Product Code : ST-Cu/In-5N-Cu
Copper indium (Cu/In) sputtering target is a material used in the production of thin films in electronic devices and photovoltaic cells. It is a composite material made up of copper (Cu) and indium (In). This mixture has excellent properties for use in sputtering processes of thin films.
The main application of Cu/In sputtering target is in the production of copper indium gallium selenide (CIGS) solar cells, which have high efficiency and stability. The sputtering process can produce high-quality, uniform thin films on substrates that are used in the manufacturing of CIGS solar cells. This process is crucial in achieving high-efficiency solar cells.
Cu/In sputtering targets are made using a powder metallurgy process. The powder is mixed thoroughly and then pressed into a compact, which is then sintered at high temperatures to form a dense, homogenous target. The target is then machined to the desired shape and size to fit the sputtering chamber.
Cu/In sputtering targets are available in various sizes and shapes, including circular, rectangular, and custom shapes, depending on the specific requirements of the application. The targets can also be supplied as either bonded or unbonded form, depending on the sputtering system used.
In summary, copper indium (Cu/In) sputtering targets are essential materials used in the production of high-efficiency solar cells. Their excellent properties make them suitable for sputtering processes of thin films in electronic devices and photovoltaic cells.
Please contact us if you need customized services. We will contact you with the price and availability in 24 hours.
| Product | Product Code | Purity | Size | Contact Us |
Product Information
Copper indium (Cu/In) sputtering target is a material used in the production of thin films in electronic devices and photovoltaic cells. It is a composite material made up of copper (Cu) and indium (In). This mixture has excellent properties for use in sputtering processes of thin films.
The main application of Cu/In sputtering target is in the production of copper indium gallium selenide (CIGS) solar cells, which have high efficiency and stability. The sputtering process can produce high-quality, uniform thin films on substrates that are used in the manufacturing of CIGS solar cells. This process is crucial in achieving high-efficiency solar cells.
Cu/In sputtering targets are made using a powder metallurgy process. The powder is mixed thoroughly and then pressed into a compact, which is then sintered at high temperatures to form a dense, homogenous target. The target is then machined to the desired shape and size to fit the sputtering chamber.
Cu/In sputtering targets are available in various sizes and shapes, including circular, rectangular, and custom shapes, depending on the specific requirements of the application. The targets can also be supplied as either bonded or unbonded form, depending on the sputtering system used.
In summary, copper indium (Cu/In) sputtering targets are essential materials used in the production of high-efficiency solar cells. Their excellent properties make them suitable for sputtering processes of thin films in electronic devices and photovoltaic cells.
Chemical Formula: Cu/In
CAS Number: 12053-87-1
Synonyms
CAS 12053-87-1, indium-copper intermetallic, In:Cu 90:10, Cu7In4 , Cu11In9, Cu16In9
Copper Indium (Cu/In) Sputtering Target Specification
Shape: Disc/Rectangular/Tube
Bonding: Unbonding/Bonding
Per your request or drawing
We can customized as required
Size：
| Circular Sputtering Targets | Diameter | 1.0”2.0”3.0”4.0”5.0”6.0”up to 21” |
| Rectangular Sputtering Targets | Width x Length | 5” x 12”5” x 15”5” x 20”5” x 22”6” x 20” |
| Thickness | 0.125”, 0.25” | |
Properties（Theoretical）
| Compound Formula | CuIn |
| Molecular Weight | 178.364 |
| Appearance | Gray metallic target |
| Melting Point | 540-640 °C |
| Boiling Point | N/A |
| Density | N/A |
| Solubility in H2O | Insoluble |
| Exact Mass | 177.833 g/mol |
| Monoisotopic Mass | 177.833 g/mol |
Sputtering Targets Requirements
General requirements such as size, flatness, purity, impurity content, density, N/O/C/S, grain size, and defect control. Special requirements include surface roughness, resistance value, grain size uniformity, composition and tissue uniformity, magnetic conductivity, ultra-high density, ultra-fine grains, etc.
Application of Copper Indium (Cu/In) Sputtering Target
Copper Indium (Cu/In) Sputtering Target is mainly used in the electronics and information industry, glass coating field, wear-resistant materials, high-temperature corrosion resistance, high-grade decorative goods, and other industries.
Packing of Copper Indium (Cu/In) Sputtering Target
Standard Packing:
Typical bulk packaging includes palletized plastic 5 gallon/25 kg. pails, fiber and steel drums to 1 ton super sacks in full container (FCL) or truck load (T/L) quantities. Research and sample quantities and hygroscopic, oxidizing or other air sensitive materials may be packaged under argon or vacuum. Solutions are packaged in polypropylene, plastic or glass jars up to palletized 440 gallon liquid totes Special package is available on request.
ATTs’Copper Indium (Cu/In) Sputtering Target is carefully handled to minimize damage during storage and transportation and to preserve the quality of our products in their original condition.
Chemical Identifiers
| Linear Formula | Cu-In |
| MDL Number | N/A |
| EC No. | N/A |
| Pubchem CID | 14454333 |
| IUPAC Name | copper; indium |
| SMILES | [Cu].[In] |
| InchI Identifier | InChI=1S/Cu.In |
| InchI Key | HVMJUDPAXRRVQO-UHFFFAOYSA-N |
