Product Code : ST-CuAlO2-5N-Cu
Copper Aluminum Oxide (CuAlO2) sputtering targets are specialty materials used in the thin film deposition process for a wide range of electronic applications. CuAlO2 is a ternary oxide compound made up of copper, aluminum, and oxygen. CuAlO2 sputtering targets are made using high-purity copper, aluminum, and oxygen materials and are available in different shapes and sizes to meet specific application requirements.
CuAlO2 sputtering targets are used in the semiconductor industry for the fabrication of electronic devices such as thin-film transistors (TFTs), solar cells, and other electronic components. The sputtering process involves bombarding the CuAlO2 target with high-energy ions, which knock off the atoms present at the surface of the target. These atoms then travel to the substrate, where they condense and form a thin film layer.
CuAlO2 sputtering targets are designed to be highly uniform and dense, ensuring the deposited thin films have excellent mechanical and thermal properties. They are also compatible with various sputtering systems, including DC, RF, and magnetron sputtering, making them highly versatile and easy to use.
CuAlO2 sputtering targets are also used in various other applications, such as in corrosion-resistant coatings, thermal barrier coatings, and ceramic materials. They are available in different shapes, sizes, and purities, making them suitable for a wide range of applications.
In summary, CuAlO2 sputtering targets are essential materials used in the fabrication of various electronic components. They offer excellent properties such as high uniformity, density, and corrosion resistance, making them ideal for use in the semiconductor and other industries.
Please contact us if you need customized services. We will contact you with the price and availability in 24 hours.
Product | Product Code | Purity | Size | Contact Us |
Product Information
Copper Aluminum Oxide (CuAlO2) sputtering targets are specialty materials used in the thin film deposition process for a wide range of electronic applications. CuAlO2 is a ternary oxide compound made up of copper, aluminum, and oxygen. CuAlO2 sputtering targets are made using high-purity copper, aluminum, and oxygen materials and are available in different shapes and sizes to meet specific application requirements.
CuAlO2 sputtering targets are used in the semiconductor industry for the fabrication of electronic devices such as thin-film transistors (TFTs), solar cells, and other electronic components. The sputtering process involves bombarding the CuAlO2 target with high-energy ions, which knock off the atoms present at the surface of the target. These atoms then travel to the substrate, where they condense and form a thin film layer.
CuAlO2 sputtering targets are designed to be highly uniform and dense, ensuring the deposited thin films have excellent mechanical and thermal properties. They are also compatible with various sputtering systems, including DC, RF, and magnetron sputtering, making them highly versatile and easy to use.
CuAlO2 sputtering targets are also used in various other applications, such as in corrosion-resistant coatings, thermal barrier coatings, and ceramic materials. They are available in different shapes, sizes, and purities, making them suitable for a wide range of applications.
In summary, CuAlO2 sputtering targets are essential materials used in the fabrication of various electronic components. They offer excellent properties such as high uniformity, density, and corrosion resistance, making them ideal for use in the semiconductor and other industries.
Chemical Formula:CuAlO2
CAS Number: 12250-93-0
Synonyms
Copper Aluminum Oxide (CuAlO2) Sputtering Target Specification
Shape: Disc/Rectangular/Tube
Bonding: Unbonding/Bonding
Per your request or drawing
We can customized as required
Size:
Circular Sputtering Targets | Diameter | 1.0”2.0”3.0”4.0”5.0”6.0”up to 21” |
Rectangular Sputtering Targets | Width x Length | 5” x 12”5” x 15”5” x 20”5” x 22”6” x 20” |
Thickness | 0.125”, 0.25” |
Properties(Theoretical)
Compound Formula | CuAlO2 |
Molecular Weight | 122.53 |
Appearance | solid |
Melting Point | N/A |
Boiling Point | n1 |
Density | N/A |
Solubility in H2O | N/A |
Exact Mass | 121.900965 |
Monoisotopic Mass | 121.900965 |
Sputtering Targets Requirements
General requirements such as size, flatness, purity, impurity content, density, N/O/C/S, grain size, and defect control. Special requirements include surface roughness, resistance value, grain size uniformity, composition and tissue uniformity, magnetic conductivity, ultra-high density, ultra-fine grains, etc.
Application of Copper Aluminum Oxide (CuAlO2) Sputtering Target
Copper Aluminum Oxide (CuAlO2) Sputtering Target is mainly used in the electronics and information industry, glass coating field, wear-resistant materials, high-temperature corrosion resistance, high-grade decorative goods, and other industries.
Packing of Copper Aluminum Oxide (CuAlO2) Sputtering Target
Standard Packing:
Typical bulk packaging includes palletized plastic 5 gallon/25 kg. pails, fiber and steel drums to 1 ton super sacks in full container (FCL) or truck load (T/L) quantities. Research and sample quantities and hygroscopic, oxidizing or other air sensitive materials may be packaged under argon or vacuum. Solutions are packaged in polypropylene, plastic or glass jars up to palletized 440 gallon liquid totes Special package is available on request.
ATTs’Copper Aluminum Oxide (CuAlO2) Sputtering Target is carefully handled to minimize damage during storage and transportation and to preserve the quality of our products in their original condition.
Chemical Identifiers
Linear Formula | CuAlO2 |
MDL Number | N/A |
EC No. | 235-483-9 |
Beilstein/Reaxys No. | N/A |
Pubchem CID | 44146798 |
IUPAC Name | aluminum; copper(1+); oxygen(2-) |
SMILES | [O-2].[O-2].[Al+3].[Cu+] |
InchI Identifier | InChI=1S/Al.Cu.2O/q+3;+1;2*-2 |
InchI Key | ZGNMHLIUGNCQDY-UHFFFAOYSA-N |