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Copper Cobalt (Cu/Co) Sputtering Target

Product Code : ST-Cu/Co-5N-Cu

A copper cobalt (Cu/Co) sputtering target is a type of material used for thin film deposition during the manufacturing of various electronic and semiconductor devices. The target is made of a mixture of copper and cobalt and is designed to be bombarded with high-energy particles in a vacuum chamber during the sputtering process.

The sputtering process involves using a plasma to dislodge particles of the target material, which then deposit onto a substrate to form a thin film. Cu/Co sputtering targets are commonly used in the production of magnetic storage devices such as hard disk drives, as well as in other applications that require high-performance coatings with good adhesion and corrosion resistance.

The composition of the Cu/Co sputtering target can be adjusted to achieve different properties, such as varying ratios of copper to cobalt for specific magnetic properties. The target material can be produced using various manufacturing methods such as powder metallurgy, casting, and hot isostatic pressing, depending on the target specifications and desired properties.

Overall, Cu/Co sputtering targets are important materials in the semiconductor and electronics industry, supporting the development of advanced technologies that require precise and reliable thin films.


Please contact us if you need customized services. We will contact you with the price and availability in 24 hours.

Product Product Code Purity Size Contact Us
Copper Cobalt (Cu/Co) Sputtering Target ST-Cu/Co-2-Cu 99% Customize
Copper Cobalt (Cu/Co) Sputtering Target ST-Cu/Co-3N-Cu 99.9% Customize
Copper Cobalt (Cu/Co) Sputtering Target ST-Cu/Co-4N-Cu 99.99% Customize
Copper Cobalt (Cu/Co) Sputtering Target ST-Cu/Co-5N-Cu 99.999% Customize

Product Information

A copper cobalt (Cu/Co) sputtering target is a type of material used for thin film deposition during the manufacturing of various electronic and semiconductor devices. The target is made of a mixture of copper and cobalt and is designed to be bombarded with high-energy particles in a vacuum chamber during the sputtering process.

The sputtering process involves using a plasma to dislodge particles of the target material, which then deposit onto a substrate to form a thin film. Cu/Co sputtering targets are commonly used in the production of magnetic storage devices such as hard disk drives, as well as in other applications that require high-performance coatings with good adhesion and corrosion resistance.

The composition of the Cu/Co sputtering target can be adjusted to achieve different properties, such as varying ratios of copper to cobalt for specific magnetic properties. The target material can be produced using various manufacturing methods such as powder metallurgy, casting, and hot isostatic pressing, depending on the target specifications and desired properties.

Overall, Cu/Co sputtering targets are important materials in the semiconductor and electronics industry, supporting the development of advanced technologies that require precise and reliable thin films.

Chemical Formula:Cu/Co




Copper Cobalt (Cu/Co) Sputtering Target Specification

Shape: Disc/Rectangular/Tube

Bonding: Unbonding/Bonding

Per your request or drawing

We can customized as required

Size:

Circular   Sputtering TargetsDiameter1.0”2.0”3.0”4.0”5.0”6.0”up to 21”
Rectangular   Sputtering TargetsWidth x Length5” x 12”5” x 15”5” x 20”5” x 22”6” x 20”
Thickness0.125”, 0.25”



Sputtering Targets Requirements

General requirements such as size, flatness, purity, impurity content, density, N/O/C/S, grain size, and defect control. Special requirements include surface roughness, resistance value, grain size uniformity, composition and tissue uniformity, magnetic conductivity, ultra-high density, ultra-fine grains, etc.


Application of Copper Cobalt (Cu/Co) Sputtering Target

Copper Cobalt (Cu/Co) Sputtering Target is mainly used in the electronics and information industry, glass coating field, wear-resistant materials, high-temperature corrosion resistance, high-grade decorative goods, and other industries.


Packing of  Copper Cobalt (Cu/Co) Sputtering Target

Standard Packing:

Typical bulk packaging includes palletized plastic 5 gallon/25 kg. pails, fiber and steel drums to 1 ton super sacks in full container (FCL) or truck load (T/L) quantities. Research and sample quantities and hygroscopic, oxidizing or other air sensitive materials may be packaged under argon or vacuum. Solutions are packaged in polypropylene, plastic or glass jars up to palletized 440 gallon liquid totes Special package is available on request.

ATTs Copper Cobalt (Cu/Co) Sputtering Target is carefully handled to minimize damage during storage and transportation and to preserve the quality of our products in their original condition.


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