Product Code : ST-Cu/Ga-5N-Cu
A copper gallium (Cu/Ga) sputtering target is a type of material used in the process of thin film deposition. The target is typically made by melting and casting a mixture of copper and gallium into a circular disc, which is then mounted onto a sputtering gun in a vacuum chamber.
During the sputtering process, the target is bombarded with high-energy ions, which dislodge atoms and deposit them onto a substrate to form a thin film. The Cu/Ga sputtering target is used in the production of semiconductors, solar cells, and other electronic components.
The combination of copper and gallium ensures that the resulting thin films have excellent electrical conductivity, while also offering enhanced thermal stability and corrosion resistance. The precise ratio of copper to gallium can be adjusted to achieve specific characteristics, such as optical and electronic properties.
Cu/Ga sputtering targets are produced using various manufacturing techniques, including powder metallurgy, hot isostatic pressing, and casting. The choice of manufacturing method depends on the target specifications and desired properties.
Overall, Cu/Ga sputtering targets are valuable materials in the semiconductor industry, supporting the development of advanced electronic devices and technologies.
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Product Information
A copper gallium (Cu/Ga) sputtering target is a type of material used in the process of thin film deposition. The target is typically made by melting and casting a mixture of copper and gallium into a circular disc, which is then mounted onto a sputtering gun in a vacuum chamber.
During the sputtering process, the target is bombarded with high-energy ions, which dislodge atoms and deposit them onto a substrate to form a thin film. The Cu/Ga sputtering target is used in the production of semiconductors, solar cells, and other electronic components.
The combination of copper and gallium ensures that the resulting thin films have excellent electrical conductivity, while also offering enhanced thermal stability and corrosion resistance. The precise ratio of copper to gallium can be adjusted to achieve specific characteristics, such as optical and electronic properties.
Cu/Ga sputtering targets are produced using various manufacturing techniques, including powder metallurgy, hot isostatic pressing, and casting. The choice of manufacturing method depends on the target specifications and desired properties.
Overall, Cu/Ga sputtering targets are valuable materials in the semiconductor industry, supporting the development of advanced electronic devices and technologies.
Chemical Formula:Cu/Ga
CAS Number: 61869-53-2
Synonyms
Copper-gallium alloy sputtering target, GaCu, CuGa 95/5, 90/10 wt%
Copper Gallium (Cu/Ga) Sputtering Target Specification
Shape: Disc/Rectangular/Tube
Bonding: Unbonding/Bonding
Per your request or drawing
We can customized as required
Size:
Circular Sputtering Targets | Diameter | 1.0”2.0”3.0”4.0”5.0”6.0”up to 21” |
Rectangular Sputtering Targets | Width x Length | 5” x 12”5” x 15”5” x 20”5” x 22”6” x 20” |
Thickness | 0.125”, 0.25” |
Properties(Theoretical)
Compound Formula | CuGa |
Molecular Weight | 133.269 g/mol |
Appearance | Target |
Melting Point | N/A |
Boiling Point | N/A |
Density | N/A |
Solubility in H2O | N/A |
Monoisotopic Mass | 131.855 g/mol |
Sputtering Targets Requirements
General requirements such as size, flatness, purity, impurity content, density, N/O/C/S, grain size, and defect control. Special requirements include surface roughness, resistance value, grain size uniformity, composition and tissue uniformity, magnetic conductivity, ultra-high density, ultra-fine grains, etc.
Application of Copper Gallium (Cu/Ga)Sputtering Target
Copper Gallium (Cu/Ga) Sputtering Target is mainly used in the electronics and information industry, glass coating field, wear-resistant materials, high-temperature corrosion resistance, high-grade decorative goods, and other industries.
Packing of Copper Gallium (Cu/Ga) Sputtering Target
Standard Packing:
Typical bulk packaging includes palletized plastic 5 gallon/25 kg. pails, fiber and steel drums to 1 ton super sacks in full container (FCL) or truck load (T/L) quantities. Research and sample quantities and hygroscopic, oxidizing or other air sensitive materials may be packaged under argon or vacuum. Solutions are packaged in polypropylene, plastic or glass jars up to palletized 440 gallon liquid totes Special package is available on request.
ATTs Copper Gallium (Cu/Ga) Sputtering Target is carefully handled to minimize damage during storage and transportation and to preserve the quality of our products in their original condition.
Chemical Identifiers
Linear Formula | Cu-Ga |
MDL Number | N/A |
EC No. | N/A |
Pubchem CID | 78065764 |
IUPAC Name | copper; gallium |
SMILES | [Cu].[Ga] |
InchI Identifier | InChI=1S/Cu.Ga |
InchI Key | CDZGJSREWGPJMG-UHFFFAOYSA-N |