Copper Nickel (Cu/Ni) Sputtering Target

Product Information

Copper nickel (Cu/Ni) sputtering target is a material used in the production of thin films in various electronic and industrial applications. It's a composite material made up of copper (Cu) and nickel (Ni). The combination of these two metals provides excellent physical and chemical properties for use in sputtering processes of thin films.

One of the primary applications of Cu/Ni sputtering targets is in the production of magnetic thin films. The sputtering process produces uniform and high-quality thin films on substrates used in manufacturing magnetic storage media such as hard disk drives. The targets can also be used in the production of high-performance conductive thin films for use in various electronics applications.

Cu/Ni sputtering targets are produced using powder metallurgy techniques. The powders of copper and nickel are blended in the desired ratio and then compressed into a compact form using high pressure. The compact is then sintered in a furnace under high temperature and vacuum conditions to form a dense, homogenous target material. The target is then machined to the required shape and size to fit the sputtering chamber.

Cu/Ni sputtering targets are available in various shapes and sizes, including circular, rectangular, and custom shapes, depending on the specific requirements of the application. Additionally, the targets can be supplied in either bonded or unbonded form, depending on the sputtering system used.

In conclusion, copper nickel (Cu/Ni) sputtering targets are essential materials used in the production of thin films in various electronic and industrial applications. Their excellent physical and chemical properties make them suitable for sputtering processes to produce magnetic and conductive thin films.

Chemical Formula:Cu/Ni

CAS Number: 12357-13-0

Synonyms

Cupro Nickel alloy, Cupronickel, Cu-Ni, Nickel-Copper, 70-30 Copper-Nickel Alloy, Resistance Alloy, Constantan, Hecnum, Telconstan, Eureka, Advance, Ferry, Copper, compd. with nickel (1:1)

Copper Nickel (Cu/Ni) Sputtering Target Specification

Shape: Disc/Rectangular/Tube

Bonding: Unbonding/Bonding

Per your request or drawing

We can customized as required

Size：

Properties（Theoretical）

Sputtering Targets Requirements

General requirements such as size, flatness, purity, impurity content, density, N/O/C/S, grain size, and defect control. Special requirements include surface roughness, resistance value, grain size uniformity, composition and tissue uniformity, magnetic conductivity, ultra-high density, ultra-fine grains, etc.

Application of Copper Nickel (Cu/Ni) Sputtering Target

Copper Nickel (Cu/Ni) Sputtering Target is mainly used in the electronics and information industry, glass coating field, wear-resistant materials, high-temperature corrosion resistance, high-grade decorative goods, and other industries.

Packing of  Copper Nickel (Cu/Ni) Sputtering Target

Standard Packing:

Typical bulk packaging includes palletized plastic 5 gallon/25 kg. pails, fiber and steel drums to 1 ton super sacks in full container (FCL) or truck load (T/L) quantities. Research and sample quantities and hygroscopic, oxidizing or other air sensitive materials may be packaged under argon or vacuum. Solutions are packaged in polypropylene, plastic or glass jars up to palletized 440 gallon liquid totes Special package is available on request.

ATTs’Copper Nickel (Cu/Ni) Sputtering Target is carefully handled to minimize damage during storage and transportation and to preserve the quality of our products in their original condition.

Chemical Identifiers