Copper Oxide (CuO) Sputtering Target

Product Information

Copper Oxide (CuO) sputtering targets are an essential component used in the thin film deposition process. They are made with high purity copper oxide material and are available in different shapes and sizes. The CuO sputtering targets are commonly used in the semiconductor industry for the fabrication of various electronic devices such as transistors, solar cells, integrated circuits, and many more.

The sputtering process involves bombarding the CuO target with high-energy ions, which knock off the atoms present at the surface of the target. These atoms then travel to the substrate, where they condense and form a thin film layer. The sputtering process is highly useful due to its ability to produce a uniform, high-quality thin film with excellent adhesion to the substrate.

CuO sputtering targets are available in different shapes such as circular, rectangular, and custom-designed shapes. They are also available in various sizes and thicknesses to suit the specific needs of different applications. The high purity of CuO sputtering targets ensures that the thin films deposited have excellent mechanical, electrical, and thermal properties.

The CuO sputtering targets are compatible with various sputtering systems, including DC, RF, and magnetron sputtering. They are also easy to install and have a long working life, which makes them highly economical and cost-effective. In summary, the CuO sputtering targets are an essential component that plays a crucial role in the fabrication of various electronic devices used in modern-day technology.

Chemical Formula:CuO

CAS Number: 1317-38-0

Synonyms

Copper(2+) oxide, Copper monooxide, Cupric oxide, Copporal, Oxocopper, Copper Brown, Black copper oxide, Paramelaconite Cuprous oxide, Copacaps, Boliden Salt K-33, Copper oxygen(2-), Ketocopper

Copper Oxide (CuO) Sputtering Target Specification

Shape: Disc/Rectangular/Tube

Bonding: Unbonding/Bonding

Per your request or drawing

We can customized as required

Size：

Properties（Theoretical）

Sputtering Targets Requirements

General requirements such as size, flatness, purity, impurity content, density, N/O/C/S, grain size, and defect control. Special requirements include surface roughness, resistance value, grain size uniformity, composition and tissue uniformity, magnetic conductivity, ultra-high density, ultra-fine grains, etc.

Application of Copper Oxide (CuO) Sputtering Target

Copper Oxide (CuO) Sputtering Target is mainly used in the electronics and information industry, glass coating field, wear-resistant materials, high-temperature corrosion resistance, high-grade decorative goods, and other industries.

Packing of Copper Oxide (CuO) Sputtering Target

Standard Packing:

Typical bulk packaging includes palletized plastic 5 gallon/25 kg. pails, fiber and steel drums to 1 ton super sacks in full container (FCL) or truck load (T/L) quantities. Research and sample quantities and hygroscopic, oxidizing or other air sensitive materials may be packaged under argon or vacuum. Solutions are packaged in polypropylene, plastic or glass jars up to palletized 440 gallon liquid totes Special package is available on request.

ATTs’Copper Oxide (CuO) Sputtering Target is carefully handled to minimize damage during storage and transportation and to preserve the quality of our products in their original condition.

Chemical Identifiers