged in polypropylene, plastic or glass jars up to palletized 440 gallon liquid totes Special package is available on request.
ATTs’Copper Aluminum (Cu/Al) Sputtering Target is carefully handled to minimize damage during storage and transportation and to preserve the quality of our products in their original condition.
