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Copper Gallium (Cu/Ga) Sputtering Target

Product Code : ST-Cu/Ga-5N-Cu

A copper gallium (Cu/Ga) sputtering target is a type of material used in the process of thin film deposition. The target is typically made by melting and casting a mixture of copper and gallium into a circular disc, which is then mounted onto a sputtering gun in a vacuum chamber.

During the sputtering process, the target is bombarded with high-energy ions, which dislodge atoms and deposit them onto a substrate to form a thin film. The Cu/Ga sputtering target is used in the production of semiconductors, solar cells, and other electronic components.

The combination of copper and gallium ensures that the resulting thin films have excellent electrical conductivity, while also offering enhanced thermal stability and corrosion resistance. The precise ratio of copper to gallium can be adjusted to achieve specific characteristics, such as optical and electronic properties.

Cu/Ga sputtering targets are produced using various manufacturing techniques, including powder metallurgy, hot isostatic pressing, and casting. The choice of manufacturing method depends on the target specifications and desired properties.

Overall, Cu/Ga sputtering targets are valuable materials in the semiconductor industry, supporting the development of advanced electronic devices and technologies.


Please contact us if you need customized services. We will contact you with the price and availability in 24 hours.

Product Product Code Purity Size Contact Us
Copper Gallium (Cu/Ga) Sputtering Target ST-Cu/Ga-2N-Cu 99% Customize
Copper Gallium (Cu/Ga) Sputtering Target ST-Cu/Ga-3N-Cu 99.9% Customize
Copper Gallium (Cu/Ga) Sputtering Target ST-Cu/Ga-4N-Cu 99.99% Customize
Copper Gallium (Cu/Ga) Sputtering Target ST-Cu/Ga-5N-Cu 99.999% Customize

Product Information

A copper gallium (Cu/Ga) sputtering target is a type of material used in the process of thin film deposition. The target is typically made by melting and casting a mixture of copper and gallium into a circular disc, which is then mounted onto a sputtering gun in a vacuum chamber.

During the sputtering process, the target is bombarded with high-energy ions, which dislodge atoms and deposit them onto a substrate to form a thin film. The Cu/Ga sputtering target is used in the production of semiconductors, solar cells, and other electronic components.

The combination of copper and gallium ensures that the resulting thin films have excellent electrical conductivity, while also offering enhanced thermal stability and corrosion resistance. The precise ratio of copper to gallium can be adjusted to achieve specific characteristics, such as optical and electronic properties.

Cu/Ga sputtering targets are produced using various manufacturing techniques, including powder metallurgy, hot isostatic pressing, and casting. The choice of manufacturing method depends on the target specifications and desired properties.

Overall, Cu/Ga sputtering targets are valuable materials in the semiconductor industry, supporting the development of advanced electronic devices and technologies.

Chemical Formula:Cu/Ga
CAS Number:  61869-53-2


Synonyms

Copper-gallium alloy sputtering target, GaCu, CuGa 95/5, 90/10 wt%


Copper Gallium (Cu/Ga) Sputtering Target Specification

Shape: Disc/Rectangular/Tube

Bonding: Unbonding/Bonding

Per your request or drawing

We can customized as required

Size:

Circular   Sputtering TargetsDiameter1.0”2.0”3.0”4.0”5.0”6.0”up to 21”
Rectangular   Sputtering TargetsWidth x Length5” x 12”5” x 15”5” x 20”5” x 22”6” x 20”
Thickness0.125”, 0.25”


Properties(Theoretical)

Compound FormulaCuGa
Molecular Weight133.269 g/mol
AppearanceTarget
Melting PointN/A
Boiling PointN/A
DensityN/A
Solubility in H2ON/A
Monoisotopic Mass131.855 g/mol




Sputtering Targets Requirements

General requirements such as size, flatness, purity, impurity content, density, N/O/C/S, grain size, and defect control. Special requirements include surface roughness, resistance value, grain size uniformity, composition and tissue uniformity, magnetic conductivity, ultra-high density, ultra-fine grains, etc.


Application of Copper Gallium (Cu/Ga)Sputtering Target

Copper Gallium (Cu/Ga) Sputtering Target is mainly used in the electronics and information industry, glass coating field, wear-resistant materials, high-temperature corrosion resistance, high-grade decorative goods, and other industries.


Packing of  Copper Gallium (Cu/Ga) Sputtering Target

Standard Packing:

Typical bulk packaging includes palletized plastic 5 gallon/25 kg. pails, fiber and steel drums to 1 ton super sacks in full container (FCL) or truck load (T/L) quantities. Research and sample quantities and hygroscopic, oxidizing or other air sensitive materials may be packaged under argon or vacuum. Solutions are packaged in polypropylene, plastic or glass jars up to palletized 440 gallon liquid totes Special package is available on request.

ATTs Copper Gallium (Cu/Ga) Sputtering Target is carefully handled to minimize damage during storage and transportation and to preserve the quality of our products in their original condition.


Chemical Identifiers

Linear FormulaCu-Ga
MDL NumberN/A
EC No.N/A
Pubchem CID78065764
IUPAC Namecopper; gallium
SMILES[Cu].[Ga]
InchI IdentifierInChI=1S/Cu.Ga
InchI KeyCDZGJSREWGPJMG-UHFFFAOYSA-N




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